摘要:
Image forming apparatus including a sheet finish-processing unit for finish-processing sheets discharged from a copying machine to which the unit is laterally positioned and stored thereby into a plurality of stacks. A sheet stack finish-processing mechanism of the unit, incorporating a stapler, is shiftable by an associated drive mechanism in the widthwise direction along the adjacent end of a positioned stack in storage. A sheet stack handling mechanism therein draws the end of the positioned stack into a finishing locale of the finish-processing mechanism, and subsequent to a finishing (stapling) operation, returns the finished sheet stack into storage. Thereupon, the stack is transversely discharged frontward of the image forming apparatus from storage, during which operation a subsequent finishing operation is concurrently executable; by such discharge a number of copy stacks greater than the number of stacking storages can be processed. The stacks are linearly inserted into and withdrawn from the finish-processing mechanism, eliminating the need for complex movements thereof, and allowing the finish-processing mechanism to be functional at a number of linear positions along the stack end margin. Furthermore, the sheet stacks are discharged to the apparatus front, wherein they are readily accessible for removal by an operator.
摘要:
A sheet stack handling apparatus discharges sheet stacks from a bin of a sorter disposed on the side of an image forming apparatus, and includes a sheet stocker, a sheet stack transporting route, and a sheet grasping mechanism. The stack handling or discharge apparatus is disposed on the front side of the sorter. The sheet stocker is disposed in the bottom of the discharging apparatus and stores the sheet stacks. The sheet stack transporting route is provided in the discharging apparatus and extends laterally from the side of the bin and downward to the sheet stacker. The sheet stack grasping mechanism is disposed under the sheet stack transporting route. The sheet stack grasping mechanism grasps a sheet stack in a bin of the sorter, then moves length-wise away from the image forming apparatus, and then moves width-wise to transfer the stack from the bin into the sheet stocker.
摘要:
A sorter for sorting sheets discharged from an image forming apparatus, comprising a sorter frame; a plurality of bins disposed in the vertical direction, for making stacks of the discharged sheets; a bin frame incorporating the bins and having an opening on a front side adapting the sorter for a stack-removal operation; a processing mechanism provided on the image-forming-apparatus side of the bins, for processing the stacks; a first driving mechanism for driving a bin at a bin-processing position opposite the processing mechanism to slide toward the processing mechanism for feeding the image-forming-apparatus side end of said stack to the processing mechanism; a single unit slide guide for guiding a bin at the bin processing position toward the processing mechanism; a second driving mechanism including a pair of rods disposed vertically on the front and back sides of the sorter frame, the rods move the bins and the bin frame vertically and support the bins from either side at a position inward from an image-forming-apparatus end of the bins, whereby the bins extend outward from the bin support position toward the image-forming-apparatus; and a tamping mechanism including a member for abutting with a side of the stacks to make neat stacks of sheets in the bins, the abutting member is provided on the front side of the sorter frame and beside the bin support position of the rod.
摘要:
A semiconductor device (1) includes an n type epitaxial layer (8), body regions (12) formed in the surface layer part of the n type epitaxial layer (8), n type source regions (16) formed in the surface layer parts of the body regions (12), a gate insulating film (19) formed on the n type epitaxial layer (8), and a gate protection diode (30) and gate electrodes (20) formed on the gate insulating film (19). The gate protection diode (30) includes a first p type region (31), an n type region (32), and a second p type region (33). A first diode (30A) is formed of the first p type region (31) and the n type region (32). A second diode (30B) is formed of the n type region (32) and the second p type region (33). The first p type region (31) is connected to the gate electrode (20). The second p type region (33) is connected to a source electrode (27).
摘要:
A sheet post-processing apparatus is provided that includes a first delivery path that guides a sheet to a first post-processing portion, a delivery holding path having a first holding path which branches off from a branch point of the first delivery path and a second holding path which is formed to be continuous with the first holding path and joins together with the first delivery path; a second delivery path that branches off from a branch point of the first holding path and guides the sheet to the second post-processing portion; a first path switching portion that is provided at the branch point of the first delivery path; and a second path switching portion that is provided at the branch point of the first holding path.
摘要:
A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
摘要:
A sheet feeding device includes a sheet accommodating portion for accommodating a sheet stack. A sheet carrying plate carries the sheet stack and has an upstream end supported in the sheet accommodating portion for rotation. A pickup roller contacts an upper face of the sheet stack and dispatches an uppermost sheet. An elevator displaces the sheet carrying plate between a feeding position where the upper face of the sheet stack contacts the pickup roller and a separating position where the upper face of the sheet stack is separated from the pickup roller. A first warm air mechanism blows warm air toward a side of the sheet stack in the sheet accommodating portion, the side being parallel to the sheet feeding direction. A controller controls the elevator so that the sheet carrying plate is displaced between the feeding position and the separating position during a warm air blowing operation.
摘要:
A semiconductor device according to the present invention includes: an insulating substrate; a metal bonding member being disposed on the insulating substrate and having a porous region and a metal region, the porous region being provided with multiple pores therein and being adjacent to the metal region in a plane direction of the insulating substrate; a solder material impregnated into the pores; a semiconductor element disposed on the surface of the porous region in the metal bonding member; a bonding wire connected to the surface of the metal region in the metal bonding member. This makes it possible to provide a semiconductor device having improved electrical conductivity and thermal conductivity, and enabling the weight reduction.
摘要:
The present invention comprises a shunting roller 41, and when recording media P, which is output from an image forming device main body 11, is stacked as a stack of recording media and staple processing is performed thereon, the shunting roller 41 rotates so as to receive subsequent recording media P in the wrapping direction thereof, while the first stack of recording media undergoes staple processing. The present invention also comprises a first branching pawl 44, for switching the direction of transport of recording media P between a transport path 42 and a processing unit 40, and a second branching pawl 47, for switching it between an output tray 45 and the shunting roller 41. Furthermore, a transport roller 53 for transporting the recording media P, is provided in the direction of transport between the first and second branching pawls 44 and 47, and cutaways 57 and 58 are formed in the first and second branching pawls 44 and 47 so as not to interfere with this transport roller 53, the transport roller 53 and the first and second branching pawls 44 and 47 being disposed so as to overlap when seen from the side.
摘要:
A semiconductor device (1) includes an n type epitaxial layer (8), body regions (12) formed in the surface layer part of the n type epitaxial layer (8), n type source regions (16) formed in the surface layer parts of the body regions (12), a gate insulating film (19) formed on the n type epitaxial layer (8), and a gate protection diode (30) and gate electrodes (20) formed on the gate insulating film (19). The gate protection diode (30) includes a first p type region (31), an n type region (32), and a second p type region (33). A first diode (30A) is formed of the first p type region (31) and the n type region (32). A second diode (30B) is formed of the n type region (32) and the second p type region (33). The first p type region (31) is connected to the gate electrode (20). The second p type region (33) is connected to a source electrode (27).