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    Method of producing a circuit board
    2.
    发明授权
    Method of producing a circuit board 失效
    电路板的制造方法

    公开(公告)号：US06691409B2

    公开(公告)日：2004-02-17

    申请号：US10280964

    申请日：2002-10-25

    申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

    发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

    IPC分类号： H01K300

    CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

    摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

    摘要翻译： 电路板被构造成在布线层之间包括不少于两个布线层，用于电绝缘的绝缘体层和在绝缘体层的厚度方向上设置在绝缘体层中的内通孔导电构件， 用于布线层之间的电连接。 绝缘体层由包含有机树脂和热膨胀系数小于有机树脂的材料的复合材料制成，并且包括以所述顺序层压的表面部分，芯部分和表面部分， 表面部分具有高含量的有机树脂，芯部分的有机树脂含量低。 所述布线层具有与所述内通孔导电部件连接的台面部，所述接合部嵌入以与所述芯部大体接触，所述内通孔导电部件的厚度基本上 等于芯部的厚度。 根据该结构，将金属箔的一部分嵌入到绝缘体层中以与芯层接触。 因此，能够提供能够选择性地压缩导电材料的部分的电路基板，由此能够确保层之间的稳定的连接。

    Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
    6.
    发明授权
    Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same 有权
    用于填充通孔的导电浆料，使用其的双面和多层印刷电路板及其制造方法

    公开(公告)号：US6139777A

    公开(公告)日：2000-10-31

    申请号：US304700

    申请日：1999-05-04

    申请人： Kazunori Omoya ,  Takeshi Suzuki ,  Tatsuo Ogawa ,  Takashi Oobayashi

    发明人： Kazunori Omoya ,  Takeshi Suzuki ,  Tatsuo Ogawa ,  Takashi Oobayashi

    IPC分类号： H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H01B1/22 ,  B05D5/12 ,  H05K1/00

    CPC分类号： H05K3/462 ,  H05K1/095 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901

    摘要： A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20 .mu.m and whose specific surface area ranges from 0.05 to 1.5 m.sup.2 /g, and (b) 70-30 volume % of resin comprising at least 10 weight % of epoxy resin comprising at least one epoxy group per molecule, in which the total amount of a hydroxyl group, an amino group and a carboxyl group is not more than 5 mol % of the epoxy group, and the epoxy equivalent ranges from 100 to 350 g/eq. The conductive paste for filling via-holes and a printed circuit board comprising thereof can be used to provide an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener and a dispersant if necessary. The paste having low viscosity and low volatility is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foils on both sides to attain a printed circuit board where both sides are electrically connected by inner-via-hole.

    摘要翻译： 提供了一种用于通孔填充的糊料，并且该糊料至少包含（a）30-70体积％的导电颗粒，其平均直径范围为0.5至20μm，比表面积为0.05至1.5m 2 / g ，和（b）70-30体积％的树脂，其包含每分子至少10重量％的包含至少一个环氧基的环氧树脂，其中羟基，氨基和羧基的总量不多 不大于5mol％的环氧基，并且环氧当量为100-350g / eq。 用于填充通孔的导电膏和包括其的印刷电路板可以用于在电极层之间提供内通孔连接，而不使用通孔电镀技术。 如果需要，导电糊包含金属颗粒如铜，环氧树脂，固化剂和分散剂。 使用具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。 然后，将该基板与两侧的铜箔一起加热加压，以获得印刷电路板，其中两侧通过内通孔电连接。

    Flexible semiconductor device and method for manufacturing same
    7.
    发明授权
    Flexible semiconductor device and method for manufacturing same 有权
    柔性半导体器件及其制造方法

    公开(公告)号：US08343822B2

    公开(公告)日：2013-01-01

    申请号：US12681445

    申请日：2009-07-30

    申请人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

    发明人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

    IPC分类号： H01L21/84 ,  H01L21/00

    CPC分类号： H01L29/78651 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/1266 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/78603 ,  H01L29/7869

    摘要： A method for manufacturing a flexible semiconductor device includes (i) forming an insulating film on the upper surface of metal foil, (ii) forming an extraction electrode pattern on the upper surface of the metal foil, (iii) forming a semiconductor layer on the insulating film such that the semiconductor layer is in contact with the extraction electrode pattern, (iv) forming a sealing resin layer on the upper surface of the metal foil such that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) forming electrodes by etching the metal foil, the metal foil being used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). The metal foil need not be stripped, and a high-temperature process can be used.

    摘要翻译： 一种制造柔性半导体器件的方法包括：（i）在金属箔的上表面上形成绝缘膜，（ii）在金属箔的上表面上形成引出电极图案，（iii）在金属箔的上表面上形成半导体层 绝缘膜，使得半导体层与引出电极图案接触，（iv）在金属箔的上表面上形成密封树脂层，使得密封树脂层覆盖半导体层和引出电极图案，和（ v）通过蚀刻金属箔形成电极，金属箔用作绝缘膜的支撑体，引出电极图案，半导体层和形成在（i）至（iv）中的密封树脂层，并用作 （v）中的电极的构成材料。 金属箔不需要剥离，可以使用高温工艺。

    FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    8.
    发明申请
    FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 有权
    柔性半导体器件及其制造方法

    公开(公告)号：US20100283054A1

    公开(公告)日：2010-11-11

    申请号：US12681445

    申请日：2009-07-30

    申请人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

    发明人： Koichi Hirano ,  Seiichi Nakatani ,  Tatsuo Ogawa ,  Takashi Ichiryu ,  Takeshi Suzuki

    IPC分类号： H01L29/786 ,  H01L21/336

    CPC分类号： H01L29/78651 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/1266 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/78603 ,  H01L29/7869

    摘要： There is provided a method for manufacturing a flexible semiconductor device characterized by comprising (i) a step of forming an insulating film on the upper surface of metal foil, (ii) a step of forming an extraction electrode pattern on the upper surface of the metal foil, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the extraction electrode pattern, (iv) a step of forming a sealing resin layer on the upper surface of the metal foil in such a manner that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) a step of forming electrodes by etching the metal foil, wherein the metal foil is used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). A TFT element can be fabricated by a simple process because the metal foil serving as the support need not be finally stripped off. Further, a high-temperature process can be introduced to the fabrication of the insulating film and the semiconductor layer because the metal foil is used as the support, whereby the TFT characteristic is improved.

    摘要翻译： 提供了一种制造柔性半导体器件的方法，其特征在于包括：（i）在金属箔的上表面上形成绝缘膜的步骤，（ii）在金属的上表面上形成引出电极图案的步骤 箔，（iii）以半导体层与引出电极图案接触的方式在绝缘膜上形成半导体层的步骤，（iv）在所述绝缘膜的上表面上形成密封树脂层的步骤 金属箔以密封树脂层覆盖半导体层和引出电极图案，以及（v）通过蚀刻金属箔形成电极的步骤，其中金属箔用作绝缘膜的支撑体， （i）〜（iv）中形成的并用作（v）中的电极的构成材料的引出电极图案，半导体层和密封树脂层。 由于作为支撑体的金属箔不需要最终被剥离，所以可以通过简单的工艺制造TFT元件。 此外，由于使用金属箔作为支撑体，因此可以将绝缘膜和半导体层的制造引入高温处理，从而提高TFT特性。