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1.发明授权Conductor composition and method of manufacturing a multilayered ceramic body using the composition 失效导体组合物和使用该组合物制造多层陶瓷体的方法
公开(公告)号：US4906405A
公开(公告)日：1990-03-06
申请号：US194967
申请日：1988-05-17
CPC分类号： H05K3/4611 , C03C3/072 , C03C8/14 , H01B1/08 , H05K1/092 , H05K3/4629 , H05K1/0306
摘要： Disclosed are a CuO conductor paste which is effective for making a multilayered ceramic body, the conductor material of which is made of copper, and a method of manufacturing a multilayered ceramic body using the conductor paste. The conductor paste is made of CuO as the main component with an addition of at least one of PbO-based glass, or any of Bi.sub.2 O.sub.3 -based glass, CuO-based glass and CuAl.sub.2 O.sub.4 as the additive. The multilayered ceramic body is manufactured by a method comprising a forming process for making a multilayered body from the conductor paste and dielectric material, a binder removing process by heat treating the multilayered body, thus obtained, in air, a reduction process for reducing CuO to copper in a mixed gas atmosphere of hydrogen and nitrogen, and a sintering process for sintering the multilayered body thus reduced in a nitrogen gas atmosphere.
摘要翻译： 公开了一种CuO导体糊，其制造多层陶瓷体，其导体材料由铜制成，以及使用该导体膏制造多层陶瓷体的方法。 导体糊以CuO为主要成分，添加PbO系玻璃，Bi2O3系玻璃，CuO系玻璃，CuAl 2 O 4等中的至少一种作为添加剂。 多层陶瓷体通过包括从导体糊和电介质材料制造多层体的成形方法的方法制造，通过在空气中热处理由此获得的多层体的粘合剂去除工艺，将CuO还原为 在氢气和氮气的混合气体气氛中的铜，以及在氮气气氛中烧结多层体的烧结方法。
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公开(公告)号：US5496619A
公开(公告)日：1996-03-05
申请号：US254414
申请日：1994-06-06
申请人： Minehiro Itagaki , Kazuyuki Okano , Suzushi Kimura , Seiichi Nakatani , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura
发明人： Minehiro Itagaki , Kazuyuki Okano , Suzushi Kimura , Seiichi Nakatani , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura
IPC分类号： H01L23/498 , B32B15/04 , B32B17/06 , H01B1/16 , H01L21/4763
CPC分类号： H01L23/49883 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , Y10T428/24917
摘要： Conductive paste for via connection of a multilayer ceramic substrate, comprising: an inorganic component which consists of 30.0 to 70.0% by weight of powder of conductive material and the remainder being one of glass powder having a softening point higher than a starting point of sintering of insulating material and crystalline glass ceramic powder having a glass transition point higher than the starting point of sintering of the insulating material; and an organics vehicle component which consists of at least organic binder and solvent.
摘要翻译： 用于多层陶瓷基板的通孔连接的导电浆料，其包含：无机成分，其由导电材料粉末的30.0〜70.0重量％组成，其余为软化点高于烧结起始点的玻璃粉末之一 绝缘材料和晶体玻璃陶瓷粉末，其玻璃化转变点高于绝缘材料的烧结起点; 以及由至少有机粘合剂和溶剂组成的有机物载体组分。
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公开(公告)号：US4695403A
公开(公告)日：1987-09-22
申请号：US875083
申请日：1986-06-17
CPC分类号： C04B41/88 , C04B41/5127 , H01B1/16 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/092
摘要： A thick film conductor composition for a ceramic wiring substrate comprises an inorganic ingredient mainly composed of a copper oxide powder added with a metal capable of forming a homogeneous solid solution with copper, and an organic vehicle. The inorganic ingredient may be further added with a manganese oxide or a heat resistant insulating material such as ceramics and/or glass.
