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29 条记录 (耗时 0.031 秒)

    Vapor deposition of hafnium silicate materials with tris(dimethylamino)silane
    4.
    发明申请
    Vapor deposition of hafnium silicate materials with tris(dimethylamino)silane 审中-公开
    硅酸铪材料与三（二甲基氨基）硅烷的蒸汽沉积

    公开(公告)号：US20060062917A1

    公开(公告)日：2006-03-23

    申请号：US11223896

    申请日：2005-09-09

    申请人： Shankar Muthukrishnan ,  Tejal Goyani ,  Rahul Sharangpani ,  Shreyas Kher ,  Pravin Narwankar ,  Khaled Ahmed ,  Yi Ma

    发明人： Shankar Muthukrishnan ,  Tejal Goyani ,  Rahul Sharangpani ,  Shreyas Kher ,  Pravin Narwankar ,  Khaled Ahmed ,  Yi Ma

    IPC分类号： C23C16/00

    CPC分类号： C23C16/308 ,  C23C16/401 ,  C23C16/56

    摘要： In one embodiment, a method for forming a morphologically stable dielectric material is provided which includes exposing a substrate to a hafnium precursor, a silicon precursor and an oxidizing gas to form hafnium silicate material during a chemical vapor deposition (CVD) process and subsequently and optionally exposing the substrate to a post deposition anneal, a nitridation process and a thermal annealing process. In some examples, the hafnium and silicon precursors used during a metal-organic CVD (MOCVD) process are alkylamino compounds, such as tetrakis(diethylamino)hafnium (TDEAH) and tris(dimethylamino)silane (Tris-DMAS). In another embodiment, other metal precursors may be used to form a variety of metal silicates containing tantalum, titanium, aluminum, zirconium, lanthanum or combinations thereof.

    摘要翻译： 在一个实施方案中，提供了一种用于形成形态稳定的电介质材料的方法，其包括在化学气相沉积（CVD）工艺期间将衬底暴露于铪前体，硅前体和氧化气体以形成硅酸铪材料，随后和任选地 将衬底暴露于后沉积退火，氮化工艺和热退火工艺。 在一些实例中，在金属 - 有机CVD（MOCVD）方法中使用的铪和硅前体是烷基氨基化合物，例如四（二乙基氨基）铪（TDEAH）和三（二甲氨基）硅烷（Tris-DMAS）。 在另一个实施方案中，其它金属前体可用于形成含有钽，钛，铝，锆，镧或其组合的各种金属硅酸盐。

    Methods for atomic layer deposition of hafnium-containing high-K dielectric materials
    7.
    发明授权
    Methods for atomic layer deposition of hafnium-containing high-K dielectric materials 失效
    含铪高K介电材料的原子层沉积方法

    公开(公告)号：US08282992B2

    公开(公告)日：2012-10-09

    申请号：US11925681

    申请日：2007-10-26

    申请人： Nyi Oo Myo ,  Kenric Cho ,  Shreyas Kher ,  Pravin Narwankar ,  Steve Poppe ,  Craig R. Metzner ,  Paul Deaten

    发明人： Nyi Oo Myo ,  Kenric Cho ,  Shreyas Kher ,  Pravin Narwankar ,  Steve Poppe ,  Craig R. Metzner ,  Paul Deaten

    IPC分类号： C23C16/00

    CPC分类号： C23C16/4488 ,  C23C16/0272 ,  C23C16/40 ,  C23C16/401 ,  C23C16/405 ,  C23C16/4412 ,  C23C16/45529 ,  C23C16/45531 ,  C23C16/45544 ,  C23C16/45582 ,  C23C16/56 ,  Y02T50/67 ,  Y10T137/0357 ,  Y10T137/0396 ,  Y10T137/2087

    摘要： Embodiments of the invention provide methods for depositing materials on substrates during vapor deposition processes, such as atomic layer deposition (ALD). In one embodiment, a chamber contains a substrate support with a receiving surface and a chamber lid containing an expanding channel formed within a thermally insulating material. The chamber further includes at least one conduit coupled to a gas inlet within the expanding channel and positioned to provide a gas flow through the expanding channel in a circular direction, such as a vortex, a helix, a spiral, or derivatives thereof. The expanding channel may be formed directly within the chamber lid or formed within a funnel liner attached thereon. The chamber may contain a retaining ring, an upper process liner, a lower process liner or a slip valve liner. Liners usually have a polished surface finish and contain a thermally insulating material such as fused quartz or ceramic. In an alternative embodiment, a deposition system contains a catalytic water vapor generator connected to an ALD chamber.

