Grouping memory cells into sub-blocks for program speed uniformity

    公开(公告)号:US10431313B2

    公开(公告)日:2019-10-01

    申请号:US15923064

    申请日:2018-03-16

    摘要: A three-dimensional stacked memory device is configured to provide uniform programming speeds of different sets of memory strings formed in memory holes. In a process for removing sacrificial material from word line layers, a block oxide layer in the memory holes is etched away relatively more when the memory hole is relatively closer to an edge of the word line layers where an etchant is introduced. A thinner block oxide layer is associated with a faster programming speed. To compensate, memory strings at the edges of the word line layers are programmed together, separate from the programming of interior memory strings. A program operation can use a higher initial program voltage for programming the interior memory strings compared to the edge memory strings.

    Multi-state programming in memory device with loop-dependent bit line voltage during verify

    公开(公告)号:US10854300B2

    公开(公告)日:2020-12-01

    申请号:US16898145

    申请日:2020-06-10

    摘要: Techniques are described for programming memory cells with reduced widening of the threshold voltage distributions. Bit line voltages are adjusted during verify tests for memory cells assigned to the upper data state in a pair of adjacent data states which are concurrently verified. An elevated bit line voltage is applied and then stepped up in successive program loops. A lower, fixed bit line voltage is used for verifying the lower data state in the pair of adjacent data states. In one option, the step size increases progressively over the program loops. In another option, the minimum level of the elevated bit line voltage is lower for higher data states. In another option, the minimum level of the elevated bit line voltage is set as a function of data states, program-erase cycles and/or temperature.

    Suppressing program disturb during program recovery in memory device

    公开(公告)号:US10762973B1

    公开(公告)日:2020-09-01

    申请号:US16408975

    申请日:2019-05-10

    摘要: Program disturb is suppressed during a program recovery phase of a program operation in a memory device. The duration of the recovery phase can be increased when the risk of program disturb is greater due to factors such as temperature, the position of the selected word line, the number of program-erase cycles and the program pulse magnitude. In other approaches, the risk of program disturb is reduced by providing an early ramp down of the voltages of the drain-side word line relative to a ramp down of the voltages of the source-side word lines, providing an early ramp down of the bit line voltage of the inhibited NAND strings relative to the ramp down of the select gate voltage or setting a lower recovery voltage for the source-side word lines relative to the recovery voltage of the drain-side word lines.

    ADJUSTING VOLTAGE ON ADJACENT WORD LINE DURING VERIFY OF MEMORY CELLS ON SELECTED WORD LINE IN MULTI-PASS PROGRAMMING

    公开(公告)号:US20190311772A1

    公开(公告)日:2019-10-10

    申请号:US15948761

    申请日:2018-04-09

    摘要: Apparatuses and techniques are described for programming memory cells with a narrow threshold voltage (Vth) distribution in a memory device. In one approach, the final pass of a multi-pass program operation on a word line WLn includes applying a variable voltage to WLn+1 during verify tests on WLn. The variable voltage (Vread) can be an increasing function of the verify voltage on WLn, and thus a function of the data state for which the verify test is performed. In one approach, Vread on WLn+1 is stepped up with each increase in the verify voltage on WLn. The step size in Vread can be the same as, or different than, the step size in the verify voltage. Vread can be different for each different verify voltage, or multiple verify voltages can be grouped for use with a common Vread.