THIN FILM TRANSISTOR ARRAY PANEL AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    THIN FILM TRANSISTOR ARRAY PANEL AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    薄膜晶体管阵列及其制造方法

    公开(公告)号:US20090098673A1

    公开(公告)日:2009-04-16

    申请号:US12334241

    申请日:2008-12-12

    IPC分类号: H01L21/77

    摘要: A TFT array panel-including a substrate, a gate line having a gate electrode, a gate insulating layer formed on the gate line, a data line having a source electrode and a drain electrode spaced apart from the source electrode, a passivation layer formed on the data line and the drain electrode, and a pixel electrode connected to the drain electrode is provided. The TFT array panel further includes a protection layer including Si under at least one of the gate insulating layer and the passivation layer to enhance reliability.

    摘要翻译: 一种TFT阵列面板,包括基板,具有栅极电极的栅极线,栅极线上形成的栅极绝缘层,具有与源极间隔开的源极和漏电极的数据线,形成在源电极上的钝化层 提供数据线和漏电极以及连接到漏电极的像素电极。 TFT阵列板还包括在栅极绝缘层和钝化层中的至少一个之下包括Si的保护层,以增强可靠性。

    Method of forming a silicon layer and method of manufacturing a display substrate by using the same
    4.
    发明授权

    公开(公告)号:US07696091B2

    公开(公告)日:2010-04-13

    申请号:US11675935

    申请日:2007-02-16

    IPC分类号: H01L21/44

    摘要: A method of manufacturing a silicon layer includes pretreating a surface of a silicon nitride layer formed on a substrate through a plasma enhanced chemical vapor deposition method using a first reaction gas including at least one of silicone tetrafluoride (SiF4) gas, a nitrogen trifluoride (NF3) gas, SiF4—H2 gas and a mixture thereof. Then, a silicon layer is formed on the pretreated silicon nitride layer through the plasma enhanced chemical vapor deposition method using a second reaction gas including a mixture of gas including silicon tetrafluoride (SiF4), hydrogen (H2) and argon (Ar).

    摘要翻译: 一种制造硅层的方法包括:使用包括四氟化硅(SiF 4)气体,三氟化氮(NF 3),氟化三氟化硼中的至少一种的第一反应气体,通过等离子体增强化学气相沉积法,对形成在基板上的氮化硅层的表面进行预处理 )气体,SiF 4 -H 2气体及其混合物。 然后,使用包括四氟化硅(SiF 4),氢(H 2)和氩(Ar)的气体混合物的第二反应气体,通过等离子体增强化学气相沉积法在预处理的氮化硅层上形成硅层。

    Thin film transistor substrate, display device having the same and method of manufacturing the display device
    5.
    发明授权
    Thin film transistor substrate, display device having the same and method of manufacturing the display device 有权
    薄膜晶体管基板,具有相同的显示装置和制造显示装置的方法

    公开(公告)号:US08409916B2

    公开(公告)日:2013-04-02

    申请号:US13233399

    申请日:2011-09-15

    IPC分类号: H01L21/00 H01L21/16

    CPC分类号: H01L29/7869 H01L27/1225

    摘要: A thin film transistor substrate includes an insulating plate; a gate electrode disposed on the insulating plate; a semiconductor layer comprising a metal oxide, wherein the metal oxide has oxygen defects of less than or equal to 3%, and wherein the metal oxide comprises about 0.01 mole/cm3 to about 0.3 mole/cm3 of a 3d transition metal; a gate insulating layer disposed between the gate electrode and the semiconductor layer; and a source electrode and a drain electrode disposed on the semiconductor layer. Also described is a display substrate. The metal oxide has oxygen defects of less than or equal to 3%, and is doped with about 0.01 mole/cm3 to about 0.3 mole/cm3 of 3d transition metal. The metal oxide comprises indium oxide or titanium oxide. The 3d transition metal includes at least one 3d transition metal selected from the group consisting of chromium, cobalt, nickel, iron, manganese, and mixtures thereof.

    摘要翻译: 薄膜晶体管基板包括绝缘板; 设置在绝缘板上的栅电极; 包含金属氧化物的半导体层,其中所述金属氧化物具有小于或等于3%的氧缺陷,并且其中所述金属氧化物包含约0.01mol / cm 3至约0.3mol / cm 3的3d过渡金属; 设置在所述栅极电极和所述半导体层之间的栅极绝缘层; 以及设置在半导体层上的源电极和漏电极。 还描述了显示基板。 金属氧化物具有小于或等于3%的氧缺陷,并且掺杂有约0.01摩尔/ cm3至约0.3摩尔/ cm3的3d过渡金属。 金属氧化物包括氧化铟或二氧化钛。 3d过渡金属包括选自铬,钴,镍,铁,锰及其混合物中的至少一种3d过渡金属。

    Thin film transistor array panel and method for manufacturing the same
    6.
    发明申请
    Thin film transistor array panel and method for manufacturing the same 审中-公开
    薄膜晶体管阵列面板及其制造方法

    公开(公告)号:US20060118793A1

    公开(公告)日:2006-06-08

    申请号:US11262163

    申请日:2005-10-27

    IPC分类号: H01L33/00 H01L31/113

    摘要: A TFT array panel including a substrate, a gate line having a gate electrode, a gate insulating layer formed on the gate line, a data line having a source electrode and a drain electrode spaced apart from the source electrode, a passivation layer formed on the data line and the drain electrode, and a pixel electrode connected to the drain electrode is provided. The TFT array panel further includes a protection layer including Si under at least one of the gate insulating layer and the passivation layer to enhance reliability.

    摘要翻译: 一种TFT阵列面板,包括基板,具有栅极电极的栅极线,栅极线上形成的栅极绝缘层,具有与源极间隔开的源极和漏电极的数据线,形成在栅电极上的钝化层 数据线和漏电极,以及连接到漏电极的像素电极。 TFT阵列板还包括在栅极绝缘层和钝化层中的至少一个之下包括Si的保护层,以增强可靠性。

    Method of Forming a Silicon Layer and Method of Manufacturing a Display Substrate by Using the Same
    10.
    发明申请
    Method of Forming a Silicon Layer and Method of Manufacturing a Display Substrate by Using the Same 有权
    形成硅层的方法和使用其形成显示器基板的方法

    公开(公告)号:US20070212827A1

    公开(公告)日:2007-09-13

    申请号:US11675935

    申请日:2007-02-16

    IPC分类号: H01L21/84

    摘要: A method of manufacturing a silicon layer includes pretreating a surface of a silicon nitride layer formed on a substrate through a plasma enhanced chemical vapor deposition method using a first reaction gas including at least one of silicone tetrafluoride (SiF4) gas, a nitrogen trifluoride (NF3) gas, SiF4—H2 gas and a mixture thereof Then, a silicon layer is formed on the pretreated silicon nitride layer through the plasma enhanced chemical vapor deposition method using a second reaction gas including a mixture of gas including silicon tetrfluoride (SiF4), hydrogen (H2) and argon (Ar),

    摘要翻译: 一种制造硅层的方法包括:使用第一反应气体,通过等离子体增强化学气相沉积方法来预处理在衬底上形成的氮化硅层的表面,所述第一反应气体包括四氟化硅(SiF 4 N 4 O 4) )气体,三氟化氮(NF 3 3)气体,SiF 4 H 2 H 2气体及其混合物然后,形成硅层 通过等离子体增强化学气相沉积方法在预处理的氮化硅层上,使用包括包括四氟化硅(SiF 4 N 4),氢(H 2 O 3)的气体混合物的第二反应气体, )和氩(Ar),