    摘要翻译： 本发明的实施例提供了在诸如原子层沉积（ALD）的气相沉积工艺期间在衬底上沉积材料的方法。 在一个实施例中，腔室包含具有接收表面的衬底支撑件和包含形成在绝热材料内的扩张通道的腔室盖。 腔室还包括至少一个管道，其连接到膨胀通道内的气体入口并且定位成提供在圆形方向（例如涡流，螺旋，螺旋或其衍生物）上的气体流过膨胀通道。 膨胀通道可以直接形成在室盖内，或者形成在其内附着的漏斗衬套中。 腔室可以包含保持环，上加工衬套，下工艺衬垫或滑阀衬套。 衬里通常具有抛光表面光洁度并且包含绝热材料，例如熔融石英或陶瓷。 在替代实施例中，沉积系统包含连接到ALD室的催化水蒸汽发生器。

    Plasma treatment of hafnium-containing materials
    8.
    发明申请
    Plasma treatment of hafnium-containing materials 审中-公开
    含铪材料的等离子体处理

    公开(公告)号：US20060019033A1

    公开(公告)日：2006-01-26

    申请号：US11167070

    申请日：2005-06-24

    申请人： Shankar Muthukrishnan ,  Rahul Sharangpani ,  Tejal Goyani ,  Pravin Narwankar ,  Shreyas Kher ,  Khaled Ahmed ,  Yi Ma

    发明人： Shankar Muthukrishnan ,  Rahul Sharangpani ,  Tejal Goyani ,  Pravin Narwankar ,  Shreyas Kher ,  Khaled Ahmed ,  Yi Ma

    IPC分类号： C23C16/00

    CPC分类号： H01L21/0228 ,  C23C16/401 ,  C23C16/405 ,  C23C16/4488 ,  C23C16/45525 ,  C23C16/45529 ,  C23C16/56 ,  H01L21/02175 ,  H01L21/02181 ,  H01L21/0234 ,  H01L21/3141 ,  H01L21/3143 ,  H01L21/31637 ,  H01L21/31645

    摘要： In one embodiment, a method for forming a dielectric material is provided which includes exposing a substrate sequentially to a metal-containing precursor and an oxidizing gas to form metal oxide (e.g., HfOx) during an ALD process and subsequently exposing the substrate to an inert plasma process and a thermal annealing process. Generally, the metal oxide contains hafnium, tantalum, titanium, aluminum, zirconium, lanthanum or combinations thereof. In one example, the inert plasma process contains argon and is free of nitrogen, while the thermal annealing process contains oxygen. In another example, an ALD process to form a metal oxide includes exposing the substrate sequentially to a metal precursor and an oxidizing gas containing water vapor formed by a catalytic water vapor generator. In an alternative embodiment, a method for forming a dielectric material is provide which includes exposing a substrate to a deposition process to form a metal oxide layer and subsequently exposing the substrate to a nitridation plasma process and a thermal annealing process to form metal oxynitride (e.g., HfOxNy).

    摘要翻译： 在一个实施例中，提供了一种用于形成介电材料的方法，其包括在ALD过程期间将衬底依次暴露于含金属的前体和氧化气体以形成金属氧化物（例如，HfO x x x） 随后将衬底暴露于惰性等离子体工艺和热退火工艺中。 通常，金属氧化物含有铪，钽，钛，铝，锆，镧或其组合。 在一个实例中，惰性等离子体工艺包含氩并且不含氮，而热退火工艺含有氧。 在另一个实例中，形成金属氧化物的ALD工艺包括将基板顺序地暴露于金属前体和含有由催化水蒸汽发生器形成的水蒸汽的氧化气体。 在替代实施例中，提供了形成电介质材料的方法，其包括将衬底暴露于沉积工艺以形成金属氧化物层，并随后将衬底暴露于氮化等离子体工艺和热退火工艺以形成金属氮氧化物（例如 ，HfO x N N y）。

    Apparatuses and methods for atomic layer deposition of hafnium-containing high-k dielectric materials
    9.
    发明申请
    Apparatuses and methods for atomic layer deposition of hafnium-containing high-k dielectric materials 审中-公开
    含铪高k电介质原子层沉积的装置和方法

    公开(公告)号：US20050271813A1

    公开(公告)日：2005-12-08

    申请号：US11127767

    申请日：2005-05-12

    申请人： Shreyas Kher ,  Pravin Narwankar ,  Rahul Sharangapani

    发明人： Shreyas Kher ,  Pravin Narwankar ,  Rahul Sharangapani

    IPC分类号： C23C16/00 ,  C23C16/02 ,  C23C16/40 ,  C23C16/44 ,  C23C16/448 ,  C23C16/455 ,  C23C16/56 ,  F22B1/00

    CPC分类号： C23C16/4488 ,  C23C16/0272 ,  C23C16/40 ,  C23C16/401 ,  C23C16/405 ,  C23C16/4412 ,  C23C16/45529 ,  C23C16/45531 ,  C23C16/45544 ,  C23C16/45582 ,  C23C16/56 ,  Y02T50/67 ,  Y10T137/0357 ,  Y10T137/0396 ,  Y10T137/2087

