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公开(公告)号：US08629543B2
公开(公告)日：2014-01-14
申请号：US12913604
申请日：2010-10-27
申请人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
发明人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
IPC分类号： H01L23/02
CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
摘要翻译： 在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。 在一些实施例中，导电迹线由导电聚合物形成。 提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。
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公开(公告)号：US08723332B2
公开(公告)日：2014-05-13
申请号：US12124077
申请日：2008-05-20
申请人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
发明人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
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公开(公告)号：US07923349B2
公开(公告)日：2011-04-12
申请号：US12142589
申请日：2008-06-19
申请人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, Jr. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
发明人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, Jr. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/3185 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68377 , H01L2224/2919 , H01L2224/81801 , H01L2224/83851 , H01L2924/14 , H01L2924/1461 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).
摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。
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公开(公告)号：US08324081B2
公开(公告)日：2012-12-04
申请号：US13041192
申请日：2011-03-04
申请人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, Jr. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
发明人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, Jr. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/3185 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68377 , H01L2224/2919 , H01L2224/81801 , H01L2224/83851 , H01L2924/14 , H01L2924/1461 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).
摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。
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公开(公告)号：US08742602B2
公开(公告)日：2014-06-03
申请号：US12046651
申请日：2008-03-12
申请人： Terrence Caskey , Lawrence Douglas Andrews, Jr. , Scott McGrath , Simon J. S. McElrea , Yong Du , Mark Scott
发明人： Terrence Caskey , Lawrence Douglas Andrews, Jr. , Scott McGrath , Simon J. S. McElrea , Yong Du , Mark Scott
CPC分类号： H01L23/49811 , H01L24/01 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/80 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32014 , H01L2224/45014 , H01L2224/48229 , H01L2224/731 , H01L2224/8312 , H01L2224/83191 , H01L2224/838 , H01L2225/06551 , H01L2225/06575 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45015 , H01L2924/207
摘要： A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically interconnecting a die to a support includes providing a support having interconnect pedestals formed at bond pads on the die mount surface of the support, providing a die having interconnect terminals projecting beyond a die edge, positioning the die in relation to the support such that the terminals are aligned with the corresponding pedestals, and moving the die and the support toward one another so that the terminals contact the respective pedestals.
摘要翻译： 模具组件包括安装到支撑件的模具，其中支撑件具有形成在接合焊盘处的互连基座，并且模具具有突出超过模具边缘的相互连接端子到相应的基座。 另外，支架具有互连基座。 此外，用于将管芯电连接到支撑件的方法包括提供支撑件，其具有形成在支撑件的管芯安装表面上的接合焊盘处的互连基座，提供具有突出超过模具边缘的互连端子的管芯，将管芯相对于 所述支撑件使得端子与相应的基座对准，并且使模具和支撑件朝向彼此移动，使得端子与相应的基座接触。
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公开(公告)号：US08178978B2
公开(公告)日：2012-05-15
申请号：US12403175
申请日：2009-03-12
IPC分类号： H01L23/495 , H01L23/50 , H01L23/34 , H01L25/16 , H01L21/50
CPC分类号： H01L25/0657 , H01L21/56 , H01L23/48 , H01L24/24 , H01L24/80 , H01L24/82 , H01L29/0657 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/00
摘要： Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
摘要翻译： 堆叠的模具组件电连接到任何支撑件上的连接部位，而不与任何插入的基板或引线框架电连接，并且没有焊料。
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公开(公告)号：US09305862B2
公开(公告)日：2016-04-05
申请号：US13456126
申请日：2012-04-25
IPC分类号： H01L23/495 , H01L23/50 , H01L23/34 , H01L25/16 , H01L21/50 , H01L23/48 , H01L23/00 , H01L25/065 , H01L29/06 , H01L21/58
CPC分类号： H01L25/0657 , H01L21/56 , H01L23/48 , H01L24/24 , H01L24/80 , H01L24/82 , H01L29/0657 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/00
摘要： Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
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公开(公告)号：US08159053B2
公开(公告)日：2012-04-17
申请号：US12892739
申请日：2010-09-28
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L23/3121 , H01L23/3135 , H01L23/4952 , H01L23/49541 , H01L24/24 , H01L25/105 , H01L2224/24137 , H01L2225/1029 , H01L2225/1064 , H01L2924/14 , H01L2924/00
摘要： A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.
摘要翻译： 平坦无引线封装包括至少一个安装在引线框上的管芯，并使用导电聚合物或导电油墨电连接到引线。 此外，组件包括使用导电聚合物或导电油墨电连接到引线的堆叠无引线封装。 此外，封装模块包括安装在支撑件上并且使用导电聚合物或导电油墨电连接到支撑体中的电路的堆叠的无引线封装的组件。
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公开(公告)号：US07843046B2
公开(公告)日：2010-11-30
申请号：US12199667
申请日：2008-08-27
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L23/3121 , H01L23/3135 , H01L23/4952 , H01L23/49541 , H01L24/24 , H01L25/105 , H01L2224/24137 , H01L2225/1029 , H01L2225/1064 , H01L2924/14 , H01L2924/00
摘要： A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.
摘要翻译： 平坦无引线封装包括至少一个安装在引线框上的管芯，并使用导电聚合物或导电油墨电连接到引线。 此外，组件包括使用导电聚合物或导电油墨电连接到引线的堆叠无引线封装。 此外，封装模块包括安装在支撑件上并且使用导电聚合物或导电油墨电连接到支撑体中的电路的堆叠的无引线封装的组件。
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