公开(公告)号：US5110515A

公开(公告)日：1992-05-05

申请号：US353256

申请日：1989-05-16

申请人： Shozo Nakamura ,  Aizo Kaneda ,  Shigeharu Tsunoda ,  Akio Hasebe ,  Masao Mitani

发明人： Shozo Nakamura ,  Aizo Kaneda ,  Shigeharu Tsunoda ,  Akio Hasebe ,  Masao Mitani

IPC分类号： B29C45/02 ,  B29C45/14 ,  B29C45/72 ,  B29L31/34 ,  H01L21/56

CPC分类号： B29C45/14655 ,  B29C45/1468 ,  B29C45/7207 ,  H01L21/565 ,  H01L2924/0002

摘要： A method for manufacturing plastic package for semiconductor according to the present invention comprises the steps of: forming a mold product of plastic package for semiconductor, which contains therein a semiconductor chip, by molding resin by means of a transfer press; heating the mold product to postcure it during transportation from the transfer press to a heating chamber while the mold product is kept by heaters at a temperature higher than a glass transition temperature of the resin for a predetermined period of time; and further heating the mold product in the heating chamber while the mold product is kept at a temperature substantially equal to the glass transition temperature of the resin for another predetermined period of time.

摘要翻译： 根据本发明的用于制造半导体用塑料封装件的方法包括以下步骤：通过转印压模成型树脂来形成其中包含半导体芯片的用于半导体的塑料封装的模具产品; 在模具产品通过加热器在高于树脂的玻璃化转变温度的温度下保持预定时间段时，加热模具产品以在从转印压机传送到加热室的过程中将其后固化; 并且在模具产品保持在基本上等于树脂的玻璃化转变温度的温度另外预定时间段的情况下，进一步加热加热室中的模具产品。

公开(公告)号：US4946633A

公开(公告)日：1990-08-07

申请号：US184790

申请日：1988-04-22

申请人： Junichi Saeki ,  Aizo Kaneda ,  Shigeharu Tsunoda ,  Isamu Yoshida ,  Kunihiko Nishi

发明人： Junichi Saeki ,  Aizo Kaneda ,  Shigeharu Tsunoda ,  Isamu Yoshida ,  Kunihiko Nishi

IPC分类号： B29C45/02 ,  B29C45/14 ,  H01L21/00 ,  H01L21/56

CPC分类号： B29C45/14655 ,  B29C45/02 ,  H01L21/565 ,  H01L24/97 ,  B29C2045/2712 ,  H01L2924/181 ,  Y10S425/812

摘要： Apparatus for producing semiconductor devices is provided with mold and lead frame suitable for improving the production efficiency and product quality. Also disclosed is a method of producing semiconductor devices by means of the apparatus. The mold is characterized by the shape of a die and has a plurality of pots for pressure-feeding resin, a flow passage communicating the pots with each other so as to uniformalize the molding pressure applied to the pots even if there are variations in the weights of the resin charged in the pots, and a plurality of cavities disposed in series.

摘要翻译： 用于生产半导体器件的设备设置有适于提高生产效率和产品质量的模具和引线框架。 还公开了通过该装置制造半导体器件的方法。 模具的特征在于模具的形状，并且具有用于加压树脂的多个盆，使得盆彼此连通的流动通道，以便均匀化施加到罐的成型压力，即使重量有变化 填充在所述盆中的树脂，以及串联设置的多个空腔。

公开(公告)号：US4983110A

公开(公告)日：1991-01-08

申请号：US323497

申请日：1989-03-13

申请人： Isamu Yoshida ,  Junichi Saeki ,  Shigeharu Tsunoda ,  Kunihiko Nishi ,  Masao Mitani

发明人： Isamu Yoshida ,  Junichi Saeki ,  Shigeharu Tsunoda ,  Kunihiko Nishi ,  Masao Mitani

IPC分类号： B29C45/02 ,  B29C45/14 ,  H01L21/56

CPC分类号： B29C45/14655 ,  B29C45/02 ,  H01L21/565 ,  H01L24/97 ,  B29C2045/024 ,  B29C2045/2712 ,  H01L2924/181

摘要： A resin encapsulating apparatus for semiconductor devices is characterized by including a rectangular pot constituted by being surrounded with two opposed wall surfaces of short side each having an outwardly projecting curved surface and two opposed wall surfaces of long side which are each substantially in the form of a straight line; a plurality of cavity lines connected respectively through gates to the bottom portion of at least one said long-side wall surface of the pot, the cavity lines each consisting of cavities connected in series; and a plunger to be inserted into the pot.

