公开(公告)号：US08457076B2

公开(公告)日：2013-06-04

申请号：US11654000

申请日：2007-01-17

申请人： Sung Lark Kwon ,  Dong Joo Park ,  Hyuck Chan Kwon ,  Young Kwon Ryu ,  Hoo Young Jeong ,  Hong Jik Kim ,  Jung Seung Lee ,  Jae Won Jang ,  Byoung Seong Park ,  Hee Gul Park

发明人： Sung Lark Kwon ,  Dong Joo Park ,  Hyuck Chan Kwon ,  Young Kwon Ryu ,  Hoo Young Jeong ,  Hong Jik Kim ,  Jung Seung Lee ,  Jae Won Jang ,  Byoung Seong Park ,  Hee Gul Park

IPC分类号： H04B7/216 ,  H04J1/06 ,  H04J11/00 ,  H04W4/00

CPC分类号： H04W72/082 ,  H04J13/0059 ,  H04L5/0005 ,  H04L5/0007 ,  H04L5/0037 ,  H04L5/023 ,  H04L27/2613 ,  H04L27/2626 ,  H04L27/2655

摘要： Embodiments of the present invention may provide an apparatus and a method for transmitting and receiving a random access channel (RACH) in a single carrier-frequency division multiple access (SC-FDMA) system. A frequency domain RACH signal may be mapped to a localized sub-frequency band of an entire frequency band available to the SC-FDMA system. A guard band including at least one sub carrier may be allocated between the RACH signal band and other channel signal bands. A guard time may be allocated between the RACH signal and other channel signals in the time domain. The RACH signal may include a short message including information related to a mobile station. The RACH signal may be detected in a frequency based method, a time based method or a sliding matched filter based method. Receiver complexity can be decreased if the RACH signal includes a CAZAC code sequence for a preamble. In such a case, a receive delay may be simply calculated and then adjusted more accurately.

摘要翻译： 本发明的实施例可以提供在单载波频分多址（SC-FDMA）系统中发送和接收随机接入信道（RACH）的装置和方法。 频域RACH信号可以映射到SC-FDMA系统可用的整个频带的本地化子频带。 可以在RACH信号频带和其它信道信号频带之间分配包括至少一个子载波的保护频带。 可以在RACH信号和时域中的其它信道信号之间分配保护时间。 RACH信号可以包括包括与移动台有关的信息的短消息。 可以基于频率的方法，基于时间的方法或基于滑动匹配滤波器的方法来检测RACH信号。 如果RACH信号包括用于前同步码的CAZAC码序列，则接收机复杂度可以降低。 在这种情况下，可以简单地计算接收延迟，然后更精确地进行调整。

公开(公告)号：US20070171889A1

公开(公告)日：2007-07-26

申请号：US11654000

申请日：2007-01-17

申请人： Sung Lark Kwon ,  Dong Joo Park ,  Hyuck Chan Kwon ,  Young Kwon Ryu ,  Hoo Young Jeong ,  Hong Jik Kim ,  Jung Seung Lee ,  Jae Won Jang ,  Byoung Seong Park ,  Hee Gul Park

发明人： Sung Lark Kwon ,  Dong Joo Park ,  Hyuck Chan Kwon ,  Young Kwon Ryu ,  Hoo Young Jeong ,  Hong Jik Kim ,  Jung Seung Lee ,  Jae Won Jang ,  Byoung Seong Park ,  Hee Gul Park

IPC分类号： H04J3/06

CPC分类号： H04W72/082 ,  H04J13/0059 ,  H04L5/0005 ,  H04L5/0007 ,  H04L5/0037 ,  H04L5/023 ,  H04L27/2613 ,  H04L27/2626 ,  H04L27/2655

摘要： Embodiments of the present invention may provide an apparatus and a method for transmitting and receiving a random access channel (RACH) in a single carrier-frequency division multiple access (SC-FDMA) system. A frequency domain RACH signal may be mapped to a localized sub-frequency band of an entire frequency band available to the SC-FDMA system. A guard band including at least one sub carrier may be allocated between the RACH signal band and other channel signal bands. A guard time may be allocated between the RACH signal and other channel signals in the time domain. The RACH signal may include a short message including information related to a mobile station. The RACH signal may be detected in a frequency based method, a time based method or a sliding matched filter based method. Receiver complexity can be decreased if the RACH signal includes a CAZAC code sequence for a preamble. In such a case, a receive delay may be simply calculated and then adjusted more accurately.

摘要翻译： 本发明的实施例可以提供在单载波频分多址（SC-FDMA）系统中发送和接收随机接入信道（RACH）的装置和方法。 频域RACH信号可以映射到SC-FDMA系统可用的整个频带的本地化子频带。 可以在RACH信号频带和其它信道信号频带之间分配包括至少一个子载波的保护频带。 可以在RACH信号和时域中的其它信道信号之间分配保护时间。 RACH信号可以包括包括与移动台有关的信息的短消息。 可以基于频率的方法，基于时间的方法或基于滑动匹配滤波器的方法来检测RACH信号。 如果RACH信号包括用于前同步码的CAZAC码序列，则接收机复杂度可以降低。 在这种情况下，可以简单地计算接收延迟，然后更精确地进行调整。

公开(公告)号：US20130250921A1

公开(公告)日：2013-09-26

申请号：US13894973

申请日：2013-05-15

申请人： Sung Lark KWON ,  Dong Joo Park ,  Hyuck Chan Kwon ,  Young Kwon Ryu ,  Hoo Young Jeong ,  Hong Jik Kim ,  Jung Seong Lee ,  Jae Won Jang ,  Byoung Seong Park ,  Hee Gul Park

