Semiconductor device, and method for manufacturing the same
    3.
    发明授权
    Semiconductor device, and method for manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号:US06211038B1

    公开(公告)日:2001-04-03

    申请号:US09047325

    申请日:1998-03-25

    IPC分类号: H01L2176

    CPC分类号: H01L21/76259

    摘要: A method for manufacturing a thin-film crystalline solar cell includes the steps of (i) forming a porous layer including a large number of fine pores in a surface portion of a crystalline substrate, (ii) transforming a part of the porous layer including the surface thereof into a smooth layer which does not include fine pores by providing the porous layer with excitation energy, and (iii) peeling the smooth layer from the substrate. The excitation energy is provided, for example, by performing heat treatment in a hydrogen atmosphere, irradiating with light having a wavelength equal to or less than 600 nm, or irradiating with an electron beam. It is thereby possible to form a thin-film crystalline semiconductor layer on an inexpensive and flexible substrate by simple processes.

    摘要翻译: 制造薄膜结晶太阳能电池的方法包括以下步骤:(i)在结晶基材的表面部分形成包含大量细孔的多孔层,(ii)将包含 通过向多孔层提供激发能量而将其表面形成不包括细孔的光滑层,以及(iii)从基板剥离光滑层。 励磁能量例如通过在氢气氛中进行热处理,用波长等于或小于600nm的光照射或用电子束照射来提供。 从而可以通过简单的工艺在便宜且柔性的基板上形成薄膜晶体半导体层。

    Process for producing semiconductor substrate
    4.
    发明授权
    Process for producing semiconductor substrate 失效
    半导体衬底的制造方法

    公开(公告)号:US06258698B1

    公开(公告)日:2001-07-10

    申请号:US09046600

    申请日:1998-03-24

    IPC分类号: H01L2130

    CPC分类号: H01L21/2007

    摘要: A process for producing a semiconductor substrate is provided which comprises a first step of anodizing a surface of a first substrate to form a porous layer on the surface, a second step of simultaneously forming a semiconductor layer on the surface of the porous layer and a semiconductor layer on a surface of the first substrate on its side opposite to the porous layer side, a third step of bonding the surface of the semiconductor layer formed on the surface of the porous layer to a surface of a second substrate, and a fourth step of separating the first substrate and the second substrate at the part of the porous layer to transfer to the second substrate the semiconductor layer formed on the surface of the porous layer, thereby providing the semiconductor layer on the surface of the second substrate. This makes it possible to produce semiconductor substrates at a low cost while making good use of expensive substrate materials.

    摘要翻译: 提供了一种制造半导体衬底的方法,其包括:第一步骤,阳极氧化第一衬底的表面以在表面上形成多孔层;第二步骤,在多孔层的表面上同时形成半导体层,半导体 在与第一基板的与多孔层侧相反的一侧的表面上的第三步骤,将形成在多孔层的表面上的半导体层的表面接合到第二基板的表面上的第三步骤, 在所述多孔层的一部分处分离所述第一基板和所述第二基板,以将所述半导体层转移到所述第二基板,所述半导体层形成在所述多孔层的表面上,从而在所述第二基板的表面上提供所述半导体层。 这使得可以以低成本制造半导体衬底,同时充分利用昂贵的衬底材料。

    Production method of photoelectric conversion device, and photoelectric conversion device produced by the method
    6.
    发明授权
    Production method of photoelectric conversion device, and photoelectric conversion device produced by the method 失效
    光电转换装置的生产方法,以及通过该方法生产的光电转换装置

    公开(公告)号:US06534336B1

    公开(公告)日:2003-03-18

    申请号:US09572940

    申请日:2000-05-18

    IPC分类号: H01L2100

    摘要: The present invention provides a production method of a photoelectric conversion device, which comprises a step of forming an uneven shape on a surface of a substrate, a step of providing a separation layer maintaining the uneven shape on the substrate, a step of forming a semiconductor film maintaining the uneven shape on the separation layer, and a step of separating the semiconductor film from the substrate at the separation layer, wherein the step of forming the uneven shape on the surface of the substrate is a step of forming the substrate having the uneven shape on the surface by anisotropic etching of the substrate with the separation layer remaining after the separation. The present invention also provides a photoelectric conversion device produced by the above method.

    摘要翻译: 本发明提供了一种光电转换装置的制造方法,其特征在于,包括在基板的表面上形成不均匀的形状的步骤,在基板上设置保持凹凸形状的分离层的工序,形成半导体 在分离层上保持不均匀形状的膜,以及在分离层处分离半导体膜与基板的步骤,其中在基板的表面上形成不均匀形状的步骤是形成具有不平坦的基板的步骤 通过分离后残留分离层的基板的各向异性蚀刻在表面上形成。 本发明还提供一种通过上述方法制造的光电转换装置。

    Method and apparatus for producing photoelectric conversion device
    7.
    发明授权
    Method and apparatus for producing photoelectric conversion device 失效
    光电转换装置的制造方法及装置

