公开(公告)号：US20080314993A1

公开(公告)日：2008-12-25

申请号：US12222938

申请日：2008-08-20

申请人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

发明人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

IPC分类号： G06K19/06

CPC分类号： H01Q1/2208 ,  A63B43/00 ,  A63B2225/54 ,  G06K19/07749 ,  G06K19/07758 ,  G06K19/07786 ,  H01Q7/00

摘要： A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.

摘要翻译： 射频识别标签天线包括薄膜基底，在薄膜基底上平行形成的用于发送和接收的多个天线图案，以及沿着沿着薄膜基底的相邻天线图案之间的薄膜基底上形成的切割线 天线图案从胶片底部的内侧到外缘。 使用切割线将形成有天线图案的胶片基底的一部分以预定方向折叠或弯曲。

公开(公告)号：US20060043199A1

公开(公告)日：2006-03-02

申请号：US10998138

申请日：2004-11-29

申请人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

发明人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

IPC分类号： G06K19/06

CPC分类号： H01Q1/2208 ,  A63B43/00 ,  A63B2225/54 ,  G06K19/07749 ,  G06K19/07758 ,  G06K19/07786 ,  H01Q7/00

摘要： A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.

公开(公告)号：US07699235B2

公开(公告)日：2010-04-20

申请号：US12222938

申请日：2008-08-20

申请人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

发明人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

IPC分类号： G06K19/06

CPC分类号： H01Q1/2208 ,  A63B43/00 ,  A63B2225/54 ,  G06K19/07749 ,  G06K19/07758 ,  G06K19/07786 ,  H01Q7/00

摘要： A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.

摘要翻译： 射频识别标签天线包括薄膜基底，在薄膜基底上平行形成的用于发送和接收的多个天线图案，以及沿着沿着薄膜基底的相邻天线图案之间的薄膜基底上形成的切割线 天线图案从胶片底部的内侧到外缘。 使用切割线将形成有天线图案的胶片基底的一部分以预定方向折叠或弯曲。

公开(公告)号：US07540428B2

公开(公告)日：2009-06-02

申请号：US10998138

申请日：2004-11-29

申请人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

发明人： Shunji Baba ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Takatoyo Yamakami ,  Masumi Katayama

IPC分类号： G06K19/06

CPC分类号： H01Q1/2208 ,  A63B43/00 ,  A63B2225/54 ,  G06K19/07749 ,  G06K19/07758 ,  G06K19/07786 ,  H01Q7/00

摘要： A radio-frequency-identification tag antenna includes a film base, a plurality of antenna patterns for transmission and reception, which is formed in parallel on the film base, and a cut line that is formed on the film base between adjacent antenna patterns along the antenna patterns from an inside to an outer edge of the film base. A part of the film base on which the antenna patterns are formed is folded or bent in a predetermined direction using the cut line.

摘要翻译： 射频识别标签天线包括薄膜基底，在薄膜基底上平行形成的用于发送和接收的多个天线图案，以及沿着沿着薄膜基底的相邻天线图案之间的薄膜基底上形成的切割线 天线图案从胶片底部的内侧到外缘。 使用切割线将形成有天线图案的胶片基底的一部分以预定方向折叠或弯曲。

公开(公告)号：US07394163B2

公开(公告)日：2008-07-01

申请号：US10187843

申请日：2002-07-03

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/563 ,  H01L21/67092 ,  H01L21/67144 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83951 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet rays 108 are emitted so as to harden the peripheral portion 151a of the adhesive 151 spread out between the head IC chip 11 and the suspension 12.

摘要翻译： 通过用作底层填充剂的粘合剂填充芯片和基板之间的间隙来安装半导体芯片的方法，其中安装IC芯片。 底部填充物的圆角被制成具有优选的形状。 为了实现这一点，将具有凸块的头IC芯片放置在被底部填充胶粘剂覆盖的悬挂上，并设置有垫。 接合工具按压头IC芯片并对头IC芯片施加超声波振荡，使得凸块适当地粘合到焊盘。 当头部IC芯片被按压并进行超声波振荡时，发射紫外线108以使在头IC芯片11和悬架12之间展开的粘合剂151的周边部分151a硬化。

公开(公告)号：US07347347B2

公开(公告)日：2008-03-25

申请号：US10972440

申请日：2004-10-26

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： B23K1/06 ,  B23K37/00

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US20050196529A1

公开(公告)日：2005-09-08

申请号：US11117307

申请日：2005-04-29

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G03F7/16 ,  B05C5/02 ,  B05C11/10 ,  B05D3/00 ,  B05D7/00 ,  H01L21/56 ,  H01L21/60 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  B05D5/12

CPC分类号： B05C11/1034 ,  B05C5/0212 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/163 ,  H01L2924/00 ,  H01L2224/05599

摘要： A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

公开(公告)号：US20050057856A1

公开(公告)日：2005-03-17

申请号：US10972440

申请日：2004-10-26

申请人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

发明人： Hidehiko Kira ,  Shunji Baba ,  Norio Kainuma ,  Toru Okada ,  Takatoyo Yamakami ,  Yasunori Sasaki ,  Takeshi Komiyama ,  Kenji Kobae ,  Hiroshi Kobayashi

IPC分类号： G11B5/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L29/06 ,  G11B21/20

CPC分类号： H01L21/568 ,  B29C2043/5825 ,  G11B5/4806 ,  G11B5/486 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L29/0657 ,  H01L2223/54426 ,  H01L2223/5448 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/75302 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

摘要翻译： 头组件设置有安装表面，以及安装在安装表面上并处理信号的集成电路芯片。 集成电路芯片由防止由集成电路芯片产生异物的层所覆盖。

公开(公告)号：US20050196704A1

公开(公告)日：2005-09-08

申请号：US11117309

申请日：2005-04-29

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G03F7/16 ,  B05C5/02 ,  B05C11/10 ,  B05D3/00 ,  B05D7/00 ,  H01L21/56 ,  H01L21/60 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  G03C5/00

CPC分类号： B05C11/1034 ,  B05C5/0212 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/163 ,  H01L2924/00 ,  H01L2224/05599

摘要： A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

公开(公告)号：US06770319B2

公开(公告)日：2004-08-03

申请号：US09811605

申请日：2001-03-20

申请人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Shunji Baba ,  Takatoyo Yamakami ,  Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： B05D512

CPC分类号： B05C11/1034 ,  B05C5/0212 ,  H01L21/563 ,  H01L24/743 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/0126 ,  H05K2203/163 ,  H01L2924/00 ,  H01L2224/05599

摘要： A resin coating method for applying resin to a predetermined region of a wiring board includes the steps of imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance of the resin obtained in the imaging step.

摘要翻译： 将树脂涂布到布线板的预定区域的树脂涂布方法包括以下步骤：对从树脂施加装置挤出的树脂的外观进行成像; 并且基于在成像步骤中获得的树脂的外观自动调节从树脂施加装置挤出的树脂的量。