发明人： Sung Lark KWON ,  Dong Joo Park ,  Hyuck Chan Kwon ,  Young Kwon Ryu ,  Hoo Young Jeong ,  Hong Jik Kim ,  Jung Seong Lee ,  Jae Won Jang ,  Byoung Seong Park ,  Hee Gul Park

IPC分类号： H04W72/08

CPC分类号： H04W72/082 ,  H04J13/0059 ,  H04L5/0005 ,  H04L5/0007 ,  H04L5/0037 ,  H04L5/023 ,  H04L27/2613 ,  H04L27/2626 ,  H04L27/2655

摘要： Embodiments of the present invention may provide an apparatus and a method for transmitting and receiving a random access channel (RACH) in a single carrier-frequency division multiple access (SC-FDMA) system. A frequency domain RACH signal may be mapped to a localized sub-frequency band of an entire frequency band available to the SC-FDMA system. A guard band including at least one sub carrier may be allocated between the RACH signal band and other channel signal bands. A guard time may be allocated between the RACE signal and other channel signals in the time domain. The RACH signal may include a short message including information related to a mobile station. The RACE signal may be detected in a frequency based method, a time based method or a sliding matched filter based method. Receiver complexity can be decreased if the RACH signal includes a CAZAC code sequence for a preamble. In such a case, a receive delay may be simply calculated and then adjusted more accurately.

摘要翻译： 本发明的实施例可以提供在单载波频分多址（SC-FDMA）系统中发送和接收随机接入信道（RACH）的装置和方法。 频域RACH信号可以映射到SC-FDMA系统可用的整个频带的本地化子频带。 可以在RACH信号频带和其它信道信号频带之间分配包括至少一个子载波的保护频带。 可以在RACE信号和时域中的其他信道信号之间分配保护时间。 RACH信号可以包括包括与移动台有关的信息的短消息。 可以以基于频率的方法，基于时间的方法或基于滑动匹配滤波器的方法来检测RACE信号。 如果RACH信号包括用于前同步码的CAZAC码序列，则接收机复杂度可以降低。 在这种情况下，可以简单地计算接收延迟，然后更精确地进行调整。

公开(公告)号：US08557629B1

公开(公告)日：2013-10-15

申请号：US12959911

申请日：2010-12-03

申请人： Jin Seong Kim ,  Dong Joo Park ,  Kwang Ho Kim ,  Hee Yeoul Yoo ,  Jeong Wung Jeong

发明人： Jin Seong Kim ,  Dong Joo Park ,  Kwang Ho Kim ,  Hee Yeoul Yoo ,  Jeong Wung Jeong

IPC分类号： H01L21/00 ,  H01L31/0232 ,  H01L23/28

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/5386 ,  H01L24/14 ,  H01L24/17 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/182 ,  H01L2924/18301

摘要： Disclosed is a semiconductor device having overlapped via apertures formed in an encapsulant to outwardly expose solder balls. When different types of semiconductor devices are electrically connected to the solder balls through the overlapped via apertures, flux or solder paste is unlikely to contact sidewall portions of the overlapped via apertures. Therefore, different types of semiconductor devices can be mounted with improved efficiency.

公开(公告)号：US08525318B1

公开(公告)日：2013-09-03

申请号：US12943540

申请日：2010-11-10

申请人： Jin Seong Kim ,  Dong Joo Park ,  Kwang Ho Kim ,  Ye Sul Ahn

发明人： Jin Seong Kim ,  Dong Joo Park ,  Kwang Ho Kim ,  Ye Sul Ahn

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed are a semiconductor device capable of efficiently radiating heat of a semiconductor die and a method of fabricating the same. The semiconductor device efficiently radiates the heat by preventing an encapsulant from reaching the semiconductor die by an encapsulant dam so that an upper surface of the semiconductor die is exposed out of the encapsulant. In addition, the semiconductor device is configured to expose a pre-solder ball or a conductive pattern of a substrate through a via of the encapsulant. Therefore, electrical connection between the pre-solder ball and a solder ball of another semiconductor device stacked thereon is easily achieved.

摘要翻译： 公开了能够有效地辐射半导体管芯的热的半导体器件及其制造方法。 半导体器件通过防止密封剂通过密封剂坝到达半导体管芯而有效地散热，使得半导体管芯的上表面暴露于密封剂外。 此外，半导体器件被配置为通过密封剂的通孔来暴露衬底的预焊球或导电图案。 因此，可以容易地实现预焊球与另一半导体器件的焊球之间的电连接。

公开(公告)号：US08089145B1

公开(公告)日：2012-01-03

申请号：US12272606

申请日：2008-11-17

申请人： Gwang Ho Kim ,  Jin Seong Kim ,  Dong Joo Park ,  Dae Byoung Kang

发明人： Gwang Ho Kim ,  Jin Seong Kim ,  Dong Joo Park ,  Dae Byoung Kang

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/495 ,  H01L23/02 ,  H01L29/40 ,  H01L23/28

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49517 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00

摘要： In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads are provided in two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body.

摘要翻译： 根据本发明，提供了包括唯一配置的引线框的半导体封装（例如，QFP封装），其尺寸和配置为使半导体封装中的暴露引线的可用数量最大化。 更具体地，本发明的半导体封装包括限定多个周边边缘段的大致平面的管芯焊盘或管芯焊盘。 此外，半导体封装包括多个引线。 这些引线中的一些以两个同心的行或环提供，其至少部分地绕过管芯焊盘，其他引线包括从半导体封装的封装主体的相应侧表面突出的部分。 连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到至少一些引线。 芯片焊盘，引线和半导体管芯的至少一部分被封装体封装。