公开(公告)号：US20080315434A1

公开(公告)日：2008-12-25

申请号：US12142589

申请日：2008-06-19

申请人： Simon J.S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, JR. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

发明人： Simon J.S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, JR. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

IPC分类号： H01L21/304 ,  H01L23/488

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3185 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).

摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。

公开(公告)号：US07923349B2

公开(公告)日：2011-04-12

申请号：US12142589

申请日：2008-06-19

申请人： Simon J. S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, Jr. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

发明人： Simon J. S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, Jr. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

IPC分类号： H01L21/46 ,  H01L21/78 ,  H01L21/301

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3185 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).

摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。

公开(公告)号：US20110147943A1

公开(公告)日：2011-06-23

申请号：US13041192

申请日：2011-03-04

申请人： Simon J. S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, JR. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

发明人： Simon J. S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, JR. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

IPC分类号： H01L23/48 ,  H01L21/78

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3185 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).

摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。

公开(公告)号：US08324081B2

公开(公告)日：2012-12-04

申请号：US13041192

申请日：2011-03-04

申请人： Simon J. S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, Jr. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

发明人： Simon J. S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, Jr. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

IPC分类号： H01L21/46 ,  H01L21/78 ,  H01L21/301

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3185 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).

摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。

公开(公告)号：US20080315407A1

公开(公告)日：2008-12-25

申请号：US12143157

申请日：2008-06-20

申请人： Lawrence Douglas Andrews, JR. ,  Simon J.S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  Yong Du

发明人： Lawrence Douglas Andrews, JR. ,  Simon J.S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  Yong Du

IPC分类号： H01L23/482 ,  G01R31/26 ,  H01L21/50 ,  H01L23/00

CPC分类号： G01R1/0483 ,  H01L24/02 ,  H01L24/16 ,  H01L24/31 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/24145 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2224/03

摘要： Stackable integrated circuit devices include an integrated circuit die having interconnect pads on an active (front) side, the die having a front side edge at the conjunction of the front side of the die and a sidewall of the die, and a back side edge at the conjunction of back side of the die and the sidewall; the die further includes a conductive trace which is electrically connected to an interconnect pad and which extends over the front side edge of the die. In some embodiments the conductive trace further extends over the sidewall, and, in some such embodiments the conductive trace further extends over the back side edge of the die, and in some such embodiments the conductive trace further extends over the back side of the die. One or both of the die edges may be chamfered. Also, methods for making such a device. Also, assemblies including such a device electrically interconnected to underlying circuitry (e.g., die-to-substrate); and assemblies including a stack of at least two such devices interconnected die-to-die, or such a stack of devices electrically interconnected to underlying circuitry. Also, apparatus and methods for testing such a die.

摘要翻译： 可堆叠集成电路器件包括具有在有源（正面）侧上的互连焊盘的集成电路管芯，该管芯具有在管芯的前侧和管芯侧壁的连接处的前侧边缘， 模具的背面与侧壁的结合; 芯片还包括电连接到互连焊盘并且在模具的前侧边缘上延伸的导电迹线。 在一些实施例中，导电迹线还在侧壁上延伸，并且在一些这样的实施例中，导电迹线还在模具的背侧边缘上延伸，并且在一些这样的实施例中，导电迹线还在模具的背面延伸。 一个或两个模边可被倒角。 另外，制造这种装置的方法。 而且，包括这样的器件的组件电连接到底层电路（例如，裸片到衬底）; 以及包括至少两个这样的设备的堆叠的组件，这些设备互相连接到管芯上，或者这样一组电器互连到下面的电路。 另外，用于测试这种模具的装置和方法。

公开(公告)号：US20090102038A1

公开(公告)日：2009-04-23

申请号：US12251624

申请日：2008-10-15

申请人： SIMON J.S. MCELREA ,  Marc E. Robinson ,  Lawrence Douglas Andrews, JR. ,  Terrence Caskey ,  Scott McGrath ,  Yong Du ,  Al Vindasius

