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    LED housing and fabrication method thereof
    1.
    发明申请
    LED housing and fabrication method thereof 审中-公开
    LED外壳及其制造方法

    公开(公告)号：US20060180925A1

    公开(公告)日：2006-08-17

    申请号：US11325327

    申请日：2006-01-05

    申请人： Seon Lee ,  Bum Jin ,  Kyung Han ,  Chang Kim

    发明人： Seon Lee ,  Bum Jin ,  Kyung Han ,  Chang Kim

    IPC分类号： H01L23/34

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/00014

    摘要： The invention relates to an LED housing and its fabrication method. In the LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body. In this fashion, the invention can overcome restricted application problems by isolating the electrical connecting parts from the heat conducting part.

    摘要翻译： 本发明涉及一种LED外壳及其制造方法。 在LED壳体中，导热部具有芯片安装区域，与芯片安装区域相对的热连接区域和与热连接区域相邻形成的槽。 电气连接部件具有与芯片安装区域相邻放置的布线区域和引导到布线区域的外部电源连接区域。 壳体由成型树脂制成，并且一体地保持导热部和电连接部，同时将电连接部与导热部隔离。 壳体设置有从导热部分的槽的一部分延伸到壳体的一侧的凹部。 以这种方式，本发明可以通过将电气连接部件与导热部分隔离来克服限制的应用问题。

    Side-view light emitting diode having protective device
    2.
    发明申请
    Side-view light emitting diode having protective device 有权
    具有保护装置的侧视发光二极管

    公开(公告)号：US20070029564A1

    公开(公告)日：2007-02-08

    申请号：US11497232

    申请日：2006-08-02

    申请人： Kyung Han ,  Myoung Choi ,  Seon Lee ,  Jong Park ,  Chang Kim

    发明人： Kyung Han ,  Myoung Choi ,  Seon Lee ,  Jong Park ,  Chang Kim

    IPC分类号： H01L33/00

    CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10S257/918 ,  H01L2924/00014

    摘要： In a side view LED, elongated first and second lead frames each have a finger extending therefrom. The finger of the first lead frame is disposed in parallel with that of the second lead frame. An LED chip and a protective device are mounted on mounting areas of the first and second lead frames, respectively and electrically connected to the first and second lead frames. A package body houses the first and second lead frames to form first and second opened areas. The first opened area is externally opened around the LED chip, the second opened area is externally opened around the protective device, and the partition wall is formed therebetween. First and second encapsulants are provided to the first and second opened areas, respectively to encapsulate the LED chip and protective device, respectively. At least the first encapsulant is transparent.

    摘要翻译： 在侧视图LED中，细长的第一和第二引线框架各自具有从其延伸的指状物。 第一引线框架的指状物与第二引线框架的手指平行设置。 LED芯片和保护装置分别安装在第一和第二引线框架的安装区域上，并且电连接到第一引线框架和第二引线框架。 包装体容纳第一和第二引线框架以形成第一和第二开放区域。 第一开放区域围绕LED芯片外部打开，第二开放区域在保护装置周围被外部打开，并且间隔壁形成在其间。 第一和第二密封剂分别提供给第一和第二开放区域以分别封装LED芯片和保护装置。 至少第一密封剂是透明的。

    High power light emitting diode package
    3.
    发明申请
    High power light emitting diode package 有权

    公开(公告)号：US20060043401A1

    公开(公告)日：2006-03-02

    申请号：US11186971

    申请日：2005-07-22

    申请人： Seon Lee ,  Chang Kim ,  Kyung Han

    发明人： Seon Lee ,  Chang Kim ,  Kyung Han

    IPC分类号： H01L33/00

    CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2224/0401

    摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

    Side-emitting LED package and method of manufacturing the same
    5.
    发明申请
    Side-emitting LED package and method of manufacturing the same 审中-公开
    侧面发光LED封装及其制造方法

    公开(公告)号：US20060273337A1

    公开(公告)日：2006-12-07

    申请号：US11444402

    申请日：2006-06-01

    申请人： Kyung Han ,  Myoung Choi ,  Seon Lee ,  Hun Hahm ,  Seong Han ,  Chang Song ,  Young Park

    发明人： Kyung Han ,  Myoung Choi ,  Seon Lee ,  Hun Hahm ,  Seong Han ,  Chang Song ,  Young Park

    IPC分类号： H01L33/00

    CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00014

    摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.

