公开(公告)号：US08310023B2

公开(公告)日：2012-11-13

申请号：US12360444

申请日：2009-01-27

申请人： Ho Joon Park ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

发明人： Ho Joon Park ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

IPC分类号： H01L23/52

CPC分类号： H01L33/641 ,  H01L33/46 ,  H01L2224/16225 ,  H01L2224/97

摘要： The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种LED封装及其制造方法。 本发明提供了一种LED封装，其包括基座硅基板和绝缘膜以及形成在基座硅基板上的电极图案。 LED封装还包括形成在电极图案上的具有通孔的间隔物。 LED封装还包括接收在通孔中的LED，与芯片接合的倒装芯片，以及附着到间隔物的上表面的光学元件。

公开(公告)号：US07816156B2

公开(公告)日：2010-10-19

申请号：US11882167

申请日：2007-07-31

申请人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

发明人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

IPC分类号： H01L29/22 ,  H01L23/498

CPC分类号： H01L33/641 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片接合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。

公开(公告)号：US07649208B2

公开(公告)日：2010-01-19

申请号：US11313508

申请日：2005-12-21

申请人： Sung Jun Lee ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sang Hyun Choi ,  Chang Hyun Lim

发明人： Sung Jun Lee ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sang Hyun Choi ,  Chang Hyun Lim

IPC分类号： H01L27/15

CPC分类号： H01L31/147 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2924/00014

摘要： The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.

摘要翻译： 本发明涉及一种包括光电二极管的LED封装。 LED封装包括硅衬底，并且在其上部形成光电二极管。 而且，除了光电二极管的光接收面积以外，在硅基板上形成绝缘层。 在LED封装中，在绝缘层上形成LED端子以连接到光电二极管。 第一和第二LED连接焊盘形成在绝缘层上，并布置在光电二极管的两侧。 此外，LED芯片安装在硅衬底上，并连接到第一和第二LED连接焊盘。

公开(公告)号：US20090137073A1

公开(公告)日：2009-05-28

申请号：US12360444

申请日：2009-01-27

申请人： Ho Joon PARK ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

发明人： Ho Joon PARK ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

IPC分类号： H01L33/00

CPC分类号： H01L33/641 ,  H01L33/46 ,  H01L2224/16225 ,  H01L2224/97

摘要： The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种LED封装及其制造方法。 本发明提供了一种LED封装，其包括基座硅基板和绝缘膜以及形成在基座硅基板上的电极图案。 LED封装还包括形成在电极图案上的具有通孔的间隔物。 LED封装还包括接收在通孔中的LED，与芯片连接的倒装芯片，以及附着到间隔物的上表面的光学元件。

公开(公告)号：US07326964B2

公开(公告)日：2008-02-05

申请号：US11312365

申请日：2005-12-21

申请人： Chang Hyun Lim ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Sang Hyun Choi

发明人： Chang Hyun Lim ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Sang Hyun Choi

IPC分类号： H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H02H3/20 ,  H02H9/04 ,  H02H3/00 ,  H02H7/00 ,  H02H9/02

CPC分类号： H01L33/62 ,  H01L24/17 ,  H01L25/167 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The LED package includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.

摘要翻译： 一种具有由静电力操作的MEMS开关的LED封装，能够连续地保护LED免受由静电放电引起的过大电流的影响。 LED封装包括其上形成有第一和第二电极图案的基座; 安装在所述基座上的LED，具有电连接到所述第一电极图案的n电极和与所述第二电极图案电连接的p电极; 以及包括第一导电板和第二导电板的MEMS开关，所述第一导电板和第二导电板被弯曲成具有与所述第一导电板上方并垂直分开的面积，其中所述第一和第二导电板电连接到所述第一和第二电极图案， 导电板通过施加高于预定电压电压的静电力与第一导电板接触。

公开(公告)号：US07262440B2

公开(公告)日：2007-08-28

申请号：US11320968

申请日：2005-12-30

申请人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

发明人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

IPC分类号： H01L29/22 ,  H01L23/498 ,  H01L21/00

CPC分类号： H01L33/641 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片接合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。

公开(公告)号：US07582496B2

公开(公告)日：2009-09-01

申请号：US11312412

申请日：2005-12-21

申请人： Sung Jun Lee ,  Woong Lin Hwang ,  Sang Hyun Choi ,  Chang Hyun Lim ,  Ho Joon Park ,  Seog Moon Choi

发明人： Sung Jun Lee ,  Woong Lin Hwang ,  Sang Hyun Choi ,  Chang Hyun Lim ,  Ho Joon Park ,  Seog Moon Choi

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.

