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    Method of producing a circuit board
    4.
    发明授权
    Method of producing a circuit board 失效
    电路板的制造方法

    公开(公告)号：US06691409B2

    公开(公告)日：2004-02-17

    申请号：US10280964

    申请日：2002-10-25

    申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

    发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

    IPC分类号： H01K300

    CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

    摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

    摘要翻译： 电路板被构造成在布线层之间包括不少于两个布线层，用于电绝缘的绝缘体层和在绝缘体层的厚度方向上设置在绝缘体层中的内通孔导电构件， 用于布线层之间的电连接。 绝缘体层由包含有机树脂和热膨胀系数小于有机树脂的材料的复合材料制成，并且包括以所述顺序层压的表面部分，芯部分和表面部分， 表面部分具有高含量的有机树脂，芯部分的有机树脂含量低。 所述布线层具有与所述内通孔导电部件连接的台面部，所述接合部嵌入以与所述芯部大体接触，所述内通孔导电部件的厚度基本上 等于芯部的厚度。 根据该结构，将金属箔的一部分嵌入到绝缘体层中以与芯层接触。 因此，能够提供能够选择性地压缩导电材料的部分的电路基板，由此能够确保层之间的稳定的连接。

    Circuit board having an interstitial inner via hole structure
    10.
    发明授权
    Circuit board having an interstitial inner via hole structure 失效
    具有间隙内通孔结构的电路板

    公开(公告)号：US06734375B2

    公开(公告)日：2004-05-11

    申请号：US09956205

    申请日：2001-09-18

    申请人： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

    发明人： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

    IPC分类号： H05K111

    CPC分类号： H05K3/4626 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

    摘要： A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle. Thereby, it is possible to make the insulating layer of the circuit board securing the interlayer electrically connection by an inner via hole including a conductive paste to be homogenized and ultra-thin and improve the reliability of the connection of the inner via hole.

    摘要翻译： 包括所需数量的电绝缘层和交替层叠的布线层的电路板，以及用于通过压缩和硬化包括导电颗粒和树脂的导电膏来固定布线层之间的电连接的内通孔。 在电绝缘层中，多孔片材至少在一个表面上设置有树脂片，多孔片材至少在中心部分不浸渍树脂。 在电绝缘层的厚度方向贯通电绝缘层的贯通孔填充有包含导电性粒子和树脂的导电性糊剂，并且在多孔质片材内存在的孔填充有层叠树脂。 多孔片内的孔的平均孔径可以小于导电性粒子的平均粒径。 由此，可以使电路基板的绝缘层通过包含导电性糊剂的内部通路孔进行层间电连接，使其均匀化，超薄化，提高内部通孔连接的可靠性。