Abstract:
An organic EL display apparatus includes a substrate, and a pixel circuit provided for each pixel. The pixel circuit includes a first oxide semiconductor TFT having a first oxide semiconductor layer, and a second oxide semiconductor TFT having a second oxide semiconductor layer. The first oxide semiconductor TFT has a top-gate structure. The second oxide semiconductor TFT has a bottom-gate structure. The second oxide semiconductor TFT has a shield electrode that is disposed on an insulating layer disposed on the second oxide semiconductor layer, facing the second oxide semiconductor layer.
Abstract:
An active matrix substrate includes a peripheral circuit including a TFT (30A) supported on a substrate (1). When viewed in a direction normal to the substrate (1), a first gate electrode (3) of the TFT (30A) includes a first edge portion and a second edge portion (3e1, 3e2) opposing each other. The first edge portion and the second edge portion extend across an oxide semiconductor layer (7) in a channel width direction. At least one of the first edge portion and the second edge portion includes, in a region overlapping with the oxide semiconductor layer (7), a first recess portion (40) recessed in a channel length direction and a first part (41) adjacent to the first recess portion in the channel width direction. When viewed in the direction normal to the substrate (1), a source electrode (8) or a drain electrode (9) of the TFT (30A) overlaps with at least a part of the first recess portion (40) and at least a part of the first part (41).
Abstract:
This semiconductor device includes a substrate and a thin film transistor supported on the substrate. The thin film transistor includes a gate electrode, a semiconductor layer, a gate-insulating layer provided between the gate electrode and the semiconductor layer, and a source electrode and a drain electrode respectively making contact with the semiconductor layer. The source electrode and the drain electrode respectively include a main layer containing aluminum or copper, a lower layer having a first layer containing refractory metal and positioned at a substrate side of the main layer, and an upper layer having a second layer containing refractory metal. The upper layer is provided so as to cover an upper surface of the main layer and at least the section of the side face of the main layer that overlaps the semiconductor layer.
Abstract:
This display device is provided with: a circuit substrate having a display region and a non-display region; pixel-driving TFTs for driving pixels, formed in the display region and having source electrodes and drain electrodes being spaced apart from each other on an insulating film and a first active layer formed from an oxide semiconductor, provided on the opposite side from the insulating film so as to cover a separation section between a source electrode and a drain electrode and part of the source electrode and part of the drain electrode adjacent to the separation section; and a driver circuit TFT for driving the pixel-driving TFTs, formed in the non-display region and having a second active layer formed from a non-oxide semiconductor.
Abstract:
An imaging panel (10) includes a photodiode (15), and a metal layer (43) provided below the photodiode and being in contact with a TFT (14) via a contact hole (CH1). A method of producing the imaging panel (10) includes forming a metal film (43p) covering to protect a first insulating film (42), subsequently forming semiconductor films to configure an n-type amorphous silicon layer (151), an intrinsic amorphous silicon layer (152), and a p-type amorphous silicon layer (153), and further forming the photodiode (15) by patterning the semiconductor films through dry etching.
Abstract:
In a demultiplexer circuit, each unit circuit includes at least n TFTs 30 and n branch lines connected with one video signal line. Each TFT 30 includes an oxide semiconductor layer 7, an upper gate electrode 11 provided on the oxide semiconductor layer with a gate insulating layer 9 interposed therebetween, and a first electrode 13 and a second electrode 15. The demultiplexer circuit further includes a first interlayer insulating layer 21 covering the oxide semiconductor layer and the upper gate electrode and a second interlayer insulating layer 23 provided on the first interlayer insulating layer. The first electrode 13 is provided between the first interlayer insulating layer 21 and the second interlayer insulating layer 23 and is in contact with the oxide semiconductor layer inside a first contact hole CH1 formed in the first interlayer insulating layer. The second electrode 15 is provided on the second interlayer insulating layer 23 and is in contact with the oxide semiconductor layer inside a second contact hole CH2 formed in the first and second interlayer insulating layers.
Abstract:
An active matrix substrate includes a demultiplexer circuit which includes a plurality of DMX circuit TFTs. Each of the DMX circuit TFTs includes a front-gate electrode (FG) supplied with a control signal from one of a plurality of control signal main lines ASW, BSW and a back-gate electrode (BG) supplied with a back-gate signal which is different from the control signal. The plurality of DMX circuit TFTs includes first DMX circuit TFTs (T1a, T1b) and second DMX circuit TFTs (T2a, T2b). The back-gate electrode of each of the first DMX circuit TFTs (T1a, T1b)is connected with a first back-gate signal main line (BGL(1)) which supplies a first back-gate signal and, the back-gate electrode of each of the second DMX circuit TFTs (T2a, T2b)is connected with a second back-gate signal main line (BGL(2)) which supplies a second back-gate signal which is different from the first back-gate signal.
Abstract:
A light detection device includes: a TFT having a semiconductor layer supported on a substrate, a source electrode, a drain electrode, and a gate electrode; a photodiode having a bottom electrode electrically connected to the drain electrode, a semiconductor laminate structure, and a top electrode; and an electrode made of the same conductive film as the bottom electrode and arranged on the semiconductor layer with an insulating layer interposed therebetween.
Abstract:
A liquid crystal panel (100) includes a pair of substrates (10, 30); a liquid crystal layer (40) provided between the pair of substrates; and a sealing member (42) provided so as to surround the liquid crystal layer. A plurality of pixels (P1, P2) are provided in a matrix in a region surrounded by the sealing member. Each of the plurality of pixels includes an oxide semiconductor TFT (5) provided in one substrate (10) of the pair of substrates; and a pixel electrode (19) provided in the one substrate and connected with the oxide semiconductor TFT. Each of the plurality of pixels is configured such that when the oxide semiconductor TFT is switched from an on-state to an off-state, a level of a voltage to be applied to the liquid crystal layer by use of the pixel electrode is shifted in a negative direction by a pull-in voltage ΔVd. A pull-in voltage ΔVd1 in a first pixel (P1) among the plurality of pixels is lower than a pull-in voltage ΔVd2 in a second pixel (P2) located farther from the sealing member than the first pixel.
Abstract:
A gate driver TFT 30 includes a first gate electrode 30a formed from a first metal film 15, a second gate electrode 31 formed from a second metal film 19 and overlapping a part of the first gate electrode 30a, an electrode 32 formed from the second metal film 19 overlapping a part of the first gate electrode 30a and disposed away from the second gate electrode 31 at an interval, channel portions 30d formed from the oxide semiconductor film 17 and one of which overlaps the second gate electrode 31 and another one of which overlaps the electrode 32, and a first low-resistance portion 33 formed from the oxide semiconductor film 17, the first-low resistance portion not overlapping the second gate electrode 31 and the electrode 32 and disposed between at least the channel portions 30d and having a resistance lower than that of the channel portions 30d.