Abstract:
A Doherty power amplification apparatus and method using a combined cell are provided. The Doherty power amplification apparatus includes, a power splitter for splitting an input power, and outputting the split powers to a carrier amplification unit and (N−1) peaking amplification units, wherein the carrier amplification unit, including M carrier power amplifiers, for amplifying power output from the power splitter; the (N−1) peaking amplification units, each of which includes M peaking power amplifiers, for amplifying the respective split powers output from the power splitter, and a power combiner for combining a power amplified by the carrier amplification unit and the respective split powers amplified by the (N−1) peaking amplification units, and for outputting the combined power, wherein N represents an integer obtained by adding a number of the carrier amplification units and a number of the (N−1) peaking amplification units, and M represents an integer which is equal to or more than 1.
Abstract:
A flash memory device and a method of programming the same include a memory cell array, a pass/fail check circuit and a control logic circuit. The memory cell array includes multiple memory cells arranged in rows and columns. The pass/fail check circuit verifies whether data bits selected by a column address during a column scan operation have program data values. The control logic circuit detects fail data bits from the selected data bits and stores the column address in response to the verification result of the pass/fail check circuit. The control logic circuit also compares a number of the fail data bits with a reference value and controls generation of the column address according to the comparison result.
Abstract:
There are provided a high-voltage transistor and a method of forming the same. A channel region of the high-voltage transistor includes a first region and a second region. The first region has high impurity concentration that is higher than that of the second region. In addition, the first region may be in contact with the isolation layer. Thus, it is possible to enhance leakage current characteristics of the high-voltage transistor.
Abstract:
A solar cell includes; a semiconductor substrate, an n+ region disposed on a surface of the semiconductor substrate, a plurality of first electrodes connected to the n+ region, a p+ region disposed on the surface of the semiconductor substrate and separated from the n+ region, a second electrode connected to the p+ region, and a first dielectric layer which has a positive fixed charge and is disposed between adjacent first electrodes of the plurality of first electrodes, and a method of manufacturing the same.
Abstract translation:太阳能电池包括: 半导体衬底,设置在半导体衬底的表面上的n +区,连接到n +区的多个第一电极,设置在半导体衬底的表面上并与n +区分离的p +区,连接到 p +区,以及具有正固定电荷且设置在多个第一电极的相邻第一电极之间的第一电介质层及其制造方法。
Abstract:
A method for reducing a memory map table search time when employing a semiconductor memory device as a temporary memory of large capacity storage device, and a semiconductor memory device therefore, are provided. A MAP RAM is prepared for storing map table data related to the nonvolatile memory area in the volatile memory area. At an initial power-up operation, it is determined whether a logical address is searched for from the map table data while the map table data existing in a map storage area of the nonvolatile memory area is loaded into the MAP RAM. A physical address corresponding to the logical address is provided as an output, when the logical address is searched for. Search time for a memory map table is reduced and read performance in a high speed map information search is increased.
Abstract:
A method of fabricating a semiconductor device includes forming a gate pattern on a substrate, forming an amorphous silicon (a-Si) region adjacent to the gate pattern by implanting a dopant containing a Group IV or VIII element into portions of the semiconductor substrate, forming gate spacers on sidewalls of the gate pattern, forming a first cavity by etching the a-Si region and the substrate using a first etching process, forming a second cavity by etching the substrate, such that the second cavity expands a profile of the first cavity in lateral and vertical directions, and forming a strained semiconductor region in the second cavity.
Abstract:
A fabricating method of a semiconductor device includes providing a substrate having a first region and a second region, forming a plurality of first gates in the first region of the substrate, such that the first gates are spaced apart from each other at a first pitch, forming a plurality of second gates in the second region of the substrate, such that the second gates are spaced apart from each other at a second pitch different from the first pitch, implanting an etch rate adjusting dopant into the second region to form implanted regions, while blocking the first region, forming a first trench by etching the first region between the plurality of first gates, and forming a second trench by etching the second region between the plurality of second gates.
Abstract:
A method of manufacturing a solar cell includes providing a semiconductor substrate; disposing a reflection layer on one side of the semiconductor substrate, wherein the disposing the reflection layer comprises implanting gas into a surface of the one side of the semiconductor substrate and heating the gas; disposing an n+ region and a p+ region separated from each other on the other opposite facing side of the semiconductor substrate; disposing a first electrode connected to the n+ region; and disposing a second electrode connected to the p+ region.
Abstract:
A flash memory device is disclosed and includes a memory cell array including a plurality of sectors. Each one of the plurality of sectors includes a plurality of strings, and each of the plurality of strings includes a plurality of memory cells series connected between a string select transistor and a ground select transistor. The flash memory device also includes a plurality of string selection lines, wherein each one of the plurality of string selection lines is respectively connected to string select transistors associated the plurality of strings in one of the plurality of sectors.
Abstract:
A resist underlayer composition, including a solvent, and an organosilane condensation polymerization product of hydrolyzed products produced from a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, and a compound represented by Chemical Formula 3.