    公开(公告)号:US06391743B1

    公开(公告)日:2002-05-21

    申请号:US09401775

    申请日:1999-09-22

    IPC分类号: H01L2130

    摘要: There is disclosed a method of producing a photoelectric conversion device comprising the steps of forming a semiconductor substrate comprising a first and a second semiconductor layers with a separation layer therebetween; bonding a support substrate to a surface of the second semiconductor layer opposite to the separation-layer-side surface to form a bonded substrate; separating the first and the second semiconductor layers by the separation layer; and producing a photoelectric conversion device in the second semiconductor layer, wherein when bonding the semiconductor substrate and the support substrate to each other, at least a portion is formed in the bonded substrate in which at least a part of end portions of the semiconductor substrate and the support substrate is not bonded to the other substrate and a fluid is jetted against a side surface of the bonded substrate, thereby separating the first and the second semiconductor layers. The method makes it possible to separate a bonded substrate with a high yield, thereby supplying photoelectric conversion devices with a high quality at a low production cost.

    摘要翻译: 公开了一种制造光电转换装置的方法,包括以下步骤:形成包括第一和第二半导体层的半导体衬底,其间具有分离层; 将支撑基板接合到与分离层侧表面相对的第二半导体层的表面,以形成键合衬底; 通过分离层分离第一和第二半导体层; 以及在所述第二半导体层中制造光电转换器件,其中当将所述半导体衬底和所述支撑衬底彼此接合时,至少一部分形成在所述键合衬底中,其中所述半导体衬底和所述支撑衬底的至少一部分端部和 支撑基板不与另一个基板接合,并且流体相对于键合衬底的侧表面喷射,从而分离第一和第二半导体层。 该方法可以以高产率分离粘合的基片,从而以低的生产成本提供高质量的光电转换装置。

    Method for producing semiconductor device substrate by bonding a porous
layer and an amorphous layer
    9.
    发明授权
    Method for producing semiconductor device substrate by bonding a porous layer and an amorphous layer 失效
    通过粘合多孔层和非晶层来制造半导体器件基板的方法

    公开(公告)号:US5492859A

    公开(公告)日:1996-02-20

    申请号:US369325

    申请日:1995-01-06

    摘要: A process for producing a semiconductor device substrate comprises the steps of making a first substrate member porous, forming an insulating layer on a second substrate member, forming an amorphous layer on the insulating layer on the second substrate member, bonding the porous first substrate member to the amorphous layer at a temperature of an atmosphere in which the amorphous layer at least does not crystallize, causing solid-phase epitaxial growth of the amorphous layer by utilizing the porous first substrate member as crystal growth seed, and removing the bonded first substrate member after completion of the epitaxial growth by chemical etching.

    摘要翻译: 一种制造半导体器件基板的方法包括以下步骤:使第一基板部件多孔,在第二基板部件上形成绝缘层,在第二基板部件上的绝缘层上形成非晶层,将多孔第一基板部件接合到 在非晶层至少不结晶的气氛的温度下的非晶层,通过利用多孔第一基板构件作为晶体生长种子,引起非晶层的固相外延生长,以及在第一基板构件之后移除结合的第一基板构件 通过化学蚀刻完成外延生长。

    Process for producing semiconductor member, and process for producing solar cell
    10.
    发明授权
    Process for producing semiconductor member, and process for producing solar cell 失效
    半导体部件的制造方法以及太阳能电池的制造方法

    公开(公告)号:US06566235B2

    公开(公告)日:2003-05-20

    申请号:US09819680

    申请日:2001-03-29

    IPC分类号: H01L2146

    摘要: A process for producing a semiconductor member, comprising a first step of forming a porous layer by making porous a first member at its surface portion, leaving some region or regions thereof not made porous; a second step of bonding a semiconductor layer formed on the porous layer and on the first-member surface left not made porous, to a second member to form a bonded structure; and a third step of separating the bonded structure at the part of the porous layer. The first member is made porous leaving some region or regions thereof not made porous so that the porous layer does not cause any separation at the part of the porous layer in the first and second steps. This process can make the semiconductor layer unseparable from the single-crystal silicon member before the separation for transferring the semiconductor layer to the support member side, without setting the anodizing conditions strictly. Also disclosed is a process for producing a solar cell by the above process.

    摘要翻译: 一种半导体部件的制造方法,其特征在于,包括:通过在其表面部分形成多孔第一部件而形成多孔层的第一工序,使一部分区域或多个区域形成多孔; 将形成在所述多孔层上的半导体层和未形成多孔的所述第一构件表面接合到第二构件以形成接合结构的第二步骤; 以及在多孔层的一部分分离结合结构的第三步骤。 第一个构件是多孔的,留下一些不是多孔的区域或区域,使得多孔层在第一和第二步骤中在多孔层的部分处不引起任何分离。该方法可以使半导体层与单个层不可分离 在将半导体层转移到支撑构件侧的分离之前的晶体硅构件,而不严格地设定阳极氧化条件。还公开了通过上述方法制造太阳能电池的方法。