摘要:
A vertical GaN-based LED includes an n-type bonding pad; an n-electrode formed under the n-type bonding pad; a light-emitting structure formed by sequentially laminating an n-type GaN layer, an active layer, and a p-type GaN layer under the n-electrode; a p-electrode formed under the light-emitting structure; and a support layer formed under the p-electrode. The light-emitting structure has or or more trenches which are spaced at a predetermined distance with the n-electrode from the outermost side of the light-emitting structure and in which the active layer of the light-emitting structure is removed.
摘要:
The present invention relates to a vertically-structured nitride semiconductor light emitting diode. The vertically-structured nitride semiconductor light emitting diode includes an n-type electrode; an n-type nitride semiconductor layer that is formed on the lower surface of the n-type electrode and on which surface texturing with a diffraction grating structure is formed, the diffraction grating structure composed of more than one line; an active layer that is formed on the lower surface of the n-type nitride semiconductor layer; a p-type nitride semiconductor layer that is formed on the lower surface of the active layer; and a p-type electrode that is formed on the lower surface of the p-type nitride semiconductor layer.
摘要:
The present invention relates to a two-wavelength semiconductor laser device, more particularly, to a fabrication method of a multi-wavelength semiconductor laser device. In this method, a substrate having an upper surface separated into at least first and second areas is provided. Then, a first dielectric mask on the substrate is formed to expose only the first area. Then, epitaxial layers for a first semiconductor laser are grown on the first area of the substrate. Then, a second dielectric mask on the substrate is formed to expose only the second area. Then, epitaxial layers for a second semiconductor laser are grown on the second area of the substrate.
摘要:
A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED includes an n-electrode, a first n-type GaN layer, a first AlGaN layer, a GaN layer, a second AlGaN layer, a second n-type GaN layer, an active layer, a p-type GaN layer, and a structure support layer. The first n-type GaN layer has uneven patterns having a plurality of protuberances. The first AlGaN layer is formed under the first n-type GaN layer, and the GaN layer is formed under the first AlGaN layer. The active layer is formed under the second n-type GaN layer, and the p-type GaN layer is formed under the active layer. A p-electrode is formed under the p-type GaN layer, and the structure support layer is formed under the p-electrode.
摘要:
A vertical GaN-based LED includes: an n-electrode; a light-emitting structure in which an n-type GaN layer, an active layer, and a p-type GaN layer are sequentially formed under the n-electrode; a p-electrode formed under the light-emitting structure; a passivation layer formed to cover the side and bottom surfaces of the light-emitting structure and expose a predetermined portion of the p-electrode, the passivation layer being formed of a distributed Bragg reflector (DBR); a plating seed layer formed under the passivation layer and the p-electrode; and a support layer formed under the plating seed layer.
摘要:
A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED can prevent the damage of an n-type GaN layer contacting an n-type electrode, thereby stably securing the contact resistance of the n-electrode. The vertical GaN-based LED includes: a support layer; a p-electrode formed on the support layer; a p-type GaN layer formed on the p-electrode; an active layer formed on the p-type GaN layer; an n-type GaN layer for an n-type electrode contact, formed on the active layer; an etch stop layer formed on the n-type GaN layer to expose a portion of the n-type GaN layer; and an n-electrode formed on the n-type GaN layer exposed by the etch stop layer.
摘要:
Disclosed is a process for producing unsaturated aldehydes and/or unsaturated acids from olefins or alkanes in a fixed bed shell-and-tube heat exchanger-type reactor by catalytic vapor phase oxidation. A heat exchanger-type reactor for use in such a process is also disclosed. In the process, at least one of the first-step reaction zone and the second-step reaction zone is divided into two or more shell spaces by at least one partition; each of the divided shell spaces is independently heat-controlled; a heat transfer medium in the first shell space of the first-step reaction zone or the first shell space of the second-step reaction zone has a temperature ranging from the lowest active temperature of a catalyst layer packed in a reaction tube corresponding to the first shell space of the first-step reaction zone or the first shell space of the second-step reaction zone to [the lowest active temperature+20° C.], when referring to the two or more shell spaces corresponding to the first-step reaction zone sequentially as the first shell space of the first-step reaction zone, the second shell space of the first-step reaction zone, . . . , the nth shell space of the first-step reaction zone, and the two or more shell spaces corresponding to the second-step reaction zone sequentially as the first shell space of the second-step reaction zone, the second shell space of the second-step reaction zone, . . . , the nth shell space of the second-step reaction zone; and the first shell space of the first-step reaction zone or the first shell space of the second-step reaction zone is controlled in such a manner that the first shell space provides a reactant conversion contribution per length as defined in Equation 1 or 2 of 1.2˜2.5.
摘要:
Disclosed herein is a dental rescue implant implanted into an alveolar bone for forming a root of an artificial tooth. The dental rescue implant includes: a wide sectional body part having a sectional diameter of 6.5 mm to 8 mm, greater than a sectional diameter of 6 mm of a typical implant body part, whereby the wide sectional body part can be implanted directly into the corresponding alveolar bone without refilling a damaged part with a bone substitutive material when implant surgery ends in failure; and a wide screw thread formed on the outer periphery of the wide sectional body part, the wide screw thread being formed at 1˜1.75 pitch intervals, whereby the wide sectional body part is implanted into the alveolar bone with relatively small resistance. The implant can be directly implanted into the alveolar bone without refilling a damaged part with a substitutive material even though a molar teeth part is lost or implant surgery ends in a failure by complex factors.
摘要:
Disclosed herein is a nitride semiconductor light emitting device. The nitride semiconductor light emitting device comprises an n-type nitride semiconductor layer on a substrate, an active layer formed on the n-type nitride semiconductor layer so that a portion of the n-type nitride semiconductor layer is exposed, a p-type nitride semiconductor layer formed on the active layer, a high-concentration dopant area on the p-type nitride semiconductor layer, a counter doping area on the high-concentration dopant areas, an n-side electrode formed on an exposed portion of the n-type nitride semiconductor layer, and a p-side electrode formed on the counter doping area. A satisfactory ohmic contact for the p-side electrode is provided by an ion implantation process and heat treatment.
摘要:
Disclosed herein is a drill for operating implant which allows a user to easily check abrasion of a drill blade with naked eyes. The drill for operating implant includes: a drill body; a drill blade formed on the drill body for perforating an implantation place of the implant when the drill body is rotated; and, an abrasion discrimination part formed at least one of the drill body or the drill blade for allowing a user to discriminate abrasion of the drill blade.