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公开(公告)号：US20050162180A1
公开(公告)日：2005-07-28
申请号：US11046883
申请日：2005-02-01
IPC分类号： G01R31/302 , G01R31/308 , H05K3/32 , G01R31/02
CPC分类号： G01R31/308 , G01R31/302 , H01L2924/0002 , H05K3/326 , H01L2924/00
摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。
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公开(公告)号：US06661247B2
公开(公告)日：2003-12-09
申请号：US09828221
申请日：2001-04-09
IPC分类号： G01R3126
CPC分类号： G01R31/308 , G01R31/302 , H01L2924/0002 , H05K3/326 , H01L2924/00
摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。
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3.发明授权Method and apparatus for passive optical characterization of semiconductor substrates subjected to high energy (MEV) ion implantation using high-injection surface photovoltage 有权使用高注射表面光电压进行高能量（MEV）离子注入的半导体衬底的无源光学表征的方法和装置公开(公告)号：US06249135B1
公开(公告)日：2001-06-19
申请号：US09268338
申请日：1999-03-16
IPC分类号： G01R3126
CPC分类号： G01R31/308 , G01R31/302 , H01L2924/0002 , H05K3/326 , H01L2924/00
摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。
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公开(公告)号：US07161370B2
公开(公告)日：2007-01-09
申请号：US11046883
申请日：2005-02-01
IPC分类号： G01R31/26
CPC分类号： G01R31/308 , G01R31/302 , H01L2924/0002 , H05K3/326 , H01L2924/00
摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。
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公开(公告)号：US06882169B2
公开(公告)日：2005-04-19
申请号：US10685542
申请日：2003-10-16
IPC分类号： G01R31/302 , G01R31/308 , H05K3/32 , G01R31/02 , H01R9/00
CPC分类号： G01R31/308 , G01R31/302 , H01L2924/0002 , H05K3/326 , H01L2924/00
摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed there in at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置相对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 至少所述连接部分可变形并延伸到所述开口中。
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6.发明授权公开(公告)号：US07112889B1
公开(公告)日：2006-09-26
申请号：US09577932
申请日：2000-05-25
申请人： Shigeyuki Maruyama , Yasuyuki Itoh , Tetsurou Honda , Kazuhiro Tashiro , Makoto Haseyama , Kenichi Nagashige , Yoshiyuki Yoneda , Hirohisa Matsuki
发明人： Shigeyuki Maruyama , Yasuyuki Itoh , Tetsurou Honda , Kazuhiro Tashiro , Makoto Haseyama , Kenichi Nagashige , Yoshiyuki Yoneda , Hirohisa Matsuki
IPC分类号： H01L23/544
CPC分类号： H01L22/12 , G01R31/2891 , H01L21/67282 , H01L21/6838 , H01L22/32 , H01L23/544 , H01L24/97 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/5448 , H01L2223/54493 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , Y10T29/49998 , Y10T279/11 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.
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7.发明授权Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state 有权测试半导体器件并在晶片状态下抽吸半导体器件的方法公开(公告)号：US08404496B2
公开(公告)日：2013-03-26
申请号：US11439119
申请日：2006-05-24
申请人： Shigeyuki Maruyama , Yasuyuki Itoh , Tetsurou Honda , Kazuhiro Tashiro , Makoto Haseyama , Kenichi Nagashige , Yoshiyuki Yoneda , Hirohisa Matsuki
发明人： Shigeyuki Maruyama , Yasuyuki Itoh , Tetsurou Honda , Kazuhiro Tashiro , Makoto Haseyama , Kenichi Nagashige , Yoshiyuki Yoneda , Hirohisa Matsuki
IPC分类号： G01R31/26
CPC分类号： H01L22/12 , G01R31/2891 , H01L21/67282 , H01L21/6838 , H01L22/32 , H01L23/544 , H01L24/97 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/5448 , H01L2223/54493 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , Y10T29/49998 , Y10T279/11 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.
摘要翻译： 半导体器件具有可以被常规晶片探测器识别的对准标记。 再分布层将半导体器件的电极连接到位于再分布层的预定位置的电极焊盘。 在再分配层的电极焊盘上形成配置有外部连接电极的金属柱。 在再分布层上形成由与金属柱相同的材料制成的标记构件。 标记构件用作与金属柱形成预定位置关系的对准标记。
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8.发明申请Semiconductor device having an alignment mark formed by the same material with a metal post 有权具有由与金属柱相同材料形成的对准标记的半导体装置公开(公告)号：US20060279003A1
公开(公告)日：2006-12-14
申请号：US11439119
申请日：2006-05-24
申请人： Shigeyuki Maruyama , Yasuyuki Itoh , Tetsurou Honda , Kazuhiro Tashiro , Makoto Haseyama , Kenichi Nagashige , Yoshiyuki Yoneda , Hirohisa Matsuki
发明人： Shigeyuki Maruyama , Yasuyuki Itoh , Tetsurou Honda , Kazuhiro Tashiro , Makoto Haseyama , Kenichi Nagashige , Yoshiyuki Yoneda , Hirohisa Matsuki
IPC分类号： H01L23/544
CPC分类号： H01L22/12 , G01R31/2891 , H01L21/67282 , H01L21/6838 , H01L22/32 , H01L23/544 , H01L24/97 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/5448 , H01L2223/54493 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , Y10T29/49998 , Y10T279/11 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.
摘要翻译： 半导体器件具有可以被常规晶片探测器识别的对准标记。 再分布层将半导体器件的电极连接到位于再分布层的预定位置的电极焊盘。 在再分配层的电极焊盘上形成配置有外部连接电极的金属柱。 在再分布层上形成由与金属柱相同的材料制成的标记构件。 标记构件用作与金属柱形成预定位置关系的对准标记。
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9.发明授权Tray in combination with electronic component attaching tool attached to the tray 失效托盘与附在托盘上的电子元件连接工具组合公开(公告)号：US08671557B2
公开(公告)日：2014-03-18
申请号：US13242647
申请日：2011-09-23
IPC分类号： B23P19/00
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.
摘要翻译： 托盘与附接到托盘上的电子部件连接工具组合地提供，并且包括附接凹陷部分，该附件凹陷部分包括内壁并且附接有电子部件，其中，附接凹陷部分的内壁的形成基本上不 取决于电子部件的外部形状，以及形成在安装凹部的内壁中的标准部分，并与电子部件安装工具的第一结构部分接合，以将电子部件安装工具的位置对准到标准 当使用电子部件安装工具将电子部件的位置与托盘的第一位置对准时，标准部件具有基本上不依赖于电子部件的外形的形状。
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公开(公告)号：US08164181B2
公开(公告)日：2012-04-24
申请号：US12872131
申请日：2010-08-31
IPC分类号： H01L23/12
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种半导体器件封装结构，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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