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16 条记录 (耗时 0.02 秒)

    Capacitor embedded printed circuit board
    1.
    发明申请
    Capacitor embedded printed circuit board 有权
    电容器嵌入式印刷电路板

    公开(公告)号：US20080223603A1

    公开(公告)日：2008-09-18

    申请号：US12068790

    申请日：2008-02-12

    申请人： Jin Cheol Kim ,  Tae Kyoung Kim ,  Jun Rok Oh

    发明人： Jin Cheol Kim ,  Tae Kyoung Kim ,  Jun Rok Oh

    IPC分类号： H05K1/16

    CPC分类号： H05K1/162 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4688 ,  H05K2201/09672 ,  H05K2203/061

    摘要： A capacitor embedded printed circuit board (PCB), the PCB including: a multilayer polymer capacitor layer where a plurality of polymer sheets is laminated; one or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets and alternately disposed to form a pair; a plurality of first extended electrodes and second extended electrodes connected to the first inner electrodes and second inner electrodes, respectively; one or more insulating layers laminated on one or both surfaces of the multilayer polymer capacitor, where a plurality of conductive patterns and conductive via holes, forming an interlayer circuit are formed; a plurality of first via holes for capacitor, penetrating the multilayer polymer capacitor layer to be connected to the first extended electrodes; and a plurality of second via holes for capacitor, penetrating the multilayer polymer capacitor layer to be connected to the second extended electrodes, wherein the plurality of the first and second extended electrodes are alternately disposed to be opposite to each other.

    摘要翻译： 一种电容器嵌入式印刷电路板（PCB），所述PCB包括：层叠多个聚合物片的多层聚合物电容器层; 一个或多个第一内部电极和第二内部电极，由多个聚合物片中的一个或多个隔开并交替地设置成一对; 分别连接到第一内部电极和第二内部电极的多个第一延伸电极和第二延伸电极; 层叠在所述多层聚合物电容器的一面或两面上的一个以上的绝缘层，其中形成形成层间电路的多个导电图案和导电通孔; 多个用于电容器的第一通孔，穿过要连接到第一延伸电极的多层聚合物电容器层; 以及多个用于电容器的第二通孔，穿过要连接到第二延伸电极的多层聚合物电容器层，其中多个第一和第二延伸电极交替地设置成彼此相对。

    Insulating material for printed circuit board
    3.
    发明申请
    Insulating material for printed circuit board 有权
    印刷电路板用绝缘材料

    公开(公告)号：US20080081177A1

    公开(公告)日：2008-04-03

    申请号：US11902487

    申请日：2007-09-21

    申请人： Jin Cheol Kim ,  Jun Rok Oh ,  Tae Kyoung Kim ,  Sang Jun Yoon ,  Hwa Young Lee

    发明人： Jin Cheol Kim ,  Jun Rok Oh ,  Tae Kyoung Kim ,  Sang Jun Yoon ,  Hwa Young Lee

    IPC分类号： B32B5/16 ,  B32B27/36

    CPC分类号： H05K1/0373 ,  H05K2201/0141 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/31786

    摘要： Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from −300 to +300 ppm/° C. in the temperature range of −55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.

    摘要翻译： 公开了一种用于印刷电路板的绝缘材料，其包括液晶聚酯树脂和陶瓷粉末，因此在-55〜125℃的温度范围内具有-300〜+ 300ppm /℃的电容温度系数 C.和介电常数范围为5至40.该绝缘材料具有优良的介电性能，并且根据温度变化的介电常数变化很小，因此在应用于高频电路时表现出高的可靠性。

    Capacitor embedded printed circuit board
    4.
    发明授权
    Capacitor embedded printed circuit board 有权
    电容器嵌入式印刷电路板

    公开(公告)号：US08053673B2

    公开(公告)日：2011-11-08

    申请号：US12068790

    申请日：2008-02-12

    申请人： Jin Cheol Kim ,  Tae Kyoung Kim ,  Jun Rok Oh

    发明人： Jin Cheol Kim ,  Tae Kyoung Kim ,  Jun Rok Oh

    IPC分类号： H05K1/00

    CPC分类号： H05K1/162 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4688 ,  H05K2201/09672 ,  H05K2203/061

