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    High reflective board or substrate for LEDs
    1.
    发明授权
    High reflective board or substrate for LEDs 有权
    高反射板或LED基板

    公开(公告)号：US09105824B2

    公开(公告)日：2015-08-11

    申请号：US13370696

    申请日：2012-02-10

    申请人： Sten Heikman ,  Zhimin Jamie Yao ,  James Ibbetson ,  Fan Zhang

    发明人： Sten Heikman ,  Zhimin Jamie Yao ,  James Ibbetson ,  Fan Zhang

    IPC分类号： H01L33/46 ,  H01L33/60 ,  H01L33/54 ,  H01L33/62

    CPC分类号： H01L33/60 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Light emitting devices and methods are disclosed that provide improved light output. The devices have an LED mounted to a substrate, board or submount characterized by improved reflectivity, which reduces the absorption of LED light. This increases the amount of light that can emit from the LED device. The LED devices also exhibit improved emission characteristics by having a reflective coating on the submount that is substantially non-yellowing. One embodiment of a light emitting device according to the present invention comprises a submount having a circuit layer. A reflective coating is included between at least some of the elements of the circuit layer. A light emitting diode mounted to the circuit layer, the reflective coating being reflective to the light emitted by the light emitting diode. In some embodiments, the reflective coating comprises a carrier with scattering particles having a different index of refraction than said carrier material.

    摘要翻译： 公开了提供改进的光输出的发光器件和方法。 这些装置具有安装到基板，板或基座的LED，其特征在于改进的反射率，这降低了LED光的吸收。 这增加了可从LED器件发射的光量。 LED器件还通过在基座上具有基本不变黄的反射涂层来显示出改进的发射特性。 根据本发明的发光器件的一个实施例包括具有电路层的基座。 反射涂层包括在电路层的至少一些元件之间。 安装到电路层的发光二极管，反射涂层对由发光二极管发出的光反射。 在一些实施例中，反射涂层包括具有与所述载体材料不同的折射率的散射颗粒的载体。

    WHITE-EMITTING LED CHIPS AND METHOD FOR MAKING SAME
    5.
    发明申请
    WHITE-EMITTING LED CHIPS AND METHOD FOR MAKING SAME 有权
    白色发光LED灯及其制作方法

    公开(公告)号：US20110266560A1

    公开(公告)日：2011-11-03

    申请号：US12771938

    申请日：2010-04-30

    申请人： Zhimin Jamie Yao ,  James Ibbetson

    发明人： Zhimin Jamie Yao ,  James Ibbetson

    IPC分类号： H01L33/48 ,  H01L33/00

    CPC分类号： H01L33/50 ,  H01L33/0079 ,  H01L33/12 ,  H01L33/22 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/16

    摘要： Methods and devices for light emitting diode (LED) chips are provided. In one embodiment of a method, a pre-formed capping wafer is provided, with the capping wafer comprising a conversion material. A wire-bond free LED wafer is fabricated comprising a plurality of LEDs. The capping wafer is bonded to the LED wafer using an adhesive. The LED chips are later singulated upon completion of all final fabrication steps. The capping wafer provides a robust mechanical support for the LED chips during fabrication, which improves the strength of the chips during fabrication. Additionally, the capping wafer may comprise an integrated conversion material, which simplifies the fabrication process. In one possible embodiment for an LED chip wafer, a submount wafer is provided, along with a plurality of LEDs flip-chip mounted on the submount wafer. Additionally, a capping wafer is bonded to the LEDs using an adhesive, and the capping wafer comprises a conversion material. At least some of the light emitted from the LEDs passes through the capping wafer where at least some of the light is converted by the conversion material.

