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公开(公告)号：US20080315434A1
公开(公告)日：2008-12-25
申请号：US12142589
申请日：2008-06-19
申请人： Simon J.S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, JR. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
发明人： Simon J.S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, JR. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
IPC分类号： H01L21/304 , H01L23/488
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/3185 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68377 , H01L2224/2919 , H01L2224/81801 , H01L2224/83851 , H01L2924/14 , H01L2924/1461 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).
摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。
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公开(公告)号：US07923349B2
公开(公告)日：2011-04-12
申请号：US12142589
申请日：2008-06-19
申请人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, Jr. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
发明人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, Jr. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/3185 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68377 , H01L2224/2919 , H01L2224/81801 , H01L2224/83851 , H01L2924/14 , H01L2924/1461 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).
摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。
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公开(公告)号：US20110147943A1
公开(公告)日：2011-06-23
申请号：US13041192
申请日：2011-03-04
申请人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, JR. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
发明人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, JR. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/3185 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68377 , H01L2224/2919 , H01L2224/81801 , H01L2224/83851 , H01L2924/14 , H01L2924/1461 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).
摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。
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公开(公告)号：US08324081B2
公开(公告)日：2012-12-04
申请号：US13041192
申请日：2011-03-04
申请人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, Jr. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
发明人： Simon J. S. McElrea , Terrence Caskey , Scott McGrath , DeAnn Eileen Melcher , Reynaldo Co , Lawrence Douglas Andrews, Jr. , Weiping Pan , Grant Villavicencio , Yong Du , Scott Jay Crane , Zongrong Liu
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/3185 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68359 , H01L2221/68377 , H01L2224/2919 , H01L2224/81801 , H01L2224/83851 , H01L2924/14 , H01L2924/1461 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).
摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。
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公开(公告)号：US20080303131A1
公开(公告)日：2008-12-11
申请号：US12124077
申请日：2008-05-20
申请人： Simon J.S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
发明人： Simon J.S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
IPC分类号： H01L23/02
CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
摘要翻译： 在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。 在一些实施例中，导电迹线由导电聚合物形成。 提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。
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公开(公告)号：US08704379B2
公开(公告)日：2014-04-22
申请号：US12199080
申请日：2008-08-27
申请人： Scott Jay Crane , Simon J. S. McElrea , Scott McGrath , Weiping Pan , DeAnn Eileen Melcher , Marc E. Robinson
发明人： Scott Jay Crane , Simon J. S. McElrea , Scott McGrath , Weiping Pan , DeAnn Eileen Melcher , Marc E. Robinson
IPC分类号： H01L23/48
CPC分类号： H01L24/83 , H01L23/293 , H01L23/3171 , H01L23/3185 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L25/0657 , H01L2224/24145 , H01L2224/24146 , H01L2224/27452 , H01L2224/29005 , H01L2224/29006 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2225/0651 , H01L2225/06524 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2924/00012
摘要： A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a conformal coating between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on either or both a die attach area of a surface of the die, or a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.
摘要翻译： 半导体管芯上的保形涂层提供了管芯和支撑件之间的粘附。 不需要额外的粘合剂将模具固定在支撑件上。 共形涂层在组装期间保护模具，并且用于使模具与模具可接触的导电部件电绝缘。 保形涂层可以是有机聚合物，例如聚对二甲苯。 此外，将模具粘附到可任选地是另一个模具的支撑件上的方法包括在模具和支撑件之间提供共形涂层，以及加热模具和支撑件之间的涂层。 保形涂层可以设置在模具表面的芯片附接区域或支撑体表面的模具安装区域中的任一个或两者上; 并且可以在将模具放置在支撑件上之后提供保形涂层。
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公开(公告)号：US20090065916A1
公开(公告)日：2009-03-12
申请号：US12199080
申请日：2008-08-27
申请人： Scott Jay Crane , Simon J.S. McElrea , Scott McGrath , Weiping Pan , De Ann Melcher , Marc E. Robinson
发明人： Scott Jay Crane , Simon J.S. McElrea , Scott McGrath , Weiping Pan , De Ann Melcher , Marc E. Robinson
CPC分类号： H01L24/83 , H01L23/293 , H01L23/3171 , H01L23/3185 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L25/0657 , H01L2224/24145 , H01L2224/24146 , H01L2224/27452 , H01L2224/29005 , H01L2224/29006 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2225/0651 , H01L2225/06524 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2924/00012
摘要： A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.
摘要翻译： 半导体管芯上的保形涂层提供了管芯和支撑件之间的粘附。 不需要额外的粘合剂将模具固定在支撑件上。 共形涂层在组装期间保护模具，并且用于使模具与模具可接触的导电部件电绝缘。 保形涂层可以是有机聚合物，例如聚对二甲苯。 此外，将模具粘附到可任选地是另一个模具的支撑件上的方法包括在模具和支撑件之间提供共形的涂层，以及加热模具和支撑件之间的涂层。 保形涂层可以设置在模具的表面的芯片附着区域上，或在支撑体的表面的模具安装区域上，或者在模具的表面的芯片附着区域上以及模具安装区域 的支撑体的表面; 并且可以在将模具放置在支撑件上之后提供保形涂层。
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公开(公告)号：US08629543B2
公开(公告)日：2014-01-14
申请号：US12913604
申请日：2010-10-27
申请人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
发明人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
IPC分类号： H01L23/02
CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
摘要翻译： 在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。 在一些实施例中，导电迹线由导电聚合物形成。 提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。
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公开(公告)号：US08723332B2
公开(公告)日：2014-05-13
申请号：US12124077
申请日：2008-05-20
申请人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
发明人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
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公开(公告)号：US20110037159A1
公开(公告)日：2011-02-17
申请号：US12913604
申请日：2010-10-27
申请人： Simon J. S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
发明人： Simon J. S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
IPC分类号： H01L23/52
CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
摘要翻译： 在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。 在一些实施例中，导电迹线由导电聚合物形成。 提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。
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