公开(公告)号：US20200229296A1

公开(公告)日：2020-07-16

申请号：US16833744

申请日：2020-03-30

Applicant: TACTOTEK OY

Inventor： Antti KERÄNEN ,  Tomi SIMULA ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Pasi RAAPPANA ,  Minna PIRKONEN

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K5/06

Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.

公开(公告)号：US20200229295A1

公开(公告)日：2020-07-16

申请号：US16245643

申请日：2019-01-11

Applicant: TACTOTEK OY

Inventor： Antti KERÄNEN ,  Tomi SIMULA ,  Mikko HEIKKINEN ,  Jarmo SÄÄSKI ,  Pasi RAAPPANA ,  Minna PIRKONEN

IPC: H05K1/02 ,  H05K1/18 ,  H05K5/06 ,  H05K3/28

Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.

公开(公告)号：US20190090353A1

公开(公告)日：2019-03-21

申请号：US16195179

申请日：2018-11-19

Applicant: TACTOTEK OY

Inventor： Paavo NISKALA ,  Pasi RAAPPANA ,  Mikko HEIKKINEN ,  Mikko SIPPARI ,  Jarkko TORVINEN

IPC: H05K3/12 ,  H05K1/18 ,  H05K3/28 ,  H05K3/00 ,  H05K3/30 ,  H05K1/09 ,  H05K1/02

Abstract: A method for manufacturing an electronic product, comprising providing a flexible, optionally optically substantially transparent or translucent, substrate film, printing a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, disposing the at least one electronic surface-mountable component, such as an integrated circuit, on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween, and further securing, optionally overmoulding, the component. Related arrangement and electronic product are presented.

公开(公告)号：US20170094776A1

公开(公告)日：2017-03-30

申请号：US15279131

申请日：2016-09-28

Applicant: TactoTek Oy

Inventor： Mikko HEIKKINEN ,  Pasi RAAPPANA ,  Jarmo SAASKI

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/12 ,  H05K3/30 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/4015 ,  H05K1/189 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/1327

Abstract: A multilayer structure, includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, preferably printed on the first side for establishing a desired predetermined circuit design, plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a preferably flexible connector for providing external electrical connection to the embedded circuit on the first side from the second, opposite side, one end of the connector being attached to a predetermined contact area on the first side, the other end being located on the second side for coupling with an external element, the intermediate portion connecting the two ends being fed through an opening in the substrate, wherein the opening extending through the thickness of the film is dimensioned to accommodate the connector without substantial additional clearance.

公开(公告)号：US20190042030A1

公开(公告)日：2019-02-07

申请号：US16156008

申请日：2018-10-10

Applicant: TACTOTEK OY

Inventor： Jarmo SAASKI ,  Jarkko TORVINEN ,  Pasi RAAPPANA ,  Mikko HEIKKINEN

IPC: G06F3/044 ,  B29C45/14 ,  B32B27/08 ,  H05K1/03 ,  H05K1/14 ,  H05K3/28 ,  H05K3/12 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36

Abstract: An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

公开(公告)号：US20170094800A1

公开(公告)日：2017-03-30

申请号：US15279080

申请日：2016-09-28

Applicant: TactoTek Oy

Inventor： Antti KERANEN ,  Mikko HEIKKINEN ,  Pasi RAAPPANA ,  Jarmo SAASKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46 ,  H05K3/12 ,  H05K3/28 ,  H05K3/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/111 ,  H05K1/118 ,  H05K1/16 ,  H05K3/0044 ,  H05K3/12 ,  H05K3/28 ,  H05K3/4092 ,  H05K3/46 ,  H05K2201/0129 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/09754 ,  H05K2203/0228 ,  H05K2203/1316

Abstract: A multilayer structure includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, printed on the first side for establishing a desired predetermined circuit design, a plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a connector in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side, the connector defined by a portion of the substrate film accommodating at least part of one or more of the printed conductive traces and cut partially loose from the surrounding substrate material to establish the flap, whose loose end is bendable away from the molded plastic layer to facilitate establishment of the electrical connection with external element, wire or connector, via the associated gap.

公开(公告)号：US20150257278A1

公开(公告)日：2015-09-10

申请号：US14198833

申请日：2014-03-06

Applicant: TactoTek Oy

Inventor： Paavo NISKALA ,  Pasi RAAPPANA ,  Mikko HEIKKINEN ,  Mikko SIPPARI ,  Jarkko TORVINEN

IPC: H05K3/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30

CPC classification number: H05K3/1216 ,  H05K1/0284 ,  H05K1/092 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0108 ,  H05K2203/1105 ,  H05K2203/1316 ,  Y10T29/53174

Abstract: A method for manufacturing an electronic product, comprising providing a flexible, optionally optically substantially transparent or translucent, substrate film, printing a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, disposing the at least one electronic surface-mountable component, such as an integrated circuit, on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween, and further securing, optionally overmoulding, the component. Related arrangement and electronic product are presented.

Abstract translation: 一种用于制造电子产品的方法，包括提供柔性的，可选地光学上基本上透明或半透明的基底膜，在基底膜上印刷多个导电墨水导电迹线，所述迹线限定多个导体和导电接触区域，用于 至少一个电子表面可安装部件的接触件，将至少一个电子表面安装部件（例如集成电路）布置在基板膜上，使得当它们仍然是湿的时候触点满足预定的接触区域以建立电气 连接，并且进一步固定，任选地包覆成型组件。 介绍相关安排和电子产品。