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    Integrated circuit chip packaging assembly
    1.
    发明授权
    Integrated circuit chip packaging assembly 有权
    集成电路芯片封装组装

    公开(公告)号：US07256482B2

    公开(公告)日：2007-08-14

    申请号：US10917036

    申请日：2004-08-12

    申请人： Steven Alfred Kummerl ,  Anthony L. Coyle ,  Bernhard Lange

    发明人： Steven Alfred Kummerl ,  Anthony L. Coyle ,  Bernhard Lange

    IPC分类号： H01L23/495 ,  H01L23/28 ,  H01L23/48

    CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.

    摘要翻译： 一种具有第一和第二封装侧的集成电路芯片封装组件。 集成电路芯片具有基板侧和有源电路侧。 芯片包括形成在有源电路侧的集成电路器件。 芯片的有源电路侧位于第一封装侧。 模片垫具有从其延伸的至少一个浇道构件，其可以朝着第一封装侧弯曲。 芯片的有源电路侧连接到管芯焊盘。 芯片焊盘相对于芯片在第一封装侧。 封装模具化合物形成在芯片焊盘，芯片的至少一部分和流道部件的至少一部分之上。 芯片的基板侧的至少一部分和/或流道部件的至少一部分可以不被封装模具化合物覆盖。

    Integrated circuit chip packaging assembly
    3.
    发明授权
    Integrated circuit chip packaging assembly 有权
    集成电路芯片封装组装

    公开(公告)号：US07488623B2

    公开(公告)日：2009-02-10

    申请号：US11774879

    申请日：2007-07-09

    申请人： Steven A Kummerl ,  Anthony L Coyle ,  Bernhard Lange

    发明人： Steven A Kummerl ,  Anthony L Coyle ,  Bernhard Lange

    IPC分类号： H01L21/00

    CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.

    摘要翻译： 一种具有第一和第二封装侧的集成电路芯片封装组件。 集成电路芯片具有基板侧和有源电路侧。 芯片包括形成在有源电路侧的集成电路器件。 芯片的有源电路侧位于第一封装侧。 模片垫具有从其延伸的至少一个浇道构件，其可以朝着第一封装侧弯曲。 芯片的有源电路侧连接到管芯焊盘。 芯片焊盘相对于芯片在第一封装侧。 封装模具化合物形成在芯片焊盘，芯片的至少一部分和流道部件的至少一部分之上。 芯片的基板侧的至少一部分和/或流道部件的至少一部分可以不被封装模具化合物覆盖。

    Pressure wave supercharger with vibration damped rotor
    5.
    发明授权
    Pressure wave supercharger with vibration damped rotor 失效
    压力波增压器带减振转子

    公开(公告)号：US4646704A

    公开(公告)日：1987-03-03

    申请号：US819384

    申请日：1986-01-16

    申请人： Hans-Joachim Gora ,  Bernhard Lange

    发明人： Hans-Joachim Gora ,  Bernhard Lange

    IPC分类号： F04F13/00 ,  F04F99/00 ,  F02B33/00

    CPC分类号： F04F13/00

    摘要： A pressure wave supercharger for internal combustion engines, particularly those in motor vehicles, has a rotor, driven in proportion to the engine speed, with a plurality of rotor cells oriented parallel to its axis of rotation. The cells are connected, at one end, in the exhaust gas flow between the exhaust manifold and the exhaust system and, at the other end, in the intake air stream between the air intake and the intake manifold. Placed on the rotor and concentric therewith is a rigid vibration damping ring, which is contacted by a support, firmly attached to the rotor, so as to create friction. The friction produced by sliding of the rigid ring on the support, acts to absorb a large part of the vibration energy of the rotor and thereby, correspondingly, to eliminate the production of annoying noise.

    摘要翻译： 用于内燃机的压力波增压器，特别是机动车辆的压力波增压器具有与发动机转速成比例地驱动的转子，多个转子电池平行于其旋转轴定向。 电池的一端连接在排气歧管和排气系统之间的排气流中，另一端连接在进气口和进气歧管之间的进气流中。 放置在转子上并与其同心的是刚性的减振环，其被支撑件接触，牢固地附接到转子上，以产生摩擦。 刚性环在支撑件上的滑动所产生的摩擦起到吸收转子的大部分振动能量的作用，从而相应地消除了烦人的噪音的产生。

    Integrated circuit package and method of manufacture thereof
    7.
    发明申请
    Integrated circuit package and method of manufacture thereof 审中-公开
    集成电路封装及其制造方法

    公开(公告)号：US20060192273A1

    公开(公告)日：2006-08-31

    申请号：US11066875

    申请日：2005-02-25

    申请人： Bernhard Lange ,  William Boyd

    发明人： Bernhard Lange ,  William Boyd

    IPC分类号： H01L23/48

    CPC分类号： H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： An integrated circuit (IC) package 100 comprises an IC 102 and leads 104 coupled to the IC. Each lead has a first end 106 configured to be coupled to the integrated circuit and a second end 108 configured to pass through one of a plurality of mounting holes 110 extending through a mounting board 112. The leads comprise at least one positioning lead 114 comprising a stop 118 being a continuous part of the positioning lead and having a lateral dimension 120 greater than a diameter 122 of a first hole 124 of the plurality of mounting holes. The leads further comprise at least one non-positioning lead 116 having a continuous uniformly shaped body 130 with a lateral dimension 132 less than a diameter 134 of a second hole 136 of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.

    摘要翻译： 集成电路（IC）封装100包括耦合到IC的IC 102和引线104。 每个引线具有被配置为耦合到集成电路的第一端106和被配置为穿过延伸穿过安装板112的多个安装孔110中的一个的第二端108。 引线包括至少一个定位引线114，定位引线114包括止动件118，该止动件118是定位引线的连续部分，并且具有大于多个安装孔中的第一孔124的直径122的横向尺寸120。 引线还包括至少一个非定位引线116，其具有连续均匀成形的主体130，其横向尺寸132小于多个安装孔中的第二孔136的直径134。 停止限制非定位导线通过第二个孔的延伸。

    Heatslug to leadframe attachment
    9.
    发明申请
    Heatslug to leadframe attachment 审中-公开
    Heatslug到引线框附件

    公开(公告)号：US20060037995A1

    公开(公告)日：2006-02-23

    申请号：US10923654

    申请日：2004-08-20

    申请人： Bernhard Lange

    发明人： Bernhard Lange

    IPC分类号： B23K31/02

    CPC分类号： H01L23/4334 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/4882 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014

    摘要： A method for coupling a heat slug to a lead frame, comprising aligning a heat slug and a lead frame depositing a material between the heat slug and the lead frame, and clamping together the heat slug and the lead frame.

    摘要翻译： 一种用于将热塞连接到引线框架的方法，包括使散热块和引线框架对准，所述引线框架在所述热段和所述引线框架之间沉积材料，并将所述热芯块和所述引线框架夹在一起。