公开(公告)号：US20080303131A1

公开(公告)日：2008-12-11

申请号：US12124077

申请日：2008-05-20

申请人： Simon J.S. McElrea ,  Lawrence Douglas Andrews, JR. ,  Scott McGrath ,  Terrence Caskey ,  Scott Jay Crane ,  Marc E. Robinson ,  Loreto Cantillep

发明人： Simon J.S. McElrea ,  Lawrence Douglas Andrews, JR. ,  Scott McGrath ,  Terrence Caskey ,  Scott Jay Crane ,  Marc E. Robinson ,  Loreto Cantillep

IPC分类号： H01L23/02

CPC分类号： H01L25/50 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24011 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48465 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

摘要翻译： 在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。 在一些实施例中，导电迹线由导电聚合物形成。 提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。

公开(公告)号：US08629543B2

公开(公告)日：2014-01-14

申请号：US12913604

申请日：2010-10-27

申请人： Simon J. S. McElrea ,  Lawrence Douglas Andrews, Jr. ,  Scott McGrath ,  Terrence Caskey ,  Scott Jay Crane ,  Marc E. Robinson ,  Loreto Cantillep

发明人： Simon J. S. McElrea ,  Lawrence Douglas Andrews, Jr. ,  Scott McGrath ,  Terrence Caskey ,  Scott Jay Crane ,  Marc E. Robinson ,  Loreto Cantillep

IPC分类号： H01L23/02

CPC分类号： H01L25/50 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24011 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48465 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

摘要翻译： 在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。 在一些实施例中，导电迹线由导电聚合物形成。 提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。

公开(公告)号：US08723332B2

公开(公告)日：2014-05-13

申请号：US12124077

申请日：2008-05-20

申请人： Simon J. S. McElrea ,  Lawrence Douglas Andrews, Jr. ,  Scott McGrath ,  Terrence Caskey ,  Scott Jay Crane ,  Marc E. Robinson ,  Loreto Cantillep

发明人： Simon J. S. McElrea ,  Lawrence Douglas Andrews, Jr. ,  Scott McGrath ,  Terrence Caskey ,  Scott Jay Crane ,  Marc E. Robinson ,  Loreto Cantillep

IPC分类号： H01L23/48

CPC分类号： H01L25/50 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24011 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48465 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

公开(公告)号：US20110037159A1

公开(公告)日：2011-02-17

申请号：US12913604

申请日：2010-10-27

申请人： Simon J. S. McElrea ,  Lawrence Douglas Andrews, JR. ,  Scott McGrath ,  Terrence Caskey ,  Scott Jay Crane ,  Marc E. Robinson ,  Loreto Cantillep

发明人： Simon J. S. McElrea ,  Lawrence Douglas Andrews, JR. ,  Scott McGrath ,  Terrence Caskey ,  Scott Jay Crane ,  Marc E. Robinson ,  Loreto Cantillep

IPC分类号： H01L23/52

CPC分类号： H01L25/50 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24011 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48465 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

摘要翻译： 在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。 在一些实施例中，导电迹线由导电聚合物形成。 提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。

公开(公告)号：US20080315434A1

公开(公告)日：2008-12-25

申请号：US12142589

申请日：2008-06-19

申请人： Simon J.S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, JR. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

发明人： Simon J.S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, JR. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

IPC分类号： H01L21/304 ,  H01L23/488

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3185 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).

摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。

公开(公告)号：US20090102038A1

公开(公告)日：2009-04-23

申请号：US12251624

申请日：2008-10-15

申请人： SIMON J.S. MCELREA ,  Marc E. Robinson ,  Lawrence Douglas Andrews, JR. ,  Terrence Caskey ,  Scott McGrath ,  Yong Du ,  Al Vindasius

发明人： SIMON J.S. MCELREA ,  Marc E. Robinson ,  Lawrence Douglas Andrews, JR. ,  Terrence Caskey ,  Scott McGrath ,  Yong Du ,  Al Vindasius

IPC分类号： H01L23/488 ,  H01L21/02

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06572

摘要： A die prepared for stacking in a chip scale stacked die assembly, having interconnect sites in an area inward from a die edge and interconnect pads near at least one die edge. Second-level interconnection of the stacked die assembly can be made by way of connections between a first die in the assembly and circuitry on a support; and interconnection between die in the stack can be made by way of connection of z-interconnects with bonds pads in the die attach side of the support near or at one or more die edges. Methods for preparing the die include processes carried out to an advanced stage at the wafer level or at the die array level.

摘要翻译： 准备用于堆叠在芯片级堆叠管芯组件中的管芯，其具有从管芯边缘向内的区域中的互连位置和在至少一个管芯边缘附近的互连焊盘。 可以通过组件中的第一管芯和支撑件上的电路之间的连接来进行堆叠管芯组件的二次互连; 并且堆叠中的管芯之间的互连可以通过z-互连与在支撑件的管芯附接侧中的接合焊盘附近或在一个或多个管芯边缘处的连接来进行。 用于制备模具的方法包括在晶片级或模具阵列级进行到高级阶段的工艺。

公开(公告)号：US20090068790A1

公开(公告)日：2009-03-12

申请号：US12124097

申请日：2008-05-20

申请人： Terrence Caskey ,  Lawrence Douglas Andrews, JR. ,  Simon J.S. McElrea ,  Scott McGrath ,  Jeffrey S. Leal

发明人： Terrence Caskey ,  Lawrence Douglas Andrews, JR. ,  Simon J.S. McElrea ,  Scott McGrath ,  Jeffrey S. Leal

IPC分类号： H01L21/60 ,  H01L21/44

CPC分类号： H05K3/321 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/244 ,  H01L2224/24998 ,  H01L2224/32145 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K2203/0126 ,  H01L2224/82

摘要： Methods for depositing interconnect material at a target for electrical interconnection include pulsed dispense of the material. In some embodiments droplets of interconnect material are deposited in a projectile fashion. In some embodiments the droplets are shaped by movement of the deposition tool following a deposition pulse and prior to separation of the droplet mass from the tool.