发明人： SIMON J.S. MCELREA ,  Marc E. Robinson ,  Lawrence Douglas Andrews, JR. ,  Terrence Caskey ,  Scott McGrath ,  Yong Du ,  Al Vindasius

IPC分类号： H01L23/488 ,  H01L21/02

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06572

摘要： A die prepared for stacking in a chip scale stacked die assembly, having interconnect sites in an area inward from a die edge and interconnect pads near at least one die edge. Second-level interconnection of the stacked die assembly can be made by way of connections between a first die in the assembly and circuitry on a support; and interconnection between die in the stack can be made by way of connection of z-interconnects with bonds pads in the die attach side of the support near or at one or more die edges. Methods for preparing the die include processes carried out to an advanced stage at the wafer level or at the die array level.

摘要翻译： 准备用于堆叠在芯片级堆叠管芯组件中的管芯，其具有从管芯边缘向内的区域中的互连位置和在至少一个管芯边缘附近的互连焊盘。 可以通过组件中的第一管芯和支撑件上的电路之间的连接来进行堆叠管芯组件的二次互连; 并且堆叠中的管芯之间的互连可以通过z-互连与在支撑件的管芯附接侧中的接合焊盘附近或在一个或多个管芯边缘处的连接来进行。 用于制备模具的方法包括在晶片级或模具阵列级进行到高级阶段的工艺。

公开(公告)号：US20080224279A1

公开(公告)日：2008-09-18

申请号：US12046651

申请日：2008-03-12

申请人： Terrence Caskey ,  Lawrence Douglas Andrews ,  Scott McGrath ,  Simon J.S. McElrea ,  Yong Du ,  Mark Scott

发明人： Terrence Caskey ,  Lawrence Douglas Andrews ,  Scott McGrath ,  Simon J.S. McElrea ,  Yong Du ,  Mark Scott

IPC分类号： H01L23/495 ,  H01L23/488 ,  H01L21/60

CPC分类号： H01L23/49811 ,  H01L24/01 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/80 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/45014 ,  H01L2224/48229 ,  H01L2224/731 ,  H01L2224/8312 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2225/06551 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45015 ,  H01L2924/207

摘要： A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically interconnecting a die to a support includes providing a support having interconnect pedestals formed at bond pads on the die mount surface of the support, providing a die having interconnect terminals projecting beyond a die edge, positioning the die in relation to the support such that the terminals are aligned with the corresponding pedestals, and moving the die and the support toward one another so that the terminals contact the respective pedestals.

摘要翻译： 模具组件包括安装到支撑件的模具，其中支撑件具有形成在接合焊盘处的互连基座，并且模具具有突出超过模具边缘的相互连接端子到相应的基座。 另外，支架具有互连基座。 此外，用于将管芯电连接到支撑件的方法包括提供支撑件，其具有形成在支撑件的管芯安装表面上的接合焊盘处的互连基座，提供具有突出超过模具边缘的互连端子的管芯，将管芯相对于 所述支撑件使得端子与相应的基座对准，并且使模具和支撑件朝向彼此移动，使得端子与相应的基座接触。

公开(公告)号：US08742602B2

公开(公告)日：2014-06-03

申请号：US12046651

申请日：2008-03-12

申请人： Terrence Caskey ,  Lawrence Douglas Andrews, Jr. ,  Scott McGrath ,  Simon J. S. McElrea ,  Yong Du ,  Mark Scott

发明人： Terrence Caskey ,  Lawrence Douglas Andrews, Jr. ,  Scott McGrath ,  Simon J. S. McElrea ,  Yong Du ,  Mark Scott

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49811 ,  H01L24/01 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/80 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/45014 ,  H01L2224/48229 ,  H01L2224/731 ,  H01L2224/8312 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2225/06551 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45015 ,  H01L2924/207

摘要： A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically interconnecting a die to a support includes providing a support having interconnect pedestals formed at bond pads on the die mount surface of the support, providing a die having interconnect terminals projecting beyond a die edge, positioning the die in relation to the support such that the terminals are aligned with the corresponding pedestals, and moving the die and the support toward one another so that the terminals contact the respective pedestals.

