公开(公告)号：US11646203B2

公开(公告)日：2023-05-09

申请号：US16925532

申请日：2020-07-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junyeong Lee ,  Minkyu Park ,  Insun Yi ,  Beomseok Kim ,  Youngseok Kim ,  Kuntack Lee

IPC: H01L21/02 ,  H01L29/66 ,  H01L27/108 ,  H01L27/115 ,  H01J37/32 ,  C23C16/511 ,  C23C16/46 ,  C23C16/40

CPC classification number: H01L21/0262 ,  C23C16/401 ,  C23C16/46 ,  C23C16/511 ,  H01J37/3244 ,  H01J37/32192 ,  H01J37/32724 ,  H01L21/02488 ,  H01L21/02532 ,  H01L27/10888 ,  H01L27/115 ,  H01L29/6681 ,  H01J2237/332 ,  H01L21/02592 ,  H01L21/02595 ,  H01L21/02598

Abstract: A thin film formation apparatus includes a chamber, a platen disposed within the chamber, a heater configured to heat the platen within the chamber, a gas inlet communicating with an interior of the chamber and configured to supply a reducing gas and inert gas to the interior of the chamber, a target disposed within the chamber and spatially separated from the platen, and a microwave plasma source disposed adjacent to the target. The reducing gas includes at least one of hydrogen (H2) and deuterium (D2).

公开(公告)号：US10607832B2

公开(公告)日：2020-03-31

申请号：US16164953

申请日：2018-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyeong Lee ,  Soonwook Jung ,  Bongjin Kuh ,  Pyung Moon ,  Sukjin Chung

IPC: H01L21/00 ,  H01L21/02 ,  H01L21/3205 ,  H01L21/3105 ,  H01L21/306

Abstract: Disclosed are method and apparatus for forming a thin layer. The method for forming the thin layer comprises providing a substrate including patterns, forming a bonding layer on the substrate covering an inner surface of a gap between the patterns, forming a preliminary layer on the bonding layer filling the gap; and thermally treating the preliminary layer to form the thin layer. The bonding layer is a self-assembled monomer layer formed using an organosilane monomer. The preliminary layer is formed from a flowable composition comprising polysilane.

公开(公告)号：US20190221424A1

公开(公告)日：2019-07-18

申请号：US16164953

申请日：2018-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyeong Lee ,  SOONWOOK JUNG ,  BONGJIN KUH ,  PYUNG MOON ,  SUKJIN CHUNG

IPC: H01L21/02

CPC classification number: H01L21/02118 ,  H01L21/02211 ,  H01L21/02274 ,  H01L21/02282

Abstract: Disclosed are method and apparatus for forming a thin layer. The method for forming the thin layer comprises providing a substrate including patterns, forming a bonding layer on the substrate covering an inner surface of a gap between the patterns, forming a preliminary layer on the bonding layer filling the gap; and thermally treating the preliminary layer to form the thin layer. The bonding layer is a self-assembled monomer layer formed using an organosilane monomer. The preliminary layer is formed from a flowable composition comprising polysilane.