摘要翻译： 提供了使用Si衬底的LED封装和LED封装的制造方法。 在LED封装中，支撑结构包括Si衬底和形成在Si衬底的顶表面和底表面上的绝缘层，并且支撑结构通过部分去除Si衬底和绝缘层而在底表面中限定至少一个凹槽 。 多个上电极形成在支撑结构的顶表面上。 至少一个LED安装在支撑结构的顶表面上，并且LED包括电连接到上电极的两个端子。 金属填料填充在支撑结构的底面中限定的槽中。

公开(公告)号：US07491978B2

公开(公告)日：2009-02-17

申请号：US11492754

申请日：2006-07-26

申请人： Alexander L'Vovich Zakgeym ,  Seog Moon Choi ,  Sung Jun Lee

发明人： Alexander L'Vovich Zakgeym ,  Seog Moon Choi ,  Sung Jun Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L2224/16

摘要： A light emitting diode package is provided. The light emitting diode package comprises a submount substrate which includes a mounting region having side walls inclined upwardly, first and second cavities formed around the mounting region, and first and second grooves extending between the mounting region and the first and second cavities on an upper surface of the submount. The package further comprises first and second bump pads formed on a bottom surface of the mounting surface, first and second bonding pads formed on a bottom surface of the first and second cavities, respectively, first and second conductive lines formed along a bottom surface of the first and second grooves for connecting the first and second bump pads to the first and second bonding pads, respectively, and a light emitting diode mounted on the mounting region so as to be connected to the first and second bump pads.

摘要翻译： 提供发光二极管封装。 发光二极管封装包括副安装座基板，其包括具有向上倾斜的侧壁的安装区域，围绕安装区域形成的第一和第二空腔，以及在安装区域与第一和第二空腔之间在上表面上延伸的第一和第二凹槽 的下层。 该封装还包括形成在安装表面的底表面上的第一和第二凸块焊盘，分别形成在第一和第二腔的底表面上的第一和第二焊盘，沿着第一和第二焊盘的底表面形成的第一和第二导电线 用于将第一和第二凸块焊盘分别连接到第一和第二接合焊盘的第一和第二凹槽以及安装在安装区域上以便连接到第一和第二凸块焊盘的发光二极管。

公开(公告)号：US09034258B2

公开(公告)日：2015-05-19

申请号：US13297556

申请日：2011-11-16

申请人： Sang Won Jeong ,  Eun Joo Kim ,  Hyun-Chul Kim ,  Se Geun Lee ,  Sung Jun Lee

发明人： Sang Won Jeong ,  Eun Joo Kim ,  Hyun-Chul Kim ,  Se Geun Lee ,  Sung Jun Lee

IPC分类号： G01N15/06 ,  G01N33/531 ,  G01N33/68

CPC分类号： G01N33/6872 ,  C07F9/117 ,  G01N33/531 ,  G01N33/6893 ,  G01N2333/4737 ,  G01N2600/00 ,  G01N2610/00 ,  Y10T436/11

摘要： The present disclosure relates to a molecularly imprinted structure for detection of a pentraxin protein and a method for preparing the same by synthesizing a reactive group-pentraxin protein ligand complex specifically reacting with the pentraxin protein and being polymerizable with a crosslink agent to detect a pentraxin protein by using the complex. The present disclosure also provides a chip for detection of a C-reactive protein and a method for preparing the same, the chip including a molecularly imprinted layer having excellent sensitivity to a C-reactive protein and an improved binding force to a metal substrate by using click chemistry.

摘要翻译： 本公开内容涉及用于检测五倍体蛋白的分子印迹结构及其制备方法，其通过合成与五倍体蛋白特异性反应的反应性基 - 五聚蛋白配体复合物，并与交联剂聚合以检测五倍体蛋白 通过使用复合体。 本公开还提供了用于检测C反应蛋白的芯片及其制备方法，该芯片包括对C-反应蛋白具有优异敏感性的分子印迹层和通过使用对金属底物的改善的结合力 点击化学。

公开(公告)号：US08973438B2

公开(公告)日：2015-03-10

申请号：US13275397

申请日：2011-10-18

申请人： Jong Woon Kim ,  Sung Jun Lee ,  Won Kyu Jeung ,  Min Kyu Choi ,  Heung Woo Park

发明人： Jong Woon Kim ,  Sung Jun Lee ,  Won Kyu Jeung ,  Min Kyu Choi ,  Heung Woo Park

IPC分类号： G01P1/02 ,  G01P15/12 ,  G01P15/09 ,  G01C19/5769 ,  G01C19/5755 ,  G01P15/08

CPC分类号： G01C25/00 ,  B32B37/0076 ,  B32B37/02 ,  B32B37/12 ,  B32B37/18 ,  B32B38/10 ,  B32B2457/00 ,  C23F1/02 ,  G01C19/5755 ,  G01C19/5769 ,  G01P15/08 ,  G01P15/0802 ,  G01P15/135 ,  G01P2015/084 ,  Y10T156/1064

摘要： Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130.

摘要翻译： 这里公开了惯性传感器及其制造方法。 根据本发明的优选实施例的惯性传感器100被构造成包括板状膜110，设置在膜110的中心部分113下方的质量体120，设置在膜110的边缘115下方的柱130 110，以支撑膜110，底盖150的边缘153设置有第一腔155，粘合剂140被引入到其中，其中粘合剂140将边缘153粘合到柱的底表面， 由此底盖150的边缘153设置有第一腔155以将粘合剂140引入第一腔155中，从而防止粘合剂140渗透到柱130中。