    摘要翻译： 本发明涉及一种侧面发光LED封装及其制造方法。 侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。 侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射 模制部件形成透光表面。 封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。 本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

    Chip coated light emitting diode package and manufacturing method thereof
    6.
    发明申请
    Chip coated light emitting diode package and manufacturing method thereof 有权
    芯片涂层发光二极管封装及其制造方法

    公开(公告)号：US20070158669A1

    公开(公告)日：2007-07-12

    申请号：US11651524

    申请日：2007-01-10

    申请人： Seon Lee ,  Kyung Han ,  Seong Han

    发明人： Seon Lee ,  Kyung Han ,  Seong Han

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/62 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

    摘要翻译： 一种芯片涂覆的LED封装及其制造方法。 芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。 芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。 芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。 本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

    LED package having recess in heat conducting part
    7.
    发明申请
    LED package having recess in heat conducting part 有权
    LED封装在导热部分具有凹槽

    公开(公告)号：US20070030703A1

    公开(公告)日：2007-02-08

    申请号：US11500361

    申请日：2006-08-08

    申请人： Seon Lee ,  Chang Song ,  Kyung Han

    发明人： Seon Lee ,  Chang Song ,  Kyung Han

    IPC分类号： H01J1/62

    CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.

    摘要翻译： 本发明提供一种包括LED芯片的LED封装。 在LED封装中，折叠的金属片的导热部分具有形成在其上的凹部，以将LED芯片置于其中。 包装体容纳导热部分，并将LED芯片产生的光向上引导。 此外，透明密封剂至少设置在导热部分的凹部上。 引线部分地由封装体容纳以向LED芯片供电。 根据本发明，折叠金属板以形成导热部分，并且在导热部分上形成凹部以将LED芯片置于其中。 这提高了反射效率并简化了整个过程。

    LED package for backlight unit
    8.
    发明申请
    LED package for backlight unit 有权
    背光单元的LED封装

    公开(公告)号：US20060023451A1

    公开(公告)日：2006-02-02

    申请号：US10953787

    申请日：2004-09-30

    申请人： Kyung Han ,  Chan Park ,  Seon Lee

    发明人： Kyung Han ,  Chan Park ,  Seon Lee

    IPC分类号： F21V21/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： Disclosed herein is an LED package for a backlight unit. The LED package includes a plurality of LEDs, a die bonding part, a wire bonding part and a body. The die bonding part, on which the plurality of LEDs is arranged, allows the first electrodes of the LEDs to be electrically connected to an external circuit. The wire bonding part is spaced apart from the die bonding part by a predetermined distance to be insulated from the die bonding part and allows the second electrodes of the LEDs to be electrically connected to the external circuit so that the LEDs are operated. The body has a molding cup which is used to fill a space above the LEDs with transparent resin and a base on which the die bonding part and the wire bonding part are arranged.

    摘要翻译： 这里公开了一种用于背光单元的LED封装。 LED封装包括多个LED，芯片接合部，引线接合部和主体。 多个LED布置在其上的裸片接合部分允许LED的第一电极电连接到外部电路。 引线接合部与芯片接合部隔开预定距离，以与芯片接合部绝缘，并且允许LED的第二电极电连接到外部电路，使得LED被操作。 本体具有用于以透明树脂填充LED上方的空间的模制杯和芯片接合部分和引线接合部分布置在其上的基座。

    Light emitting diode package with diffuser and method of manufacturing the same
    9.
    发明申请
    Light emitting diode package with diffuser and method of manufacturing the same 有权
    具有扩散器的发光二极管封装及其制造方法

    公开(公告)号：US20070045644A1

    公开(公告)日：2007-03-01

    申请号：US11491947

    申请日：2006-07-25

    申请人： Seong Han ,  Seon Lee ,  Chang Song ,  Jung Park ,  Young Park ,  Kyung Han

    发明人： Seong Han ,  Seon Lee ,  Chang Song ,  Jung Park ,  Young Park ,  Kyung Han

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

    摘要翻译： 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。