    摘要： Embodiments of the invention provide methods for depositing dielectric materials on substrates during vapor deposition processes, such as atomic layer deposition (ALD). In one example, a method includes sequentially exposing a substrate to a hafnium precursor and an oxidizing gas to deposit a hafnium oxide material thereon. In another example, a hafnium silicate material is deposited by sequentially exposing a substrate to the oxidizing gas and a process gas containing a hafnium precursor and a silicon precursor. The oxidizing gas usually contains water vapor formed by flowing a hydrogen source gas and an oxygen source gas through a water vapor generator. In another example, a method includes sequentially exposing a substrate to the oxidizing gas and at least one precursor to deposit hafnium oxide, zirconium oxide, lanthanum oxide, tantalum oxide, titanium oxide, aluminum oxide, silicon oxide, aluminates thereof, silicates thereof, derivatives thereof or combinations thereof.

    摘要翻译： 本发明的实施例提供了在诸如原子层沉积（ALD）的气相沉积工艺期间在衬底上沉积电介质材料的方法。 在一个实例中，一种方法包括将衬底顺序地暴露于铪前体和氧化气体以在其上沉积氧化铪材料。 在另一个实例中，通过将衬底顺序地暴露于氧化气体和含有铪前体和硅前体的工艺气体来沉积硅酸铪材料。 氧化气体通常含有通过使氢源气体和氧源气体流过水蒸汽发生器而形成的水蒸气。 在另一个实例中，一种方法包括将衬底顺序地暴露于氧化气体和至少一种前体以沉积氧化铪，氧化锆，氧化镧，氧化钽，氧化钛，氧化铝，氧化硅，其铝酸盐，其硅酸盐，衍生物 或其组合。

    Apparatuses for atomic layer deposition
    10.
    发明授权
    Apparatuses for atomic layer deposition 有权
    用于原子层沉积的装置

    公开(公告)号：US08343279B2

    公开(公告)日：2013-01-01

    申请号：US11127753

    申请日：2005-05-12

    申请人： Nyi Oo Myo ,  Kenric Choi ,  Shreyas Kher ,  Pravin Narwankar ,  Steve Poppe ,  Craig R. Metzner ,  Paul Deaten

    发明人： Nyi Oo Myo ,  Kenric Choi ,  Shreyas Kher ,  Pravin Narwankar ,  Steve Poppe ,  Craig R. Metzner ,  Paul Deaten

    IPC分类号： C23C16/00

    CPC分类号： C23C16/4488 ,  C23C16/0272 ,  C23C16/40 ,  C23C16/401 ,  C23C16/405 ,  C23C16/4412 ,  C23C16/45529 ,  C23C16/45531 ,  C23C16/45544 ,  C23C16/45582 ,  C23C16/56 ,  Y02T50/67 ,  Y10T137/0357 ,  Y10T137/0396 ,  Y10T137/2087

    摘要： Embodiments of the invention provide apparatuses and methods for depositing materials on substrates during vapor deposition processes, such as atomic layer deposition (ALD). In one embodiment, a chamber contains a substrate support with a receiving surface and a chamber lid containing an expanding channel formed within a thermally insulating material. The chamber further includes at least one conduit coupled to a gas inlet within the expanding channel and positioned to provide a gas flow through the expanding channel in a circular direction, such as a vortex, a helix, a spiral or derivatives thereof. The expanding channel may be formed directly within the chamber lid or formed within a funnel liner attached thereon. The chamber may contain a retaining ring, an upper process liner, a lower process liner or a slip valve liner. Liners usually have a polished surface finish and contain a thermally insulating material such as fused quartz or ceramic. In an alternative embodiment, a deposition system contains a catalytic water vapor generator connected to an ALD chamber.

    摘要翻译： 本发明的实施例提供了在诸如原子层沉积（ALD）的气相沉积工艺期间在衬底上沉积材料的设备和方法。 在一个实施例中，腔室包含具有接收表面的衬底支撑件和包含形成在绝热材料内的扩张通道的腔室盖。 腔室还包括至少一个管道，其连接到膨胀通道内的气体入口并且定位成提供在圆形方向（例如涡流，螺旋，螺旋或其衍生物）上的气流通过膨胀通道。 膨胀通道可以直接形成在室盖内，或者形成在其内附着的漏斗衬套中。 腔室可以包含保持环，上加工衬套，下工艺衬垫或滑阀衬套。 衬里通常具有抛光表面光洁度并且包含绝热材料，例如熔融石英或陶瓷。 在替代实施例中，沉积系统包含连接到ALD室的催化水蒸汽发生器。