摘要翻译： 用于陶瓷布线基板的厚膜导体组合物包括主要由添加有能够形成具有铜的均匀固溶体的金属的氧化铜粉末和有机载体的无机成分。 无机成分还可以添加氧化锰或耐热绝缘材料如陶瓷和/或玻璃。
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公开(公告)号：US5014158A
公开(公告)日：1991-05-07
申请号：US507568
申请日：1990-04-11
CPC分类号： C04B35/49 , H01G4/1245 , Y10T29/435
摘要： A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electrode layers are made of Ni. The dielectric layers are made of a dielectric ceramic composition having a structural formula of:{Bam(Til-xZrx)O2+m}1-.alpha.-.beta.-{MnO2}.alpha.-{X}.beta.where X is at least one of Yb2O3, Dy2O3, and ThO2 and m, x, .alpha., and .beta. are expressed as:0.98.ltoreq.m.ltoreq.1.020.ltoreq.x.ltoreq.0.20.005.ltoreq..alpha..ltoreq.0.050.001.ltoreq..beta..ltoreq.0.02so that the laminated ceramic capacitor can be minimized in the size, increased in the capacitance, and reduced in the cost of production.
摘要翻译： 层叠陶瓷电容器包括用于显影电容的多个内部电极层，夹在内部电极层的电介质层和耦合到其相关联的内部电极层的一对外部电极，用于输出电容。 内部电极层由Ni制成。 电介质层由结构式为：{Bam（Til-xZrx）O 2 + m} 1-α-β - {MnO 2}α - {X}β的电介质陶瓷组合物制成，其中X是Yb 2 O 3中的至少一种 ，Dy 2 O 3和ThO 2，m，x，α和β表示为：0.98
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公开(公告)号：US4795512A
公开(公告)日：1989-01-03
申请号：US18579
申请日：1987-02-25
CPC分类号： H05K3/4629 , B32B18/00 , C04B35/622 , C04B35/64 , H05K3/4611 , C04B2235/6567 , C04B2235/658 , C04B2237/343 , C04B2237/525 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/76 , H05K1/0306 , H05K1/092
摘要： A method of manufacturing a multilayer ceramic using Cu as the conductor material is disclosed. This method comprises a step of forming a multilayer laminate by the green tape multilayer laminating method or by the thick film printing method on ceramic substrate with an insulating material with a mixture of ceramic and glass containing lead oxide as its main component and a conductor paste with CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of causing reduction at temperatures where copper oxide is reduced, but lead oxide is not, in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of firing in a nitrogen atmosphere, thereby effecting sintering of the insulating material composed of ceramic and glass containing lead oxide and metallization of copper electrodes (firing process). For the uppermost layer electrodes, metal copper paste is employed, and a pattern printing process is conducted subsequent to the aforementioned reduction process, so that the sintering of the insulating material and the metallization of the uppermost layer are simultaneously performed; in this way, highly reliable uppermost layer Cu electrodes are obtainable.
摘要翻译： 公开了使用Cu作为导体材料的多层陶瓷的制造方法。 该方法包括通过生胶带多层层压法或通过厚膜印刷方法在陶瓷基板上形成多层层压体的步骤，其中绝缘材料与陶瓷和玻璃的混合物以含氧化铅为主要成分的混合物和具有 CuO为主要成分; 在空气中分解除去有机粘合剂的热处理步骤（粘合剂除去工艺）; 在氮和氢的混合气体气氛中还原氧化铜还原的氧化还原反应的步骤（还原过程）; 以及在氮气气氛中烧成的步骤，从而实现由含有氧化铅的陶瓷和玻璃构成的绝缘材料和铜电极的金属化（烧成工序）的烧结。 对于最上层电极，使用金属铜膏，并且在上述还原处理之后进行图案印刷工艺，使得绝缘材料的烧结和最上层的金属化同时进行; 以这种方式，可以获得高可靠性的最上层Cu电极。
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公开(公告)号：US5252519A
公开(公告)日：1993-10-12
申请号：US785750
申请日：1991-10-31
IPC分类号： H01B1/22 , H01L23/498 , H05K1/09 , H05K3/46 , H01L21/60
CPC分类号： H05K1/092 , H01L23/49822 , H01L23/49883 , H01L2224/16225 , H01L2224/45144 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , Y10T29/4913
摘要： A multilayered glass-ceramic substrate using copper as wiring material is fabricated by a step of forming wiring patterns with Au paste for connection of semiconductor chip prepared by adding at least one of Ni powder, Pt powder and Pd powder to Au powder, and copper oxide paste mainly composed of CuO powder, on a green sheet, and burning out the organic pattern by heat treatment in air, a step of reducing the copper oxide electrode by heat treatment in a reducing atmosphere containing hydrogen, and a step of sintering the substrate material, copper oxide electrode and gold electrode by heat treatment in nitrogen. Since the Au wiring pattern is formed on the top layer of the multilayered substrate in this constitution, wire bonding of high reliability is realized. Besides, by making use of the excellent solderability of Au, it may be also applied in flip-chip mounting of semiconductor. In addition, in this Au paste composition, the melting point of Au may be raised, and alloying or fusing is avoided if sintered at 900.degree. C. together with Cu electrode.