摘要翻译： 一种用于半导体器件的树脂封装装置的特征在于包括矩形盆，该矩形盆由两个相对的短边的相对的壁表面围绕，每个具有向外突出的弯曲表面和两个相对的长边的相对的壁表面基本上呈 直线; 多个腔体线分别通过浇口连接到所述罐的至少一个所述长边壁表面的底部，每个空腔线由空腔连接成串联连接; 以及插入锅中的柱塞。

公开(公告)号：US20050130425A1

公开(公告)日：2005-06-16

申请号：US10985934

申请日：2004-11-12

申请人： Naoya Kanda ,  Kosuke Inoue ,  Madoka Minagawa ,  Shigeharu Tsunoda

发明人： Naoya Kanda ,  Kosuke Inoue ,  Madoka Minagawa ,  Shigeharu Tsunoda

IPC分类号： G06K19/07 ,  G06K19/077 ,  H01R43/02 ,  H01L21/302 ,  H01L21/461

CPC分类号： G06K19/0775 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2924/01079

摘要： There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.

摘要翻译： 存在制造RFID的方法，其中具有存储器的半导体芯片被结合到天线，使得可以通过天线发送记录在存储器中的信息。 在RFID中，使用PET膜，PEN膜或纸张作为天线的基材。 该方法包括：将半导体芯片与相对于天线的金凸块对准，其中由铝或铝合金形成的金属箔粘附到包括聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的基材上; 将半导体芯片按压到天线; 并在低于聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的玻璃化转变温度的环境温度下施加超声波，从而结合金凸块和金属箔。 因此，该方法抑制天线的变形。

公开(公告)号：US06861294B2

公开(公告)日：2005-03-01

申请号：US10673459

申请日：2003-09-30

申请人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

发明人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/44

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

摘要翻译： 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模组成的模具，下半模具有多个突起，一个在 对应于每个外部端子的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US5914531A

公开(公告)日：1999-06-22

申请号：US805737

申请日：1997-02-25

申请人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

发明人： Shigeharu Tsunoda ,  Junichi Saeki ,  Isamu Yoshida ,  Kazuya Ooji ,  Michiharu Honda ,  Makoto Kitano ,  Nae Yoneda ,  Shuji Eguchi ,  Kunihiko Nishi ,  Ichiro Anjoh ,  Kenichi Otsuka

IPC分类号： H01L21/50 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/04 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3128 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

摘要翻译： 一种半导体塑料封装，更具体地，优选的封装结构和用于制造BGA封装的方法。 树脂密封BGA封装，其中固定支撑半导体部件的支撑框架; 即IC芯片，电路板或电路膜用树脂密封，使用由上半模和下半模构成的模具，下半模具有多个突起，一个在 对应于每个外部端子的位置。 模具具有在其分割元件之间具有通风口的分隔结构。

公开(公告)号：US08110907B2

公开(公告)日：2012-02-07

申请号：US12318798

申请日：2009-01-08

申请人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

发明人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/50 ,  H01L24/93 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/78313 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.

摘要翻译： 半导体器件包括半导体芯片，第一基板和第二基板。 第一基板包括多个导线和多个第一电极，每个第一电极与每个导线连接。 第二基板包括安装在其上的半导体芯片，以及多个第二电极，每个第二电极与第一基板的每个第一电极连接。 第一基板的导线的宽度根据导线的长度而不同。 通过根据其长度改变电线的宽度，可以减少电极的刚度变化和电极附近，从而可以降低超声波接合强度的变化。

公开(公告)号：US20090206492A1

公开(公告)日：2009-08-20

申请号：US12318798

申请日：2009-01-08

申请人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

发明人： Masahiro Yamaguchi ,  Emi Sawayama ,  Hiroshi Oyama ,  Shigeharu Tsunoda ,  Yasuo Amano ,  Naoki Matsushima

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/50 ,  H01L24/93 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/78313 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.

