摘要:
A memory array includes a plurality of bit lines and a plurality of word lines, a gate region, and a charge trapping layer. The charge trapping layer is wider than a word line; the charge trapping layer is extended beyond the edge of the gate region to facilitate capturing and removing charges.
摘要:
A method and apparatus for continuously rounded charge trapping layer formation in a flash memory device. The memory device includes a semiconductor layer, including a source/drain region. An isolation region is disposed adjacent to the source/drain region. A first insulator is disposed above the source/drain region. A charge trapping layer is disposed within the first insulator, wherein the charge trapping layer comprises a bulk portion and a first tip and a second tip on either side of said bulk portion, wherein said charge trapping layer extends beyond the width of the source/drain region. A second insulator is disposed above the charge trapping layer. A polysilicon gate structure is disposed above the second insulator, wherein a width of said control gate is wider than the width of said source/drain region.
摘要:
Embodiments of the present technology are directed toward gate sidewall engineering of field effect transistors. The techniques include formation of a blocking dielectric region and nitridation of a surface thereof. After nitridation of the blocking dielectric region, a gate region is formed thereon and the sidewalls of the gate region are oxidized to round off gate sharp corners and reduce the electrical field at the gate corners.
摘要:
A method for double patterning is disclosed. In one embodiment the formation a pair of select gate wordlines on either side of a plurality of core wordlines begins by placing a spacer pattern around edges of a photoresist pattern is disclosed. The photoresist pattern is stripped away leaving the spacer pattern. A trim mask is placed over a portion of the spacer pattern. Portions of the spacer pattern are etched away that are not covered by the trim mask. The trim mask is removed, wherein first remaining portions of the spacer pattern define a plurality of core wordlines. A pad mask is placed such that the pad mask and second remaining portions of the spacer pattern define a select gate wordline on either side of the plurality of core wordlines. Finally at least one pattern transfer layer is etched through using the mad mask and the first and second remaining portions of the spacer pattern to etch the select gate wordlines and the plurality of core wordlines into a poly silicon layer.
摘要:
Embodiments of the present technology are directed toward charge trapping region process margin engineering for charge trapping field effect transistor. The techniques include forming a plurality of shallow trench isolation regions on a substrate, wherein the tops of the shallow trench isolation regions extend above the substrate by a given amount. A portion of the substrate is oxidized to form a tunneling dielectric region. A first set of one or more nitride layers are deposited on the tunneling dielectric region and shallow trench isolation regions, wherein a thickness of the first set of nitride layers is approximately half of the given amount that the tops of the shallow trench isolation regions extend above the substrate. A portion of the first set of nitride layers is etched back to the tops of the trench isolation regions. A second set of one or more nitride layers is deposited on the etched back first set of nitride layers. The second set of nitride layers is oxidized to form a charge trapping region on the tunneling dielectric region and a blocking dielectric region on the charge trapping region. A gate region is then deposited on the blocking dielectric region.
摘要:
Methods for fabricating an electronic device and electronic devices therefrom are provided. A method includes forming one or more masking layers on a semiconducting surface of a substrate and forming a plurality of dielectric isolation features and a plurality of fin-type projections using the masking layer. The method also includes processing the masking layers and the plurality of fin-type projections to provide an inverted T-shaped cross-section for the plurality of fin-type projections that includes a distal extension portion and a proximal base portion. The method further includes forming a plurality of bottom gate layers on the distal extension portion and forming a plurality of control gate layers on the plurality of dielectric isolation features and the plurality of bottom gate layers.
摘要:
An electronic device includes a substrate with a semiconducting surface having a plurality of fin-type projections coextending in a first direction through a memory cell region and select gate regions. The electronic device further includes a dielectric isolation material disposed in spaces between the projections. In the electronic device, the dielectric isolation material in the memory cell regions have a height less than a height of the projections in the memory cell regions, and the dielectric isolation material in the select gate regions have a height greater than or equal to than a height of the projections in the select gate regions. The electronic device further includes gate features disposed on the substrate within the memory cell region and the select gate regions over the projections and the dielectric isolation material, where the gate features coextend in a second direction transverse to the first direction.
摘要:
A memory and method of manufacture employing word line scaling. A layered stack, including a charge trapping component and a core polysilicon layer, is formed on a core section and a peripheral section of a substrate. A portion of the layered stack, including the core polysilicon layer is then removed from the peripheral section. A peripheral polysilicon layer, which is thicker than the core polysilicon layer of the layered stack, is next formed on the layered stack and the peripheral section. The layered stack is then isolated from the peripheral polysilicon layer by removing a portion of the peripheral polysilicon layer from the core section, and polysilicon lines are patterned in the isolated layered stack.
摘要:
Methods for fabricating a semiconductor memory cell that has a spacer layer are disclosed. A method includes forming a plurality of source/drain regions in a substrate where the plurality of source/drain regions are formed between trenches, forming a first oxide layer above the plurality of source/drain regions and in the trenches, forming a charge storage layer above the oxide layer and separating the charge storage layer in the trenches where a space is formed between separated portions of the charge storage layer. The method further includes forming a spacer layer to fill the space between the separated portions of the charge storage layer and to rise a predetermined distance above the space. A second oxide layer is formed above the charge storage layer and the spacer layer and a polysilicon layer is formed above the second oxide layer.
摘要:
A memory and method of manufacture employing word line scaling. A layered stack, including a charge trapping component and a core polysilicon layer, is formed on a core section and a peripheral section of a substrate. A portion of the layered stack, including the core polysilicon layer is then removed from the peripheral section. A peripheral polysilicon layer, which is thicker than the core polysilicon layer of the layered stack, is next formed on the layered stack and the peripheral section. The layered stack is then isolated from the peripheral polysilicon layer by removing a portion of the peripheral polysilicon layer from the core section, and polysilicon lines are patterned in the isolated layered stack.