    摘要翻译： 提供了用于发光二极管（LED）芯片的方法和装置。 在一种方法的一个实施例中，提供预成形的封盖晶片，封盖晶片包括转换材料。 制造包括多个LED的无引线接合LED晶片。 封盖晶片使用粘合剂结合到LED晶片。 在完成所有最终制造步骤后，LED芯片随后被分割。 封装晶片在制造期间为LED芯片提供了坚固的机械支撑，这在制造过程中提高了芯片的强度。 另外，封盖晶片可以包括集成转换材料，这简化了制造工艺。 在用于LED芯片晶片的一个可能的实施例中，提供了一个底座晶片以及安装在底座晶片上的多个LED倒装芯片。 此外，使用粘合剂将封盖晶片结合到LED，并且封盖晶片包括转换材料。 从LED发射的至少一些光通过封盖晶片，其中至少一些光被转换材料转化。

    White-emitting LED chips and method for making same
    7.
    发明授权
    White-emitting LED chips and method for making same 有权
    白光LED芯片及其制造方法

    公开(公告)号：US08329482B2

    公开(公告)日：2012-12-11

    申请号：US12771938

    申请日：2010-04-30

    申请人： Zhimin Jamie Yao ,  James Ibbetson

    发明人： Zhimin Jamie Yao ,  James Ibbetson

    IPC分类号： H01L21/00

    CPC分类号： H01L33/50 ,  H01L33/0079 ,  H01L33/12 ,  H01L33/22 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/16

    摘要： Methods and devices for light emitting diode (LED) chips are provided. In one embodiment of a method, a pre-formed capping wafer is provided, with the capping wafer comprising a conversion material. A wire-bond free LED wafer is fabricated comprising a plurality of LEDs. The capping wafer is bonded to the LED wafer using an adhesive. The LED chips are later singulated upon completion of all final fabrication steps. The capping wafer provides a robust mechanical support for the LED chips during fabrication, which improves the strength of the chips during fabrication. Additionally, the capping wafer may comprise an integrated conversion material, which simplifies the fabrication process. In one possible embodiment for an LED chip wafer, a submount wafer is provided, along with a plurality of LEDs flip-chip mounted on the submount wafer. Additionally, a capping wafer is bonded to the LEDs using an adhesive, and the capping wafer comprises a conversion material. At least some of the light emitted from the LEDs passes through the capping wafer where at least some of the light is converted by the conversion material.

    摘要翻译： 提供了用于发光二极管（LED）芯片的方法和装置。 在一种方法的一个实施例中，提供预成形的封盖晶片，封盖晶片包括转换材料。 制造包括多个LED的无引线接合LED晶片。 封盖晶片使用粘合剂结合到LED晶片。 在完成所有最终制造步骤后，LED芯片随后被分割。 封装晶片在制造期间为LED芯片提供了坚固的机械支撑，这在制造过程中提高了芯片的强度。 另外，封盖晶片可以包括集成转换材料，这简化了制造工艺。 在用于LED芯片晶片的一个可能的实施例中，提供了一个底座晶片以及安装在底座晶片上的多个LED倒装芯片。 此外，使用粘合剂将封盖晶片结合到LED，并且封盖晶片包括转换材料。 从LED发射的至少一些光通过封盖晶片，其中至少一些光被转换材料转化。

    High voltage low current surface emitting LED
    8.
    发明授权
    High voltage low current surface emitting LED 有权
    高压低电流表面发光LED

    公开(公告)号：US08476668B2

    公开(公告)日：2013-07-02

    申请号：US12814241

    申请日：2010-06-11

    申请人： James Ibbetson ,  Sten Heikman

    发明人： James Ibbetson ,  Sten Heikman

    IPC分类号： H01L33/64 ,  H01L29/06

    CPC分类号： H01L25/0753 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An LED chip comprising a plurality of sub-LEDs on a submount. Electrically conductive and electrically insulating features are included that serially interconnect the sub-LEDs such that an electrical signal applied to the serially interconnected sub-LEDs along the electrically conductive features spreads to the serially interconnected sub-LEDs. A via is included that is arranged to electrically couple one of the sub-LEDs to the submount. The sub-LEDs can be interconnected by more than one of the conductive features, with each one of the conductive features capable of spreading an electrical signal between two of the sub-LEDs.

    摘要翻译： 一种LED芯片，包括在底座上的多个子LED。 包括导电和电绝缘特征，其将子LED串联连接，使得沿着导电特征施加到串联的子LED的电信号扩展到串联的子LED。 包括通孔，其布置成将子LED中的一个电耦合到基座。 子LED可以由多于一个的导电特征相互连接，其中每个导电特征能够在两个子LED之间扩展电信号。