公开(公告)号：US10409163B2

公开(公告)日：2019-09-10

申请号：US15509171

申请日：2015-09-18

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yugo Tanigaki ,  Takenori Fujiwara

IPC: G03F7/095 ,  C08K3/36 ,  C08K5/28 ,  C08L83/06 ,  G03F7/40 ,  H01L21/027 ,  H01L21/3065 ,  G03F7/004 ,  G03F7/039 ,  G03F7/023 ,  G03F7/032 ,  G03F7/075

Abstract: To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A).

公开(公告)号：US11561470B2

公开(公告)日：2023-01-24

申请号：US16495745

申请日：2018-03-27

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yugo Tanigaki ,  Kazuto Miyoshi

IPC: G03F7/037 ,  G03F7/038 ,  G03F7/40 ,  G03F7/075 ,  H01L51/56 ,  G02F1/1339 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32

Abstract: The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof. The negative type photosensitive resin composition includes an alkali-soluble resin (A), a radical polymerizable compound (B), a photo initiator (C1), and a black colorant (Da); the alkali-soluble resin (A) including a first resin (A1) containing one or more selected from the group consisting of polyimide (A1-1), polyimide precursor (A1-2), polybenzoxazole (A1-3), polybenzoxazole precursor (A1-4), and polysiloxane (A1-5); and the radical polymerizable compound (B) including one or more selected from the group consisting of a fluorene backbone-containing radical polymerizable compound (B1) and an indane backbone-containing radical polymerizable compound (B2).

公开(公告)号：US10983436B2

公开(公告)日：2021-04-20

申请号：US16084866

申请日：2017-03-17

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yugo Tanigaki ,  Satoshi Kamemoto ,  Kazuto Miyoshi

IPC: G03F7/32 ,  G03F7/038 ,  G03F7/075 ,  G03F7/037 ,  G02F1/1335 ,  G02F1/1339 ,  G02F1/1368 ,  G03F7/023 ,  G03F7/16 ,  G03F7/20 ,  G03F7/40 ,  H01L21/027 ,  H01L27/12 ,  H01L51/56 ,  H01L51/00 ,  H01L51/52 ,  H01L21/02 ,  H01L21/311 ,  G02F1/1362 ,  H01L27/32

Abstract: The present invention provides a negative type photosensitive resin composition having high sensitivity, excellent halftone characteristics, capability to form a small tapered pattern shape, and alkali-developability. The negative type photosensitive resin composition includes, as an alkali-soluble resin (A), at least a weakly acidic group-containing resin (A1) and an unsaturated group-containing resin (A2), the weakly acidic group-containing resin (A1) containing an acidic group having an acid dissociation constant in the range of 13.0 to 23.0 in dimethyl sulfoxide, and the unsaturated group-containing resin (A2) containing an ethylenically unsaturated double bond group.

公开(公告)号：US11822243B2

公开(公告)日：2023-11-21

申请号：US16333449

申请日：2017-08-22

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yugo Tanigaki ,  Akihiro Ishikawa ,  Kazuto Miyoshi

IPC: G03F7/037 ,  G03F7/30 ,  G03F7/40 ,  G03F7/027 ,  G02F1/1335 ,  G02F1/1339 ,  G03F7/023 ,  G03F7/032 ,  G03F7/038 ,  G03F7/075 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  C08F20/28 ,  H05B33/22 ,  H05B33/10 ,  H05B33/12 ,  G03F7/105 ,  G03F7/033 ,  H10K50/00 ,  H10K50/86 ,  H10K59/122 ,  H10K59/126 ,  H10K85/40 ,  H10K85/10 ,  H10K59/12

CPC classification number: G03F7/037 ,  C08F20/28 ,  G02F1/1335 ,  G02F1/1339 ,  G02F1/13394 ,  G02F1/133512 ,  G03F7/027 ,  G03F7/0233 ,  G03F7/032 ,  G03F7/033 ,  G03F7/038 ,  G03F7/0757 ,  G03F7/105 ,  G03F7/162 ,  G03F7/168 ,  G03F7/2002 ,  G03F7/322 ,  G03F7/40 ,  H05B33/10 ,  H05B33/12 ,  H05B33/22 ,  H10K50/00 ,  H10K50/865 ,  H10K59/122 ,  H10K59/126 ,  H10K85/111 ,  H10K85/141 ,  H10K85/40 ,  G02F1/13398 ,  H10K59/1201

