Semiconductor device and manufacturing method thereof
    2.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US08742422B2

    公开(公告)日:2014-06-03

    申请号:US12871148

    申请日:2010-08-30

    摘要: The semiconductor device includes a driver circuit portion including a driver circuit and a pixel portion including a pixel. The pixel includes a gate electrode layer having a light-transmitting property, a gate insulating layer, a source electrode layer and a drain electrode layer each having a light-transmitting property provided over the gate insulating layer, an oxide semiconductor layer covering top surfaces and side surfaces of the source electrode layer and the drain electrode layer and provided over the gate electrode layer with the gate insulating layer therebetween, a conductive layer provided over part of the oxide semiconductor layer and having a lower resistance than the source electrode layer and the drain electrode layer, and an oxide insulating layer in contact with part of the oxide semiconductor layer.

    摘要翻译: 半导体器件包括驱动器电路部分,其包括驱动器电路和包括像素的像素部分。 像素包括具有透光性的栅极电极层,栅极绝缘层,源极电极层和漏极电极层,其各自具有设置在栅极绝缘层上的透光性,覆盖顶表面的氧化物半导体层和 源极电极层和漏极电极层的侧面,并且在栅电极层之间设置有栅极绝缘层,导电层设置在氧化物半导体层的一部分上,并且具有比源极电极层和漏极 电极层和与氧化物半导体层的一部分接触的氧化物绝缘层。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20110062432A1

    公开(公告)日:2011-03-17

    申请号:US12879635

    申请日:2010-09-10

    IPC分类号: H01L29/786 H01L21/44

    CPC分类号: H01L29/7869 H01L27/1225

    摘要: An object is to realize low power consumption while manufacturing a semiconductor device including a thin film transistor whose parasitic capacitance is reduced. Part of an insulating layer covering the periphery of a gate electrode layer is formed to be thick. Specifically, a stack including a spacer insulating layer and a gate insulating layer is formed. The thick part of the insulating layer covering the periphery of the gate electrode layer reduces parasitic capacitance formed between the gate electrode layer of the thin film transistor and another electrode layer (another wiring layer) overlapping with the gate electrode layer.

    摘要翻译: 目的是在制造包括其寄生电容减小的薄膜晶体管的半导体器件的同时实现低功耗。 覆盖栅电极层周围的绝缘层的一部分形成为较厚。 具体地,形成包括间隔绝缘层和栅极绝缘层的堆叠。 覆盖栅电极层周围的绝缘层的厚部减小了在薄膜晶体管的栅电极层与与栅电极层重叠的另一电极层(另一布线层)之间形成的寄生电容。