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    SEMICONDUCTOR LIGHT-EMITTING DEVICE
    3.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE 审中-公开

    公开(公告)号：US20180366621A1

    公开(公告)日：2018-12-20

    申请号：US16109047

    申请日：2018-08-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Mi Jeong YUN ,  Jong Sup SONG

    IPC: H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60

    CPC classification number: H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/73253

    Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.

    SEMICONDUCTOR LIGHT-EMITTING DEVICE
    5.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权

    公开(公告)号：US20210217933A1

    公开(公告)日：2021-07-15

    申请号：US17214992

    申请日：2021-03-29

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Mi Jeong YUN ,  Jong Sup SONG

    IPC: H01L33/50 ,  H01L33/56 ,  H01L33/54

    Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.

    OPTICAL DEVICE AND LIGHT SOURCE MODULE INCLUDING THE SAME
    6.
    发明申请
    OPTICAL DEVICE AND LIGHT SOURCE MODULE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20190155009A1

    公开(公告)日：2019-05-23

    申请号：US16021729

    申请日：2018-06-28

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sang Woo HA ,  Tetsuo ARIYOSHI ,  Kyung Mi MOON ,  Jong Sup SONG ,  Jong Pil WON

    IPC: G02B19/00 ,  F21V5/04 ,  F21V7/00 ,  F21V13/04

    Abstract: An optical device is provided. The optical device includes a first surface that defines a concave light incident surface facing a central axis and a light source; a second surface disposed opposite the first surface which is configured to reflect light incident on the concave light incident surface; and an inclined light exit surface between the first surface and the second surface. The second surface includes a concave first reflective portion curving toward the first surface, and a substantially flat second reflective portion which portion is interposed between a first reflective portion edge of the first reflective portion and an outer second surface edge of the second surface. The first reflective portion is configured to totally reflect light incident at a predetermined angle or more with respect to a top surface of the light source once to the light exit surface.

    SEMICONDUCTOR PACKAGE SEPARATING DEVICE
    7.
    发明申请
    SEMICONDUCTOR PACKAGE SEPARATING DEVICE 审中-公开

    公开(公告)号：US20190131488A1

    公开(公告)日：2019-05-02

    申请号：US15980267

    申请日：2018-05-15

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jong Ho LIM ,  Jong Sup SONG ,  Houn JOUNG

    IPC: H01L33/00 ,  H01L33/62

    Abstract: A semiconductor package separating device is provided. The semiconductor package separating device includes a die configured to support a lead frame array including a fixing portion inserted into an insertion groove formed on at least a side surface of a semiconductor package to support the semiconductor package; and a cylindrical punch configured to rotate in a rotational direction, the cylindrical punch including a bending protrusion and a package separating protrusion that are provided on an outer circumferential surface of the cylindrical punch, the bending protrusion being configured to apply pressure to the fixing portion to bend the fixing portion, and the package separating protrusion being configured to apply pressure to the semiconductor package to separate the semiconductor package from the lead frame array in a state in which the fixing portion has been bent by the bending protrusion.

    OPTICAL DEVICE AND LIGHT EMITTING DEVICE PACKAGE INCLUDING THE SAME
    8.
    发明申请
    OPTICAL DEVICE AND LIGHT EMITTING DEVICE PACKAGE INCLUDING THE SAME 有权
    光学装置和发光装置包括它们

    公开(公告)号：US20160380169A1

    公开(公告)日：2016-12-29

    申请号：US15058645

    申请日：2016-03-02

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Ji Hoon YUN ,  Jong Sup SONG ,  Soo Hwan LEE ,  Saesil KIM ,  Mi Jeong YUN

    IPC: H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00 ,  H01L33/06 ,  H01L33/32 ,  H01L33/24 ,  F21V3/02 ,  H01L33/50

    CPC classification number: H01L33/58 ,  F21V3/02 ,  H01L33/24 ,  H01L33/382 ,  H01L33/505 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2933/0058

    Abstract: An optical device may include a first surface having a shape of a quadrangle; and a second surface disposed to be opposite to the first surface and comprising a convex curved surface. The optical device has an aspherical shape in a cross-section taken along a diagonal direction of the quadrangle and has a semicircular shape in a cross-section taken along a direction connecting a central portion of a first side of the quadrangle and a central portion of a second side opposite to the first side of the quadrangle. In a cross-sectional view of the optical device, the second surface is continuously varied between the semicircular shape of the cross-section and the aspherical shape of the cross-section.

    Abstract translation: 光学装置可以包括具有四边形形状的第一表面; 以及设置成与第一表面相对并包括凸曲面的第二表面。 所述光学元件沿着所述四边形的对角方向具有非球面形状，并且沿着连接所述四边形的第一侧的中心部分的方向截取的横截面为半圆形， 第二侧与四边形的第一侧相对。 在光学装置的横截面图中，第二表面在横截面的半圆形状和横截面的非球面形状之间连续变化。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE
    9.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE 审中-公开
    半导体发光器件

    公开(公告)号：US20160240746A1

    公开(公告)日：2016-08-18

    申请号：US14985784

    申请日：2015-12-31

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Mi Jeong YUN ,  Jong Sup SONG

    IPC: H01L33/50 ,  H01L33/58 ,  H01L33/10 ,  H01L33/48 ,  H01L33/56

    CPC classification number: H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/73253

    Abstract: A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.

    Abstract translation: 一种半导体发光器件，包括：封装基板，其具有设置有第一电路图案和第二电路图案的安装面; 安装在所述安装面上的半导体LED芯片，具有面向所述安装面的第一面，配置有第一电极和第二电极的第一表面，与所述第一表面相对的第二表面，以及位于所述第一表面和所述第二表面之间的侧表面 第二表面，第一电极和第二电极分别连接到第一电路图案和第二电路图案; 设置在所述第二表面上的波长转换膜; 以及设置在半导体LED芯片的侧表面上的提供倾斜表面的侧表面倾斜部分，并且包括含有波长转换材料的透光树脂。

    METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE
    10.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE 审中-公开
    制造半导体发光器件封装的方法

    公开(公告)号：US20160172533A1

    公开(公告)日：2016-06-16

    申请号：US14963269

    申请日：2015-12-09

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jong Sup SONG

    IPC: H01L33/00

    CPC classification number: H01L33/0095 ,  H01L2933/0041

    Abstract: There is provided a method for manufacturing a semiconductor light emitting device package including steps of disposing a plurality of light emitting structures on a support substrate, each light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, shaping a mixture containing a wavelength conversion material and a glass composition on the plurality of light emitting structures, sintering the mixture to form a wavelength conversion part, removing the support substrate, and cutting the plurality of light emitting structures into individual device units.

    Abstract translation: 提供了一种制造半导体发光器件封装的方法，包括在支撑衬底上设置多个发光结构的步骤，每个发光结构包括第一导电类型半导体层，有源层和第二导电型半导体层， 在所述多个发光结构上形成含有波长转换材料和玻璃组合物的混合物，烧结所述混合物以形成波长转换部分，去除所述支撑基板，以及将所述多个发光结构切割成单独的器件 单位。

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