METHODS AND APPARATUSES FOR CLEANING ELECTROPLATING SUBSTRATE HOLDERS
    1.
    发明申请
    METHODS AND APPARATUSES FOR CLEANING ELECTROPLATING SUBSTRATE HOLDERS 审中-公开
    清洗电镀基板支架的方法和装置

    公开(公告)号:US20130292254A1

    公开(公告)日:2013-11-07

    申请号:US13852767

    申请日:2013-03-28

    IPC分类号: C25D17/00

    摘要: Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle.

    摘要翻译: 本文公开了通过去除在现有电镀操作中积累的金属沉积物来清洁电镀装置的唇密封和/或杯底的方法。 所述方法可以包括使喷嘴定向成使得其基本上指向唇密封件和/或杯底部的内圆形边缘,并且从喷嘴分配清洁溶液流,使得流接触唇塞的内圆形边缘,并且 /或杯底,同时旋转,去除金属沉积物。 在一些实施例中,流具有抵抗唇密封和/或杯底的旋转方向的速度分量。 在一些实施例中,沉积物可以包括锡/银合金。 本文还公开了用于安装在电镀装置中并用于从其密封件和/或杯底部去除电镀金属沉积物的清洁装置。 在一些实施例中,清洁设备可以包括喷嘴。

    CLEANING ELECTROPLATING SUBSTRATE HOLDERS USING REVERSE CURRENT DEPLATING
    2.
    发明申请
    CLEANING ELECTROPLATING SUBSTRATE HOLDERS USING REVERSE CURRENT DEPLATING 有权
    使用反向电流去除清洁电镀基板支架

    公开(公告)号:US20130256146A1

    公开(公告)日:2013-10-03

    申请号:US13853935

    申请日:2013-03-29

    IPC分类号: C25F1/00

    摘要: Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. The front surface of the cleaning disk includes a corrosion resistant conductive material to form electrical connections to deposits on the cup's surfaces. The disk is sealed in the cup and submerged into a plating solution. A reverse current is then applied to the front conductive surface of the disk to initiate deplating of the deposits. Sealing compression in the cup may change during cleaning to cause different deformation of the lip seal and to form new electrical connections to the deposits. The proposed cleaning may be applied to remove deposits formed during electroplating of alloys, in particular, tin-silver alloys widely used for semiconductor and wafer level packaging.

    摘要翻译: 提供了使用反向电流去除技术从电镀设备中除去非预期的金属沉积物的清洁方法和系统。 这样的清洁包括将清洁(脱落)盘定位在类似于经常处理的基底的电镀杯中。 清洁盘的前表面包括耐腐蚀的导电材料以形成电连接以沉积在杯的表面上。 将盘密封在杯中并浸没在电镀液中。 然后将反向电流施加到盘的前导电表面以开始沉积物的脱落。 杯子内的密封压缩可能在清洁过程中发生变化,导致唇形密封件发生不同的变形,并形成与沉积物的新的电气连接。 所提出的清洁可以用于去除在电镀期间形成的沉积物,特别是广泛用于半导体和晶片级封装的锡 - 银合金。

    System and Method for Modular Exponentiation
    3.
    发明申请
    System and Method for Modular Exponentiation 审中-公开
    模块化指数的系统和方法

    公开(公告)号:US20100088526A1

    公开(公告)日:2010-04-08

    申请号:US12359182

    申请日:2009-01-23

    IPC分类号: G06F12/14 H04L9/28

    摘要: To calculate the equation y=xe mod n, integral to solving cryptographic and authentication problems, much computing power is required despite elegant algorithms that greatly reduce the number of calculations required. Operations involved in computing this equation include shifting bits, comparing values, subtracting, and adding. This invention provides an improvement over prior calculation methods by pinpointing places where computing cycles can be eliminated.

