摘要:
Methods and apparatus for output of high-bandwidth debug data/traces in electronic devices using embedded high-speed debug port(s). Debug data is received from multiple blocks and buffered in a buffer. The buffer's output is operatively coupled to one or more high-speed serial I/O interfaces via muxing logic during debug test operations. The buffered data is encoded as serialized data and sent over the one or more high-speed serial I/O interfaces to a logic device that receives serialized data and de-serializes it to generate parallel debug data that is provided to a debugger. The buffer may be configured as a bandwidth-adapting buffer that facilitates transfer of debug data that is received at a variable combined data rate outbound via the one or more high-speed serial I/O interfaces at a data rate corresponding to the bandwidth of the serial I/O interfaces.
摘要:
Methods and apparatus for output of high-bandwidth debug data/traces in electronic devices using embedded high-speed debug port(s). Debug data is received from multiple blocks and buffered in a buffer. The buffer's output is operatively coupled to one or more high-speed serial I/O interfaces via muxing logic during debug test operations. The buffered data is encoded as serialized data and sent over the one or more high-speed serial I/O interfaces to a logic device that receives serialized data and de-serializes it to generate parallel debug data that is provided to a debugger. The buffer may be configured as a bandwidth-adapting buffer that facilitates transfer of debug data that is received at a variable combined data rate outbound via the one or more high-speed serial I/O interfaces at a data rate corresponding to the bandwidth of the serial I/O interfaces.
摘要:
A system and method for a common unified debug architecture for integrated circuits and System on Chips (SoCs) are provided. A system consistent with the present disclosure may comprise of an integrated circuit or SoC which includes a display port, plurality of logic blocks, and debug logic. The debug logic may receive debug data from one or more of the plurality of logic blocks in response to the integrated circuit or SoC operating in a debug mode. In addition, control logic coupled to the debug logic. The control logic provides display data to the display port in response to the integrated circuit operating in an operational mode. The control logic further directs high-speed debug data to the display port in response to the integrated circuit or SoC operating in the debug mode. The high-speed debug data is to be based on the debug data.
摘要:
Observability of internal system-on-chip signals is a difficult problem and it is particularly difficult to observe and debug transactions with different clock domains. However, one embodiment provides observability of internal signals from multiple internal blocks having varying clock domains such as synchronous (common clock) and asynchronous (non common clock) domains. An embodiment provides simultaneous observability of debug data from both synchronous and asynchronous clock domains. An embodiment may also allow sending debug data from both synchronous and asynchronous domains from the SoC. One embodiment outputs internal signals on output pins of the SoC, thereby allowing transactions from one clock domain to be tracked to another clock domain and allowing for the determination of the relationship between the data of differing clock domains. Other embodiments are described herein.
摘要:
Embodiments are generally directed no-touch stress testing of memory input/output (I/O) interfaces. An embodiment of a memory device includes a system element to be coupled with a dynamic random-access memory (DRAM), the system element including a memory interface for connection with the DRAM, the interface including a driver and a receiver, a memory controller for control of the DRAM, and a timing stress testing logic for testing of the I/O interface.
摘要:
Methods and apparatus for testing Input/Output (I/O) boundary scan chains for Systems on a Chip (SoCs) having I/Os that are powered off by default. Some methods and apparatus include implementation of boundary scan chain bypass routing schemes that selectively route a boundary scan chain path around I/O interfaces and/or ports that are powered off by default. Other techniques include selectively power-on I/Os that are powered off by default in a manner that is independent of SoC facilities for controlling the power state of the I/Os during SoC runtime operations. Various schemes facilitate boundary scan testing in accordance with IEEE Std.-1149.1 methodology.
摘要:
The inputs to an embedded core, e.g., the core terminals, may not be directly connected to pins on the SoC. The lack of direct access to an embedded core's terminals may complicate testing of the embedded core. A test wrapper including boundary scan test (BST) cells may be used to test an embedded core. Dual function BST/ATPG (Automatic Test Pattern Generation) cells may be used to perform both BST and ATPG tests on embedded cores.
摘要:
Methods and apparatus for testing Input/Output (I/O) boundary scan chains for Systems on a Chip (SoCs) having I/Os that are powered off by default. Some methods and apparatus include implementation of boundary scan chain bypass routing schemes that selectively route a boundary scan chain path around I/O interfaces and/or ports that are powered off by default. Other techniques include selectively power-on I/Os that are powered off by default in a manner that is independent of SoC facilities for controlling the power state of the I/Os during SoC runtime operations. Various schemes facilitate boundary scan testing in accordance with IEEE Std.-1149.1 methodology.
摘要:
Testing memory devices. An apparatus may include a test module operative to perform a test on a plurality of pipelined memory elements and a fail trace module operative to interrupt the test in response to identifying a failure of a memory element and to store an address of said memory element in a storage unit.
摘要:
An integrated circuit (IC) device configured for multiple return material authorizations (RMAs) is provided. The IC device includes an asset and a return material authorization (RMA) counter fuse including a first fuse, a second fuse, and a third fuse. The IC device enters an RMA state in response to blowing the first fuse, a second state in response to blowing the second fuse, and the RMA state in response to blowing the third fuse.