公开(公告)号：US20210355586A1

公开(公告)日：2021-11-18

申请号：US17390579

申请日：2021-07-30

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Naoko MIKAMI ,  Sumika TAMURA ,  Reiji TERADA ,  Masashi KURATA ,  Daisei FUJITO ,  Kiyoaki NISHITSUJI ,  Takehiro NISHI

IPC: C23F1/28 ,  B21B1/22 ,  B21B3/02 ,  B32B15/01 ,  B32B15/04 ,  C23C14/04 ,  C23C14/34 ,  C23C16/04 ,  C23F1/16 ,  C23F1/40 ,  H01L51/00 ,  C23C14/24

Abstract: A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 μm or less by etching the processing object by 3 μm or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 μm or more, thereby obtaining a metal mask sheet.

公开(公告)号：US20190144989A1

公开(公告)日：2019-05-16

申请号：US16248643

申请日：2019-01-15

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Takehiro NISHI

IPC: C23C14/04

Abstract: A vapor deposition metal mask includes a mask region including a plurality of mask holes. A connection portion of each mask hole located at a position other than the center of the mask region has a shape protruding inward of the mask hole along the entire circumference of the mask hole and is configured by a first section, which is a section closer to the center of the mask region and a second section, which is a section closer to one of the ends of the mask region. The distance between the first section and the reverse surface of the mask region is a first step height. The first step height in the end region is smaller than the first step height in the central region.

公开(公告)号：US20180065162A1

公开(公告)日：2018-03-08

申请号：US15786446

申请日：2017-10-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Naoko MIKAMI ,  Sumika TAMURA ,  Reiji TERADA ,  Masashi KURATA ,  Daisei FUJITO ,  Kiyoaki NISHITSUJI ,  Takehiro NISHI

IPC: B21B3/02 ,  B21B1/22 ,  C23C14/04 ,  C23C16/04 ,  C23F1/28 ,  C23F1/40 ,  B32B15/01 ,  B32B15/04 ,  H01L51/00

CPC classification number: B21B3/02 ,  B21B1/227 ,  B21B2261/04 ,  B32B15/015 ,  B32B15/04 ,  C23C14/042 ,  C23C16/042 ,  C23F1/28 ,  C23F1/40 ,  H01L51/0015

Abstract: A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 μm or less by etching the processing object by 3 μm or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 μm or more, thereby obtaining a metal mask sheet.

公开(公告)号：US20210091312A1

公开(公告)日：2021-03-25

申请号：US17100769

申请日：2020-11-20

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Daisei FUJITO ,  Kiyoaki NISHITSUJI ,  Takehiro NISHI

IPC: H01L51/00 ,  C23F1/02 ,  C23C14/04 ,  H05B33/10 ,  B05C21/00 ,  C23F1/16

Abstract: A metal mask substrate includes a metal obverse surface configured such that a resist is placed on the obverse surface. The obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 μm. The obverse surface also has a three-dimensional surface roughness Sz of less than or equal to 3.17 μm.

公开(公告)号：US20200235298A1

公开(公告)日：2020-07-23

申请号：US16840260

申请日：2020-04-03

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Takehiro NISHI

IPC: H01L51/00 ,  H01L51/56 ,  H05B33/10 ,  C23C14/04 ,  C23C14/24

Abstract: A vapor deposition mask includes a front surface, a back surface opposite to the front surface, and inner surfaces defining the respective mask holes. Each mask hole extends between the front surface and the back surface. In a plan view of the front surface, each mask hole includes a large opening, which is located at the front surface, and a small opening, which is located inside the large opening. At least a section of each mask hole has a shape of an inverted frustum extending between the large opening and the small opening. Each inner surface includes a stepped surface spreading from the small opening toward the large opening.

公开(公告)号：US20180138410A1

公开(公告)日：2018-05-17

申请号：US15869597

申请日：2018-01-12

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Daisei FUJITO ,  Kiyoaki NISHITSUJI ,  Takehiro NISHI

IPC: H01L51/00 ,  B05C21/00 ,  C23F1/16 ,  H05B33/10 ,  H01L51/56

CPC classification number: H01L51/0011 ,  B05C21/005 ,  C23C14/042 ,  C23F1/02 ,  C23F1/16 ,  H01L51/56 ,  H05B33/10

Abstract: A metal mask substrate includes a metal obverse surface configured such that a resist is placed on the obverse surface. The obverse surface has a three-dimensional surface roughness Sa of less than or equal to 0.11 μm. The obverse surface also has a three-dimensional surface roughness Sz of less than or equal to 3.17 μm.

公开(公告)号：US20180066352A1

公开(公告)日：2018-03-08

申请号：US15786463

申请日：2017-10-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Sumika TAMURA ,  Naoko MIKAMI ,  Daisei FUJITO ,  Kiyoaki NISHITSUJI ,  Takehiro NISHI

IPC: C23C14/04 ,  C23C14/02 ,  C23C14/08 ,  C23C14/22 ,  C23F1/44 ,  G01N21/55 ,  H01L51/00 ,  H01L51/50 ,  H01L51/52

CPC classification number: C23C14/042 ,  C23C14/024 ,  C23C14/028 ,  C23C14/085 ,  C23C14/12 ,  C23C14/225 ,  C23F1/02 ,  C23F1/14 ,  C23F1/44 ,  G01N21/55 ,  H01L51/0011 ,  H01L51/5012 ,  H01L51/5271

Abstract: A metal mask substrate includes a metal surface to which a resist is to be disposed. A specular reflectance of incident light to the surface is 45.2% or more.

公开(公告)号：US20180038002A1

公开(公告)日：2018-02-08

申请号：US15786455

申请日：2017-10-17

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Sumika TAMURA ,  Mikio SHINNO ,  Daisei FUJITO ,  Kiyoaki NISHITSUJI ,  Takehiro NISHI ,  Naoko MIKAMI

IPC: C25B11/04 ,  C25C7/08 ,  C25D1/10 ,  C25C1/08 ,  C25D11/34 ,  C25D5/16

CPC classification number: C25B11/041 ,  C23C14/042 ,  C25C1/08 ,  C25C7/08 ,  C25D1/04 ,  C25D1/10 ,  C25D3/562 ,  C25D5/16 ,  C25D11/34 ,  H01L51/0011

Abstract: A vapor deposition metal mask substrate includes a nickel-containing metal sheet including a obverse surface and a reverse surface, which is opposite to the obverse surface. At least one of the obverse surface and the reverse surface is a target surface for placing a resist layer. The target surface has a surface roughness Sa of less than or equal to 0.019 μm. The target surface has a surface roughness Sz of less than or equal to 0.308 μm.