摘要翻译： 使用铜作为布线材料的多层玻璃陶瓷基板通过以下步骤制造：用Au糊形成用于连接通过将Ni粉末，Pt粉末和Pd粉末中的至少一种添加到Au粉末中而制备的半导体芯片的布线图案和氧化铜 主要由CuO粉末组成的糊料，在生片上通过在空气中热处理而烧制有机图案，通过在含氢还原气氛中进行热处理来还原氧化铜电极的工序，以及烧结基板材料的工序 ，氧化铜电极和金电极通过在氮气中热处理。 在这种结构中，由于在多层基板的顶层上形成Au布线图形，所以实现了高可靠性的引线接合。 此外，通过利用Au的优异的可焊性，也可以应用于半导体的倒装芯片安装。 此外，在该Au糊剂组合物中，Au的熔点可以提高，如果在900℃下与Cu电极一起烧结，则避免合金化或熔融。
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公开(公告)号：US5004640A
公开(公告)日：1991-04-02
申请号：US321702
申请日：1989-03-10
IPC分类号： H05K3/46 , B32B18/00 , C04B35/18 , C04B35/634 , C04B35/636 , H01L21/48 , H01L23/15 , H05K1/03
CPC分类号： C04B35/63416 , B32B18/00 , C04B35/18 , C04B35/634 , C04B35/6342 , C04B35/63424 , C04B35/6365 , H01L21/4857 , H01L23/15 , H05K1/0306 , C04B2237/34 , H01L2924/0002 , H01L2924/09701 , H05K3/4629 , Y10S428/901 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926
摘要： Multilayered ceramic substrates having Cu electrode patterns in or on ceramic-glass insulating layers which consist essentially of Al.sub.2 O.sub.3, SiO.sub.2, B.sub.2 O.sub.3, Na.sub.2 O, K.sub.2 O, CaO, MgO and PbO. The methods for manufacturing the substrate comprises thermally treating a laminate of alternately superimposing ceramic-glass insulating layers and CuO-based electrode layers of desired patterns in air or in a molecular oxygen-containing atmosphere to eliminate organic binders from the laminates by burning out, reducing the CuO into metallic Cu at low temperatures in an atmosphere containing hydrogen, and firing the thus reduced laminate in an inert gas such as nitrogen. The firing is effected at 850.degree. to 950.degree. C. The multilayered ceramic substrate may also be obtained by forming ceramic-glass insulating layers and CuO-based electrode layers alternately on a sintered ceramic support, followed by the thermal treatment, reduction and firing set forth above.
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公开(公告)号：US4812422A
公开(公告)日：1989-03-14
申请号：US869904
申请日：1986-06-03
CPC分类号： H05K1/0306 , C03C3/091 , H01B3/10 , H05K3/4629
摘要： Disclosed is a dielectric paste for a ceramic multilayer wiring substrate, of which feature, among others, lies in the composition of inorganic components comprised of ceramics made of Al.sub.2 O.sub.3, SiO.sub.2, CaO and MgO, and a borosilicate glass. This can be prepared by mixing a part of the glass with the ceramic, calcining the mixture at a high temperature, and then adding the remaining glass to mix with the calcined product. The insulation layer is densely formed, and a dielectric paste excelling in electric insulating property can be obtained by mixing this composition with an organic liquid.