摘要翻译： 模具组件包括安装到支撑件的模具，其中支撑件具有形成在接合焊盘处的互连基座，并且模具具有突出超过模具边缘的相互连接端子到相应的基座。 另外，支架具有互连基座。 此外，用于将管芯电连接到支撑件的方法包括提供支撑件，其具有形成在支撑件的管芯安装表面上的接合焊盘处的互连基座，提供具有突出超过模具边缘的互连端子的管芯，将管芯相对于 所述支撑件使得端子与相应的基座对准，并且使模具和支撑件朝向彼此移动，使得端子与相应的基座接触。

公开(公告)号：US20100099145A1

公开(公告)日：2010-04-22

申请号：US12555742

申请日：2009-09-08

申请人： Haitao WANG ,  Chungsheng Mao ,  Jizhi Li ,  Jing XU ,  Rui ZHANG ,  Ling Wang ,  Yong Du ,  Longbin LIU

发明人： Haitao WANG ,  Chungsheng Mao ,  Jizhi Li ,  Jing XU ,  Rui ZHANG ,  Ling Wang ,  Yong Du ,  Longbin LIU

IPC分类号： C12P21/00 ,  C07H21/04 ,  C12N5/16

CPC分类号： C07K14/505 ,  A61K9/0019 ,  A61K38/00 ,  A61K47/6811 ,  C07K2317/53 ,  C07K2319/30

摘要： A recombinant fusion protein comprising a human erythropoietin peptide portion linked to an immunoglobulin peptide portion is described. The fusion protein has a prolonged half-life in vivo in comparison to naturally occurring or recombinant native human erythropoietin. In one embodiment of the invention, the protein has a half-life in vivo at least three fold higher than native human erythropoietin. The fusion protein also exhibits enhanced erythropoietic bioactivity in comparison to native human erythropoietin. In one embodiment, the fusion protein comprises the complete peptide sequence of a human erythropoietin (EPO) molecule and the peptide sequence of an Fc fragment of human immunoglobulin IgG1. The Fc fragment in the fusion protein includes the hinge region, CH2 and CH3 domains of human immunoglobulin IgG1. The EPO molecule may be linked directly to the Fc fragment to avoid extraneous peptide linkers and lessen the risk of an immunogenic response when administered in vivo. In one embodiment the hinge region is a human Fc fragment variant having a non-cysteine residue at amino acid 6. The invention also relates to nucleic acid and amino acid sequences encoding the fusion protein and transfected cell lines and methods for producing the fusion protein. The invention further includes pharmaceutical compositions comprising the fusion protein and methods of using the fusion protein and/or the pharmaceutical compositions, for example to stimulate erythropoiesis in subjects in need of therapy.

公开(公告)号：US07163839B2

公开(公告)日：2007-01-16

申请号：US11116571

申请日：2005-04-27

申请人： John Yan ,  Yong Du ,  Bruce E. Symons

发明人： John Yan ,  Yong Du ,  Bruce E. Symons

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A multi-chip module and a method for manufacturing the multi-chip module. A first semiconductor chip is mounted to a support substrate and a second semiconductor chip is mounted to the first semiconductor chip. The second semiconductor chip has a smaller dimension than the first semiconductor chip. A spacer is coupled to the second semiconductor chip. Bonding pads on the first and second semiconductor chips are wirebonded to bonding pads on the support substrate. A third semiconductor chip is mounted to the spacer and bonding pads on the third semiconductor chip are wirebonded to bonding pads on the support substrate.

摘要翻译： 一种多芯片模块及其制造方法。 第一半导体芯片安装在支撑基板上，第二半导体芯片安装在第一半导体芯片上。 第二半导体芯片的尺寸比第一半导体芯片小。 间隔件耦合到第二半导体芯片。 第一和第二半导体芯片上的接合焊盘被引线键合到支撑衬底上的接合焊盘。 第三半导体芯片安装到间隔件上，并且第三半导体芯片上的接合焊盘被引线接合到支撑衬底上的接合焊盘。