公开(公告)号：US20170371092A1

公开(公告)日：2017-12-28

申请号：US15672684

申请日：2017-08-09

Applicant: TactoTek Oy

Inventor： Antti KERANEN ,  Jarmo SAASKI ,  Tuomas HEIKKILA ,  Paavo NISKALA ,  Kari SEVERINKANGAS ,  Sami TORVINEN

IPC: F21V8/00

CPC classification number: G02B6/0065 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/006 ,  G02B6/0091

Abstract: A method for manufacturing an electronic product, including obtaining a flexible, optically substantially transparent or translucent, substrate sheet, printing, by an additive printed electronics process, a plurality of electrical conductors on the substrate sheet, printing or disposing, a plurality of electronic components including optoelectronic light emissive components on the substrate sheet, at least some of the printed conductors being configured to provide electrical current thereto, providing at least one graphic on the substrate sheet, the at least one graphic configured to enable outcoupling of light, and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate sheet to establish a multi-layer structure, the light emitted by the light emissive components being received by the lightguide sheet, propagating therewithin, and then being at least partly emitted to the environment through the at least one graphic.

公开(公告)号：US20190069403A1

公开(公告)日：2019-02-28

申请号：US15687157

申请日：2017-08-25

Applicant: TactoTek Oy

Inventor： Tero HEIKKINEN ,  Antti KERANEN ,  Mikko HEIKKINEN ,  Jarmo SAASKI

IPC: H05K1/03 ,  H05K1/18 ,  H05K1/02 ,  H05K3/28 ,  H05K3/46 ,  F21V3/00 ,  F21V8/00

Abstract: Integrated multilayer structure (100, 400) for hosting electronics, comprising a first substrate (102) comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (102A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (102B), a plastic layer (112), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (104, 104B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

公开(公告)号：US20210007222A1

公开(公告)日：2021-01-07

申请号：US17026960

申请日：2020-09-21

Applicant: TactoTek Oy

Inventor： Tero HEIKKINEN ,  Antti KERANEN ,  Mikko HEIKKINEN ,  Jarmo SAASKI

IPC: H05K1/03 ,  F21V3/00 ,  F21V8/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/46

Abstract: Integrated multilayer structure for hosting electronics, including a first substrate—including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

公开(公告)号：US20190021168A1

公开(公告)日：2019-01-17

申请号：US16123479

申请日：2018-09-06

Applicant: TACTOTEK OY

Inventor： Mikko HEIKKINEN ,  Jarmo SAASKI

IPC: H05K1/18 ,  H05K3/32 ,  H05K1/02 ,  H05K3/12 ,  H05K3/28

Abstract: A method for manufacturing a multilayer structure for an electronic device includes obtaining a flexible substrate film; printing a number of conductor traces on the flexible substrate film; providing a number of electronic components on a first surface area of the flexible substrate film, wherein the flexible substrate film further includes a second surface area adjacent to the first surface area; molding first thermoplastic material on the number of electronic components and the related first surface area of the flexible substrate film accommodating the components; and molding second thermoplastic material on the adjacent second surface area and on at least part of the first surface area, wherein the first thermoplastic material exhibits a first elasticity and the second thermoplastic material exhibits a second, different elasticity.

公开(公告)号：US20170094776A1

公开(公告)日：2017-03-30

申请号：US15279131

申请日：2016-09-28

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Pasi RAAPPANA ,  Jarmo SAASKI

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/12 ,  H05K3/30 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/4015 ,  H05K1/189 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/1327

Abstract: A multilayer structure, includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, preferably printed on the first side for establishing a desired predetermined circuit design, plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a preferably flexible connector for providing external electrical connection to the embedded circuit on the first side from the second, opposite side, one end of the connector being attached to a predetermined contact area on the first side, the other end being located on the second side for coupling with an external element, the intermediate portion connecting the two ends being fed through an opening in the substrate, wherein the opening extending through the thickness of the film is dimensioned to accommodate the connector without substantial additional clearance.

公开(公告)号：US20190042030A1

公开(公告)日：2019-02-07

申请号：US16156008

申请日：2018-10-10

Applicant: TACTOTEK OY

Inventor： Jarmo SAASKI ,  Jarkko TORVINEN ,  Pasi RAAPPANA ,  Mikko HEIKKINEN

IPC: G06F3/044 ,  B29C45/14 ,  B32B27/08 ,  H05K1/03 ,  H05K1/14 ,  H05K3/28 ,  H05K3/12 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36

Abstract: An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

公开(公告)号：US20170094800A1

公开(公告)日：2017-03-30

申请号：US15279080

申请日：2016-09-28

Applicant: TactoTek Oy

Inventor： Antti KERANEN ,  Mikko HEIKKINEN ,  Pasi RAAPPANA ,  Jarmo SAASKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46 ,  H05K3/12 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/111 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0044 ,  H05K3/12 ,  H05K3/28 ,  H05K3/4092 ,  H05K3/46 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/09754 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: A multilayer structure includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, printed on the first side for establishing a desired predetermined circuit design, a plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a connector in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side, the connector defined by a portion of the substrate film accommodating at least part of one or more of the printed conductive traces and cut partially loose from the surrounding substrate material to establish the flap, whose loose end is bendable away from the molded plastic layer to facilitate establishment of the electrical connection with external element, wire or connector, via the associated gap.

公开(公告)号：US20150308639A1

公开(公告)日：2015-10-29

申请号：US14264273

申请日：2014-04-29

Applicant: Tactotek Oy

Inventor： Antti KERANEN ,  Jarmo SAASKI ,  Tuomas HEIKKILA ,  Paavo NISKALA ,  Kari SEVERINKANGAS ,  Sami TORVINEN

IPC: F21K99/00 ,  F21V8/00

CPC classification number: G02B6/0065 ,  G02B6/0036 ,  G02B6/0051 ,  G02B6/006 ,  G02B6/0091

Abstract: A method for manufacturing an electronic product, includes: obtaining a flexible, optically substantially transparent or translucent, substrate sheet; printing a number of electrical conductors on the substrate sheet in accordance with a predefined schematic; printing or disposing a number of electronic components including optoelectronic light emissive, preferably LED (light-emitting diode), components on the substrate sheet in accordance with the schematic, wherein at least some of the printed conductors are configured to provide electrical current thereto; and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate so as to establish a functional multi-layer structure, where the light emitted by the light emissive components is incoupled to the lightguide, propagates therewithin, and is at least partly outcoupled to the environment through the substrate sheet. Related arrangement and electronic device are presented.

Abstract translation: 一种电子产品的制造方法，包括：获得柔性光学上基本上透明或半透明的基片; 根据预定示意图在基片上印刷多个电导体; 根据示意图，在基板上打印或布置包括光电发光，优选LED（发光二极管））的多个电子部件，其中至少一些印刷导体被配置为向其提供电流; 以及将柔性的光学上基本上透明的光导薄片附接到所述基底上，以便建立功能性多层结构，其中由所述光发射组件发射的光被耦合到所述光导，在其中传播，并且至少部分地耦合到 通过基板的环境。 介绍了相关的布置和电子设备。