摘要翻译： 公开了一种用于陶瓷多层布线基板的电介质浆料，其特征在于其中包括由Al 2 O 3，SiO 2，CaO和MgO制成的陶瓷和硼硅酸盐玻璃组成的无机组分的组成。 这可以通过将玻璃的一部分与陶瓷混合，在高温下煅烧混合物，然后加入剩余的玻璃与煅烧产物混合来制备。 绝缘层密集地形成，并且通过将该组合物与有机液体混合，可以获得优异的电绝缘性能的电介质糊料。
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9.发明授权Circuit component built-in module with embedded semiconductor chip and method of manufacturing 失效具有嵌入式半导体芯片的电路元件内置模块及其制造方法公开(公告)号：US07018866B2
公开(公告)日：2006-03-28
申请号：US10753933
申请日：2004-01-07
申请人： Yasuhiro Sugaya , Toshiyuki Asahi , Shingo Komatsu , Yoshiyuki Yamamoto , Seiichi Nakatani , Satoru Yuhaku , Kazuo Ohtani
发明人： Yasuhiro Sugaya , Toshiyuki Asahi , Shingo Komatsu , Yoshiyuki Yamamoto , Seiichi Nakatani , Satoru Yuhaku , Kazuo Ohtani
CPC分类号： H05K1/187 , H01L21/56 , H01L21/563 , H01L21/568 , H01L23/49822 , H01L23/49833 , H01L23/5385 , H01L23/5389 , H01L24/29 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/13111 , H01L2224/13144 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/73267 , H01L2224/81001 , H01L2224/81801 , H01L2224/83101 , H01L2224/83856 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06582 , H01L2225/06589 , H01L2225/06596 , H01L2225/1035 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/1517 , H01L2924/15787 , H01L2924/1627 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/00 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014
摘要： A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 μm and not more than 100 μm, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 μm and not more than 200 μm. With this configuration, the high-performance and compact-size circuit component built-in module in which circuit components are mounted at a high density is provided so as to be used suitably in various types of electronic information devices.
摘要翻译： 电路部件内置模块包括：由含有无机填料和热固性树脂的混合物制成的第一电绝缘基板; 至少形成在所述第一电绝缘基板的主表面上的多个布线图案; 结合在第一电绝缘基板中并与布线图形电连接的半导体芯片; 以及将所述多个布线图案彼此电连接的内部通孔，所述内部通孔穿过所述第一电绝缘基板。 在电路部件内置模块中，半导体芯片的厚度为30μm以上且100μm以下，具有非接线表面接地，电路部件内置模块的厚度为 范围不小于80μm，不大于200μm。 利用这种配置，提供了以高密度安装电路部件的高性能和紧凑型电路部件内置模块，以便适用于各种类型的电子信息装置。
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10.发明授权Conductor paste and method of manufacturing a multilayered ceramic body using the paste 失效导体糊料和使用该糊料制造多层陶瓷体的方法
公开(公告)号：US4714570A
公开(公告)日：1987-12-22
申请号：US756081
申请日：1985-07-17
申请人： Seiichi Nakatani , Satoru Yuhaku , Hideyuki Okinaka , Toru Ishida , Osamu Makino , Tatsuro Kikuchi
发明人： Seiichi Nakatani , Satoru Yuhaku , Hideyuki Okinaka , Toru Ishida , Osamu Makino , Tatsuro Kikuchi
CPC分类号： H05K1/092 , C04B41/5127 , C04B41/5144 , H01B1/20 , H01L21/4867 , H01L23/4828 , H01L2924/0002 , H01L2924/09701 , H05K3/4629
摘要： A manufacturing method for a multilayered ceramic body using Cu, Ni, Co or Fe as a conductor material, and a conductor forming paste of a particular composition of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component, the paste being applied to the multilayered body. The manufacturing method comprises: a process of forming the multilayered body with conductor paste of CuO, NiO, CoO or Fe.sub.2 O.sub.3 as the main component and insulating paste formed of glass and/or ceramic, so that a binder is removed from the laminate by heat treatment in an oxidizing atmosphere; a process of heat treatment for reducing the oxide; and a sintering process for sintering the laminate in a nitrogen atmosphere.
摘要翻译： 使用Cu，Ni，Co或Fe作为导体材料的多层陶瓷体的制造方法和以CuO，NiO，CoO或Fe2O3为特征的导体形成膏作为主要成分，将该糊状物施加到多层 身体。 该制造方法包括：以CuO，NiO，CoO或Fe2O3的导体浆料为主要成分的多层体和由玻璃和/或陶瓷形成的绝缘膏形成多层体的方法，通过热处理从粘合剂中除去粘合剂 在氧化气氛中 一种用于还原氧化物的热处理方法; 以及在氮气气氛中烧结层压体的烧结工艺。
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