    摘要翻译: 为了计算方程y = xe mod n,解决加密和认证问题的积分,尽管优雅的算法大大减少了所需的计算数量,但需要很多的计算能力。 计算该方程的操作包括移位,比较值,减法和加法。 本发明通过精确定位可以消除计算周期的位置来提供比先前计算方法的改进。

    Method and Apparatus of Providing the Security and Error Correction Capability for Memory Storage Devices
    4.
    发明申请
    Method and Apparatus of Providing the Security and Error Correction Capability for Memory Storage Devices 审中-公开
    为存储器件提供安全和纠错能力的方法和装置

    公开(公告)号:US20090125726A1

    公开(公告)日:2009-05-14

    申请号:US11949652

    申请日:2007-12-03

    IPC分类号: G06F12/14 G06F12/06 G11C29/52

    摘要: A method and apparatus of configuring the byte structure of a memory storage device, including a flash memory device, to enhance the security and error correction capability is described. In one embodiment, the method includes increasing the security of data stored in the storage device by encrypting data with a unique initialization vector and storing the initialization vector in the storage device. The method also includes using a unique initialization vector for encrypting data, to be stored in each datablock, each time data are encrypted. In one embodiment, the apparatus includes an AES controller that includes encryption and decryption modules to encrypt and decrypt data prior to writing data to or reading from the storage device. The apparatus also includes an encoder module and decoder circuits to encode and decode data prior to writing or reading from memory storage devices. The apparatus optionally includes a state machine that generates and provides the initialization vector and also activates different components of AES controller and ECC module depending on the operation of the device.

    摘要翻译: 描述了一种配置包括闪存设备的存储器存储设备的字节结构以增强安全性和纠错能力的方法和装置。 在一个实施例中,该方法包括通过使用唯一的初始化向量加密数据来增加存储在存储设备中的数据的安全性,并将该初始化向量存储在存储设备中。 该方法还包括使用唯一的初始化向量来加密数据,每个数据块被加密存储在每个数据块中。 在一个实施例中,该装置包括AES控制器,其包括加密和解密模块以在将数据写入或从存储设备读取之前对数据进行加密和解密。 该装置还包括编码器模块和解码器电路,用于在从存储器存储装置写入或读取之前对数据进行编码和解码。 该装置可选地包括生成和提供初始化向量的状态机,并且还根据设备的操作激活AES控制器和ECC模块的不同组件。

    Cold plate cooling apparatus for a rack mounted electronic module
    6.
    发明申请
    Cold plate cooling apparatus for a rack mounted electronic module 有权
    用于机架式电子模块的冷板冷却装置

    公开(公告)号:US20070019384A1

    公开(公告)日:2007-01-25

    申请号:US11184153

    申请日:2005-07-19

    IPC分类号: H05K7/20

    摘要: Apparatus which is capable of providing efficient cooling of rack mounted electronic modules while accommodating relatively large tolerances in the mounting of the modules. A plurality of thermally conductive sliding wedge blocks are interposed between the lower surface of each module and the upper surface of the cold plate base of the rack. The mechanism for clamping a module to the rack also pulls the wedge blocks together to fill in the gap between the lower surface of the module and the upper surface of the cold plate so as to provide a complete thermal path therebetween.

    摘要翻译: 该设备能够提供有效冷却机架安装的电子模块,同时在模块的安装中容纳相对大的公差。 在每个模块的下表面和机架的冷板底座的上表面之间插入有多个导热滑动楔块。 将模块夹紧到机架上的机构还将楔块拉到一起以填充模块的下表面和冷板的上表面之间的间隙,以在其间提供完整的热路径。

    APPARATUS FOR AUTOMATICALLY TESTING AND TUNING RADIO FREQUENCY COIL
    8.
    发明申请
    APPARATUS FOR AUTOMATICALLY TESTING AND TUNING RADIO FREQUENCY COIL 有权
    用于自动测试和调谐无线电频率线圈的设备