摘要翻译： 用于在用于电互连的靶上沉积互连材料的方法包括材料的脉冲分配。 在一些实施例中，互连材料的液滴以抛射体的方式沉积。 在一些实施例中，液滴通过沉积工具的运动在沉积脉冲之后并且在将液滴质量与工具分离之前成形。

公开(公告)号：US20080315407A1

公开(公告)日：2008-12-25

申请号：US12143157

申请日：2008-06-20

申请人： Lawrence Douglas Andrews, JR. ,  Simon J.S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  Yong Du

发明人： Lawrence Douglas Andrews, JR. ,  Simon J.S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  Yong Du

IPC分类号： H01L23/482 ,  G01R31/26 ,  H01L21/50 ,  H01L23/00

CPC分类号： G01R1/0483 ,  H01L24/02 ,  H01L24/16 ,  H01L24/31 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/24145 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2224/03

摘要： Stackable integrated circuit devices include an integrated circuit die having interconnect pads on an active (front) side, the die having a front side edge at the conjunction of the front side of the die and a sidewall of the die, and a back side edge at the conjunction of back side of the die and the sidewall; the die further includes a conductive trace which is electrically connected to an interconnect pad and which extends over the front side edge of the die. In some embodiments the conductive trace further extends over the sidewall, and, in some such embodiments the conductive trace further extends over the back side edge of the die, and in some such embodiments the conductive trace further extends over the back side of the die. One or both of the die edges may be chamfered. Also, methods for making such a device. Also, assemblies including such a device electrically interconnected to underlying circuitry (e.g., die-to-substrate); and assemblies including a stack of at least two such devices interconnected die-to-die, or such a stack of devices electrically interconnected to underlying circuitry. Also, apparatus and methods for testing such a die.

摘要翻译： 可堆叠集成电路器件包括具有在有源（正面）侧上的互连焊盘的集成电路管芯，该管芯具有在管芯的前侧和管芯侧壁的连接处的前侧边缘， 模具的背面与侧壁的结合; 芯片还包括电连接到互连焊盘并且在模具的前侧边缘上延伸的导电迹线。 在一些实施例中，导电迹线还在侧壁上延伸，并且在一些这样的实施例中，导电迹线还在模具的背侧边缘上延伸，并且在一些这样的实施例中，导电迹线还在模具的背面延伸。 一个或两个模边可被倒角。 另外，制造这种装置的方法。 而且，包括这样的器件的组件电连接到底层电路（例如，裸片到衬底）; 以及包括至少两个这样的设备的堆叠的组件，这些设备互相连接到管芯上，或者这样一组电器互连到下面的电路。 另外，用于测试这种模具的装置和方法。

公开(公告)号：US20090065916A1

公开(公告)日：2009-03-12

申请号：US12199080

申请日：2008-08-27

申请人： Scott Jay Crane ,  Simon J.S. McElrea ,  Scott McGrath ,  Weiping Pan ,  De Ann Melcher ,  Marc E. Robinson

发明人： Scott Jay Crane ,  Simon J.S. McElrea ,  Scott McGrath ,  Weiping Pan ,  De Ann Melcher ,  Marc E. Robinson

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L24/83 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/27452 ,  H01L2224/29005 ,  H01L2224/29006 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

摘要： A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

摘要翻译： 半导体管芯上的保形涂层提供了管芯和支撑件之间的粘附。 不需要额外的粘合剂将模具固定在支撑件上。 共形涂层在组装期间保护模具，并且用于使模具与模具可接触的导电部件电绝缘。 保形涂层可以是有机聚合物，例如聚对二甲苯。 此外，将模具粘附到可任选地是另一个模具的支撑件上的方法包括在模具和支撑件之间提供共形的涂层，以及加热模具和支撑件之间的涂层。 保形涂层可以设置在模具的表面的芯片附着区域上，或在支撑体的表面的模具安装区域上，或者在模具的表面的芯片附着区域上以及模具安装区域 的支撑体的表面; 并且可以在将模具放置在支撑件上之后提供保形涂层。

公开(公告)号：US07923349B2

公开(公告)日：2011-04-12

申请号：US12142589

申请日：2008-06-19

申请人： Simon J. S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, Jr. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

发明人： Simon J. S. McElrea ,  Terrence Caskey ,  Scott McGrath ,  DeAnn Eileen Melcher ,  Reynaldo Co ,  Lawrence Douglas Andrews, Jr. ,  Weiping Pan ,  Grant Villavicencio ,  Yong Du ,  Scott Jay Crane ,  Zongrong Liu

IPC分类号： H01L21/46 ,  H01L21/78 ,  H01L21/301

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3185 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).

摘要翻译： 至少在晶片加工过程中至少施加电绝缘保形涂层至模具的活性（前）侧和一个或多个侧壁。 此外，模具具有至少施加到活性（前）侧和侧壁的电绝缘保形涂层。 此外，组件包括这种模具的叠层，电互连的模 - 芯; 并且组件包括这种管芯或这种管芯的堆叠，电连接到下面的电路（例如在基板或电路板中）。