公开(公告)号：US20190090353A1

公开(公告)日：2019-03-21

申请号：US16195179

申请日：2018-11-19

Applicant: TACTOTEK OY

Inventor： Paavo NISKALA ,  Pasi RAAPPANA ,  Mikko HEIKKINEN ,  Mikko SIPPARI ,  Jarkko TORVINEN

IPC: H05K3/12 ,  H05K1/18 ,  H05K3/28 ,  H05K3/00 ,  H05K3/30 ,  H05K1/09 ,  H05K1/02

Abstract: A method for manufacturing an electronic product, comprising providing a flexible, optionally optically substantially transparent or translucent, substrate film, printing a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, disposing the at least one electronic surface-mountable component, such as an integrated circuit, on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween, and further securing, optionally overmoulding, the component. Related arrangement and electronic product are presented.

公开(公告)号：US20190042030A1

公开(公告)日：2019-02-07

申请号：US16156008

申请日：2018-10-10

Applicant: TACTOTEK OY

Inventor： Jarmo SAASKI ,  Jarkko TORVINEN ,  Pasi RAAPPANA ,  Mikko HEIKKINEN

IPC: G06F3/044 ,  B29C45/14 ,  B32B27/08 ,  H05K1/03 ,  H05K1/14 ,  H05K3/28 ,  H05K3/12 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36

Abstract: An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

公开(公告)号：US20160345437A1

公开(公告)日：2016-11-24

申请号：US15158645

申请日：2016-05-19

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Jarkko TORVINEN

IPC: H05K1/18 ,  H01L33/62 ,  H01L33/52 ,  H01L33/48 ,  H01L31/0203 ,  H05K1/02 ,  H01L31/02

CPC classification number: H05K1/186 ,  H01L23/4985 ,  H01L23/5387 ,  H01L33/52 ,  H01L51/0097 ,  H01L2224/1319 ,  H01L2933/005 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/05 ,  H05K2201/09872 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device

Abstract translation: 一种用于电子设备的多层结构，其具有用于容纳电子设备（204）的柔性基底膜（202）。 设置在所述衬底膜（202）上的至少一个电子部件（204）; 以及设置在所述衬底膜（202）上的多个导电迹线（206），用于对包括所述至少一个电子部件（204）的电子元件进行电力供应和/或连接，其中至少一个优选地，热成型盖（210）附接到所述 在所述至少一个电子部件（204）的顶部上的所述基底膜（202），所述至少一个热成型盖（210）和容纳所述电子器件（204）的所述基底膜（202）用热塑性材料（208）包覆成型。 本发明还涉及一种用于制造电子设备的多层结构的方法

公开(公告)号：US20150257278A1

公开(公告)日：2015-09-10

申请号：US14198833

申请日：2014-03-06

Applicant: TactoTek Oy

Inventor： Paavo NISKALA ,  Pasi RAAPPANA ,  Mikko HEIKKINEN ,  Mikko SIPPARI ,  Jarkko TORVINEN

IPC: H05K3/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30

CPC classification number: H05K3/1216 ,  H05K1/0284 ,  H05K1/092 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0108 ,  H05K2203/1105 ,  H05K2203/1316 ,  Y10T29/53174

Abstract: A method for manufacturing an electronic product, comprising providing a flexible, optionally optically substantially transparent or translucent, substrate film, printing a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, disposing the at least one electronic surface-mountable component, such as an integrated circuit, on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween, and further securing, optionally overmoulding, the component. Related arrangement and electronic product are presented.

Abstract translation: 一种用于制造电子产品的方法，包括提供柔性的，可选地光学上基本上透明或半透明的基底膜，在基底膜上印刷多个导电墨水导电迹线，所述迹线限定多个导体和导电接触区域，用于 至少一个电子表面可安装部件的接触件，将至少一个电子表面安装部件（例如集成电路）布置在基板膜上，使得当它们仍然是湿的时候触点满足预定的接触区域以建立电气 连接，并且进一步固定，任选地包覆成型组件。 介绍相关安排和电子产品。