    公开(公告)号:US20130113484A1

    公开(公告)日:2013-05-09

    申请号:US13290493

    申请日:2011-11-07

    IPC分类号: G01R33/44

    摘要: In one embodiment, an apparatus for automatically testing and tuning a RF coil is provided. The apparatus comprises a digital frequency generator for generating a stimulus, the stimulus comprising a range of radio frequency signals having different frequencies, a radio frequency coupler configured for applying the stimulus to the RF coil so as to enable the RF coil to generate a reflected signal in response to the stimulus applied, a radio frequency detector for detecting the reflected signal and a signal processing unit for processing the reflected signal, so as to identify the tuned resonant frequency of the RF coil and further configured for calculating return loss at the RF coil based on the reflected signal.

    摘要翻译: 在一个实施例中,提供了用于自动测试和调谐RF线圈的装置。 该装置包括用于产生刺激的数字频率发生器,所述刺激包括具有不同频率的射频信号的范围;射频耦合器,被配置为将激励施加到RF线圈,以使RF线圈能够产生反射信号 响应于所施加的刺激,用于检测反射信号的射频检测器和用于处理反射信号的信号处理单元,以便识别RF线圈的调谐谐振频率,并进一步被配置为计算RF线圈处的回波损耗 基于反射信号。

    Centralized management of applications and desktop preferences without requiring configuration of clientside operating systems
    9.
    发明授权
    Centralized management of applications and desktop preferences without requiring configuration of clientside operating systems 失效
    集中管理应用程序和桌面偏好,而不需要配置客户端操作系统

    公开(公告)号:US08433757B2

    公开(公告)日:2013-04-30

    申请号:US12143929

    申请日:2008-06-23

    摘要: A method, apparatus and system of centralized management of applications and desktop preferences without requiring configuration of client-side operating systems are disclosed. In one embodiment, a method of a rich client device includes accessing an application installed on a server, and executing the application from the rich client device without installing the application on the rich client device (e.g., that may mean that an operating system of the rich client device is not modified to perform the function calls between the application and the operating system) when requested by a user of the rich client device through a binary module (e.g., the binary module may include required resources between the application and the operating system including a file system data, a Dynamic-Link library (DLL) data, etc.) of the server that emulates a set of function calls between the application and an operating system of the rich client device.

    摘要翻译: 公开了一种集中管理应用程序和桌面偏好的方法,装置和系统,而不需要客户端操作系统的配置。 在一个实施例中,富客户端设备的方法包括访问安装在服务器上的应用,以及从富客户端设备执行应用,而不在富客户端设备上安装应用(例如,这可能意味着 当富客户端设备的用户通过二进制模块请求(例如,二进制模块可能包括应用程序和操作系统之间的所需资源)时,富客户端设备不会被修改为执行应用程序和操作系统之间的函数调用) 包括模拟应用程序和富客户端设备的操作系统之间的一组函数调用的服务器的文件系统数据,Dynamic-Link库(DLL)数据等)。

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    10.
    发明申请
    "L" Shaped Lead Integrated Circuit Package 有权
    “L”形引脚集成电路封装

    公开(公告)号:US20130020695A1

    公开(公告)日:2013-01-24

    申请号:US13187380

    申请日:2011-07-20

    IPC分类号: H01L23/50 H01L21/98

    摘要: Various aspects provide for bending a bending a lead frame of a semiconductor device package into a shape of an “L” and mounting the package on a substrate. A horizontal portion of the bent lead-frame is about parallel with a surface of the package. A vertical portion of the bent lead frame is configured to extend the horizontal portion beyond the surface of the package. A device may be mounted between the substrate and the package.

    摘要翻译: 各种方面提供了将半导体器件封装的引线框弯曲成L形并将封装安装在基板上的方面。 弯曲引线框架的水平部分大致平行于封装的表面。 弯曲引线框架的垂直部分构造成将水平部分延伸超过封装的表面。 装置可以安装在基板和封装之间。