Abstract: The present invention provides a negative-type photosensitive resin composition capable of obtaining a cured film suppressing generation of development residues caused by a pigment and having high sensitivity and excellent heat resistance and light blocking capability. A negative-type photosensitive resin composition contains an alkali-soluble resin (A), a radical-polymerizable compound (B), a photopolymerization initiator (C1), and a pigment (D1). In this resin composition, the radical-polymerizable compound (B) contains a flexible chain-containing radical-polymerizable compound (B1), the flexible chain-containing radical-polymerizable compound (B1) contains a compound having (I) a structure derived from a compound having at least three hydroxyl groups in the molecule, (II) at least three ethylenically unsaturated double bond groups, and (III) at least one aliphatic chain, the aliphatic chain has an average molecular weight of 40 to 500, and the content of the pigment (D1) is 5 to 70 mass % of the total solid content.

公开(公告)号：US10802401B2

公开(公告)日：2020-10-13

申请号：US15759429

申请日：2016-09-26

Applicant: TORAY INDUSTRIES, INC.

Inventor： Yugo Tanigaki ,  Satoshi Kamemoto ,  Kazuto Miyoshi

IPC: G03F7/027 ,  G03F7/028 ,  G03F7/037 ,  G03F7/033 ,  H01L51/56 ,  H01L51/54 ,  C08F265/06 ,  C08F283/12 ,  C08F283/04 ,  C08G73/22 ,  C08G73/10 ,  C09D179/08 ,  C08F222/10 ,  G03F7/038 ,  C08F285/00 ,  G03F7/032 ,  C08L51/00 ,  G03F7/004 ,  C09K11/06 ,  G03F7/105 ,  H01L51/50 ,  G03F7/075 ,  G03F7/20 ,  H01L51/52 ,  H01L27/32

Abstract: To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.

公开(公告)号：US20170243737A1

公开(公告)日：2017-08-24

申请号：US15128585

申请日：2015-03-18

Applicant: Toray Industries, Inc.

Inventor： Yugo Tanigaki ,  Takenori Fujiwara

IPC: H01L21/027 ,  H01L21/266 ,  B08B7/00 ,  H01L21/02 ,  B08B3/08 ,  G03F7/42 ,  H01L21/3105

CPC classification number: H01L21/0272 ,  B08B3/08 ,  B08B7/0057 ,  G03F7/0233 ,  G03F7/0757 ,  G03F7/40 ,  G03F7/42 ,  G03F7/423 ,  G03F7/425 ,  G03F7/427 ,  H01L21/0206 ,  H01L21/266 ,  H01L21/3081 ,  H01L21/31058 ,  H01L21/31111 ,  H01L21/31116

Abstract: Disclosed is a method for manufacturing a semiconductor device, including a step of yielding a pattern 2a of a polysiloxane-containing composition over a substrate 1, and a step of forming an ion impurity region 6 in the substrate, wherein, after the step of forming an ion impurity region, the method further includes a step of firing the pattern at a temperature of 300 to 1,500° C. This method makes it possible that after the formation of the ion impurity region in the semiconductor substrate, the pattern 2a of the polysiloxane-containing composition is easily removed without leaving any residual. Thus, the yield in the production of a semiconductor device can be improved and the tact time can be shortened.

公开(公告)号：US20150205203A1

公开(公告)日：2015-07-23

申请号：US14411442

申请日：2013-06-06

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takenori Fujiwara ,  Yugo Tanigaki ,  Ichiro Masuda ,  Yusuke Fukuzaki

IPC: G03F7/038

CPC classification number: G03F7/0388 ,  C08F290/126 ,  G03F7/0007 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0755 ,  G06F2203/04103 ,  C08F222/1006

Abstract: The present invention provides a photosensitive resin composition comprising an unsaturated group-containing resin (D), a (meth)acrylic compound (E) having a specific structure, a silane compound (G) having a substituent selected from the group consisting of an amino group, an amide group, a ureido group, a ketimine group, and an isocyanate group, and a photo-polymerization initiator (F), the unsaturated group-containing resin (D) being obtained by adding an epoxy group-containing unsaturated compound (C) to some acid radicals of a copolymer obtained by copolymerizing a (meth)acrylic ester (A) with an unsaturated group- and acid-containing compound (B).

