公开(公告)号：US20040259291A1

公开(公告)日：2004-12-23

申请号：US10602373

申请日：2003-06-23

申请人： SanDisk Corporation

发明人： Hem P. Takiar

IPC分类号： H01L021/48 ,  H01L021/44 ,  H01L021/50

CPC分类号： H01L21/6835 ,  G06K19/077 ,  G06K19/07718 ,  G06K19/07732 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention is that the integrated circuit products are produced a batch at a time, and that singulation of the batch into individualized integrated circuit products uses a non-linear (e.g., non-rectangular or curvilinear) sawing or cutting action so that the resulting individualized integrated circuit packages no longer need to be completely rectangular. Another aspect of the invention is that the integrated circuit products can be produced with semiconductor assembly processing such that the need to provide an external package or container becomes optional.

摘要翻译： 公开了用于生产集成电路产品的改进的技术。 改进的技术允许集成电路产品的生产更小且成本更低。 本发明的一个方面是集成电路产品一次批量生产，并且将批次分成单独的集成电路产品使用非线性（例如，非矩形或曲线）锯切或切割动作，使得 所产生的个体化集成电路封装不再需要完全矩形。 本发明的另一方面是集成电路产品可以用半导体组装处理制造，使得需要提供外部封装或容器成为可选的。

公开(公告)号：US20040251523A1

公开(公告)日：2004-12-16

申请号：US10463051

申请日：2003-06-16

申请人： SanDisk Corporation

发明人： Hem P. Takiar

IPC分类号： H01L023/495

CPC分类号： H05K3/3426 ,  H01L23/3128 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10931 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： Improved apparatus and methods for stacking integrated circuit packages having leads are disclosed. According to one embodiment, the leads of an integrated circuit package are exposed and provided with solder balls so that corresponding leads of another integrated circuit package being stacked thereon can be electrically connected. The stacking results in increased integrated circuit density with respect to a substrate, yet the stacked integrated circuit packages are able to still enjoy having an overall thin or low profile.

摘要翻译： 公开了用于堆叠具有引线的集成电路封装的改进的装置和方法。 根据一个实施例，集成电路封装的引线被暴露并设置有焊球，使得堆叠在其上的另一个集成电路封装的相应引线可以电连接。 堆叠导致相对于衬底的集成电路密度增加，但是堆叠的集成电路封装仍然可以享受整体薄或薄的轮廓。