摘要翻译： 半导体器件包括半导体芯片，第一基板和第二基板。 第一基板包括多个导线和多个第一电极，每个第一电极与每个导线连接。 第二基板包括安装在其上的半导体芯片，以及多个第二电极，每个第二电极与第一基板的每个第一电极连接。 第一基板的导线的宽度根据导线的长度而不同。 通过根据其长度改变电线的宽度，可以减少电极的刚度变化和电极附近，从而可以降低超声波接合强度的变化。

公开(公告)号：US07172130B2

公开(公告)日：2007-02-06

申请号：US10960074

申请日：2004-10-08

申请人： Shigeharu Tsunoda ,  Hiroshi Hozoji ,  Madoka Minagawa

发明人： Shigeharu Tsunoda ,  Hiroshi Hozoji ,  Madoka Minagawa

IPC分类号： G06K19/06 ,  H05B3/30 ,  B29V45/14 ,  G08B13/14

CPC分类号： G06K19/07749 ,  G06K19/07728 ,  G06K19/07764

摘要： The present invention aims to improve the durability of an RFID chip inlet. A module including an RFID chip amounted to an antenna is covered with polyimide film with an adhesive layer to make up an RFID inlet. The outer surface of the RFID inlet is then covered with the surface processed to increase surface lubricity of a base part. When the RFID inlet is for use in a rubber product, it is mounted to a rubber base of the rubber product, the exposed surface of the RFID inlet is covered with an unvulcanized rubber, and the unvulcanized rubber is then pressed and heated causing the RFID inlet to be embedded in the rubber base.

摘要翻译： 本发明旨在提高RFID芯片入口的耐久性。 包括与天线对应的RFID芯片的模块被具有粘合剂层的聚酰亚胺膜覆盖以构成RFID入口。 然后，RFID入口的外表面被处理的表面覆盖以增加基部的表面润滑性。 当RFID入口用于橡胶制品时，它被安装到橡胶制品的橡胶基座上，RFID入口的暴露表面被未硫化橡胶覆盖，然后将未硫化橡胶压制和加热，使得RFID 入口嵌入橡胶底座。

公开(公告)号：US07122087B2

公开(公告)日：2006-10-17

申请号：US10985934

申请日：2004-11-12

申请人： Naoya Kanda ,  Kosuke Inoue ,  Madoka Minagawa ,  Shigeharu Tsunoda

发明人： Naoya Kanda ,  Kosuke Inoue ,  Madoka Minagawa ,  Shigeharu Tsunoda

IPC分类号： B32B37/00

CPC分类号： G06K19/0775 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2924/01079

摘要： There is a method of manufacturing an RFID, in which a semiconductor chip with a memory is bonded to an antenna, so that the information recorded in the memory can be transmitted through the antenna. In the RFID, a PET film, a PEN film, or a sheet of paper is used as the base material of the antenna. The method includes: aligning the semiconductor chip with gold bumps relative to the antenna, in which a metal foil formed of an aluminum or an aluminum alloy is adhered to the base material, including a polyethylene terephthalate or a polyethylene naphthalate; pressing the semiconductor chip to the antenna; and applying ultrasonic waves under an ambient temperature lower than the glass transition temperature of the polyethylene terephthalate or the polyethylene naphthalate, to thereby bond the gold bumps and the metal foil. Thus, the method suppresses the deformation of the antenna.

摘要翻译： 存在制造RFID的方法，其中具有存储器的半导体芯片被结合到天线，使得可以通过天线发送记录在存储器中的信息。 在RFID中，使用PET膜，PEN膜或纸张作为天线的基材。 该方法包括：将半导体芯片与相对于天线的金凸块对准，其中由铝或铝合金形成的金属箔粘附到包括聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的基材上; 将半导体芯片按压到天线; 并在低于聚对苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯的玻璃化转变温度的环境温度下施加超声波，从而结合金凸块和金属箔。 因此，该方法抑制天线的变形。