Abstract translation: 本发明提供一种含有不饱和基团的树脂（D），具有特定结构的（甲基）丙烯酸类化合物（E））的硅氧烷化合物（G）的感光性树脂组合物，所述硅烷化合物（G）具有选自氨基 基团，酰胺基，脲基，酮亚胺基和异氰酸酯基，以及光聚合引发剂（F），通过加入含环氧基的不饱和化合物（D）得到不饱和基团的树脂（D） C）通过使（甲基）丙烯酸酯（A）与不饱和基团和含酸化合物（B）共聚获得的共聚物的一些酸基。

公开(公告)号：US10723884B2

公开(公告)日：2020-07-28

申请号：US16327162

申请日：2017-08-22

Applicant: TORAY INDUSTRIES, INC.

Inventor： Akihiro Ishikawa ,  Yugo Tanigaki ,  Kazuto Miyoshi

IPC: C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C09B67/08 ,  C09B57/00 ,  G03F7/023 ,  G03F7/037 ,  H01L51/50 ,  G03F7/004 ,  H05B33/22 ,  G03F7/027 ,  G09F9/30 ,  H05B33/12 ,  H01L27/32 ,  C08K3/22 ,  C08K3/36 ,  C08K5/00 ,  C08K5/1535 ,  C08K5/3417 ,  C08L79/08 ,  C09B5/62 ,  C09B29/40 ,  C09B67/46

Abstract: Provided is a black pigment that enables pattern formation of pixel division layer while suppressing generation of development residue. The black pigment comprises (a) a core containing at least one organic black pigment selected from the group consisting of benzodifuranone-based black pigments, perylene-based black pigments, azo-based black pigments, and isomers thereof and (b) a coating layer containing silica and/or a metal oxide and/or a metal hydroxide.

公开(公告)号：US10451969B2

公开(公告)日：2019-10-22

申请号：US15567822

申请日：2016-04-20

Applicant: TORAY INDUSTRIES, INC.

Inventor： Takenori Fujiwara ,  Yugo Tanigaki

IPC: G03F7/038 ,  C08L79/04 ,  C08L79/08 ,  G03F7/40 ,  C08F212/14 ,  C08G73/10 ,  G03F7/039 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  H01L21/22 ,  H01L21/308 ,  H01L21/3205 ,  G03F7/004 ,  G03F7/023

Abstract: Provided is a resin composition including: (A1) an alkali-soluble resin having a specific structural unit; (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, in which the amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1).

公开(公告)号：US10324376B2

公开(公告)日：2019-06-18

申请号：US15760756

申请日：2016-09-21

Applicant: TORAY INDUSTRIES, INC.

Inventor： Satoshi Kamemoto ,  Yugo Tanigaki ,  Kazuto Miyoshi

IPC: C08G69/32 ,  G03F7/038 ,  G03F7/031 ,  G03F7/037 ,  G03F7/004 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26 ,  G03F7/40 ,  H01L27/32 ,  G03F7/00 ,  G03F7/105 ,  C09K19/04 ,  C09D179/04 ,  C09D179/08 ,  C08G73/10 ,  C08G73/14 ,  C08G73/22

Abstract: The present invention provides a negative type colored photosensitive resin composition that serves to produce a cured film having a forward tapered shape. This negative type colored photosensitive resin composition includes an alkali-soluble resin (A), a photo initiator (B), a photo polymerizable compound (C), and a coloring agent (D), the alkali-soluble resin (A) containing a polyimide precursor, polybenzoxazole precursor, and/or a copolymer thereof (A-1), each resin (A-1) having a trifluoromethyl group in the backbone chain.