-
公开(公告)号：US20080315409A1
公开(公告)日：2008-12-25
申请号：US11765055
申请日：2007-06-19
申请人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , H01L24/11 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2224/0401 , H01L2224/06183 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16137 , H01L2224/16238 , H01L2224/17183 , H01L2224/81005 , H01L2224/811 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81986 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30105 , H01L2924/3025 , H01L2924/3512 , H01L2924/00 , H01L2224/83851 , H01L2224/81
摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.
摘要翻译： 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。
-
公开(公告)号：US08237271B2
公开(公告)日：2012-08-07
申请号：US11765055
申请日：2007-06-19
申请人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , H01L24/11 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2224/0401 , H01L2224/06183 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16137 , H01L2224/16238 , H01L2224/17183 , H01L2224/81005 , H01L2224/811 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81986 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30105 , H01L2924/3025 , H01L2924/3512 , H01L2924/00 , H01L2224/83851 , H01L2224/81
摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.
摘要翻译： 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。
-
公开(公告)号：US20120187577A1
公开(公告)日：2012-07-26
申请号：US13439198
申请日：2012-04-04
申请人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L21/6835 , H01L24/11 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2224/0401 , H01L2224/06183 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16137 , H01L2224/16238 , H01L2224/17183 , H01L2224/81005 , H01L2224/811 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81986 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30105 , H01L2924/3025 , H01L2924/3512 , H01L2924/00 , H01L2224/83851 , H01L2224/81
摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.
摘要翻译： 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。
-
公开(公告)号：US08551816B2
公开(公告)日：2013-10-08
申请号：US13439198
申请日：2012-04-04
申请人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
发明人： Steven A. Cordes , Matthew J. Farinelli , Sherif A. Goma , Peter A. Gruber , John U. Knickerbocker , James L. Speidell
CPC分类号： H01L21/6835 , H01L24/11 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2224/0401 , H01L2224/06183 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/16137 , H01L2224/16238 , H01L2224/17183 , H01L2224/81005 , H01L2224/811 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/81986 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30105 , H01L2924/3025 , H01L2924/3512 , H01L2924/00 , H01L2224/83851 , H01L2224/81
摘要： The present invention allows for direct chip-to-chip connections using the shortest possible signal path.
摘要翻译： 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。
-
公开(公告)号：US20090008057A1
公开(公告)日：2009-01-08
申请号：US12189388
申请日：2008-08-11
CPC分类号： B23K3/0638 , B23K35/02 , B23K2101/40 , H01L2224/11
摘要： A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。 该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被放置成与非矩形模具基本接触。 旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。 将导电接合材料从填充头推向非矩形模具。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。
-
公开(公告)号：US20080272177A1
公开(公告)日：2008-11-06
申请号：US12173346
申请日：2008-07-15
IPC分类号： B23K37/06
CPC分类号： H05K3/3484 , B23K3/0607 , B23K2101/42 , H05K3/4038 , H05K2201/0305 , H05K2201/09472 , H05K2203/0126 , H05K2203/043 , H05K2203/0568
摘要： A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.
摘要翻译： 系统将焊料提供到电路支撑衬底中的空腔中。 该系统使填充头与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 焊料被迫从填充头朝向电路支撑基板。 焊料被提供到与填充头附近的至少一个空腔同时的至少一个空腔中。 系统使第二电路支撑衬底紧靠电路支撑衬底，第二电路支撑衬底上的至少一个接收衬垫基本上接触至少一个空腔的导电接合材料。
-
公开(公告)号：US07410090B2
公开(公告)日：2008-08-12
申请号：US11409244
申请日：2006-04-21
IPC分类号： B23K31/02
CPC分类号： H05K3/3484 , B23K3/0607 , B23K2101/42 , H05K3/4038 , H05K2201/0305 , H05K2201/09472 , H05K2203/0126 , H05K2203/043 , H05K2203/0568
摘要： A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 公开了一种在电路支撑衬底中的多个空腔中提供导电接合材料的系统，方法和装置。 该方法包括将填充头放置成与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 导电接合材料被迫从填充头朝向电路支撑基板排出。 所述导电接合材料被提供到与所述至少一个空腔同时的至少一个空腔中，所述至少一个空腔在所述填充头附近。
-
公开(公告)号：US07784673B2
公开(公告)日：2010-08-31
申请号：US12189388
申请日：2008-08-11
CPC分类号： B23K3/0638 , B23K35/02 , B23K2101/40 , H01L2224/11
摘要： A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 公开了一种用于将导电接合材料注射成非矩形模具中的多个空腔的系统和方法。 该方法包括将填充头与非矩形模具对准。 非矩形模具包括多个空腔。 填充头被放置成与非矩形模具基本接触。 旋转运动提供给非矩形模具和填充头中的至少一个，同时填充头基本上与非矩形模具接触。 将导电接合材料从填充头推向非矩形模具。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。
-
公开(公告)号：US07410092B2
公开(公告)日：2008-08-12
申请号：US11409233
申请日：2006-04-21
IPC分类号： B23K31/02
CPC分类号： B23K3/0638 , B23K1/20 , B23K2101/40 , H01L24/11 , H01L24/742 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。 该方法包括将填充头与表面对准。 模具包括多个空腔。 该方法还包括将填充头与表面实质接触。 至少第一气体围绕填充头的第一区域引导。 所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。 导电接合材料从表面压出填料头。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。
-
公开(公告)号：US07784664B2
公开(公告)日：2010-08-31
申请号：US12189822
申请日：2008-08-12
CPC分类号： B23K3/0638 , B23K1/20 , B23K2101/40 , H01L24/11 , H01L24/742 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译： 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。 该方法包括将填充头与表面对准。 模具包括多个空腔。 该方法还包括将填充头与表面实质接触。 至少第一气体围绕填充头的第一区域引导。 所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。 导电接合材料从表面压出填料头。 导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。
-
-
-
-
-
-
-
-
-
搜索结果
162 条记录 (耗时 0.059 秒)