    摘要： A capacitor embedded printed circuit board (PCB) includes a multilayer polymer capacitor layer with a plurality of polymer sheets. One or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets, are alternately disposed to form a pair. A plurality of first extended electrodes and second extended electrodes protrude from the first inner electrodes and second inner electrodes, respectively. One or more insulating layers are laminated on one or both surfaces of the multilayer polymer capacitor. A plurality of first via holes for capacitor, and a plurality of second via holes for capacitor, penetrating the multilayer polymer capacitor layer are connected to the first extended electrodes and the second extended electrodes, respectively. The plurality of the first and second extended electrodes are alternately disposed to be opposite to each other.

    摘要翻译： 电容器嵌入式印刷电路板（PCB）包括具有多个聚合物片的多层聚合物电容层。 由多个聚合物片中的一个或多个隔开的一个或多个第一内部电极和第二内部电极交替地设置成一对。 多个第一延伸电极和第二延伸电极分别从第一内部电极和第二内部电极突出。 在多层聚合物电容器的一个或两个表面上层压一个或多个绝缘层。 多个用于电容器的第一通孔和多个穿过多层聚合物电容器层的电容器用第二通孔分别连接到第一延伸电极和第二延伸电极。 多个第一和第二延伸电极交替地设置成彼此相对。

    Method of manufacturing printed circuit board including embedded capacitors
    6.
    发明授权
    Method of manufacturing printed circuit board including embedded capacitors 失效
    包括嵌入式电容器的印刷电路板的制造方法

    公开(公告)号：US07676921B2

    公开(公告)日：2010-03-16

    申请号：US11670463

    申请日：2007-02-02

    申请人： Jin Cheol Kim ,  Min Soo Kim ,  Jun Rok Oh ,  Tae Kyoung Kim

    发明人： Jin Cheol Kim ,  Min Soo Kim ,  Jun Rok Oh ,  Tae Kyoung Kim

    IPC分类号： H01K3/10

    CPC分类号： H05K1/162 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2201/09672 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method of manufacturing a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board manufactured by the method of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon.

    摘要翻译： 一种制造包括嵌入式电容器的印刷电路板的方法，该电容器由包括多个聚合物聚合物层的聚合物冷凝层压板组成，每个聚合物层压板具有形成在聚合物片上的聚合物片和导体图案，以及用于层间连接的通孔 以及形成在聚合物冷凝层叠体的任一表面或两个表面上并具有电路图案和用于通过其进行层间连接的通孔的电路层。 通过本发明的方法制造的印刷电路板比传统的嵌入式电容器印刷电路板具有更高的每单位面积的电容密度，由此具有各种电容值的电容器，例如具有高电容的多层陶瓷电容器可以嵌入印刷电路 而不是安装在其上。

    Printed circuit board including embedded capacitors and method of manufacturing the same
    7.
    发明授权
    Printed circuit board including embedded capacitors and method of manufacturing the same 有权
    印刷电路板包括嵌入式电容器及其制造方法

    公开(公告)号：US07186919B2

    公开(公告)日：2007-03-06

    申请号：US11031508

    申请日：2005-01-06

    申请人： Jin Cheol Kim ,  Min Soo Kim ,  Jun Rok Oh ,  Tae Kyoung Kim

    发明人： Jin Cheol Kim ,  Min Soo Kim ,  Jun Rok Oh ,  Tae Kyoung Kim

    IPC分类号： H05K1/00

    CPC分类号： H05K1/162 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2201/09672 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： Disclosed herein is a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon. Also, a method of manufacturing the printed circuit board including embedded capacitors is provided.

    摘要翻译： 本发明公开了一种印刷电路板，其包括嵌入式电容器，其由聚合物冷凝器层压体构成，聚合物冷凝层压板包括多个聚合物聚合物层，每个聚合物聚合物层具有形成在聚合物片上的聚合物片和导体图案，以及用于层间连接的通孔 以及形成在聚合物冷凝层叠体的任一表面或两个表面上的电路层，并且具有电路图案和用于通过其进行层间连接的通孔。 本发明的印刷电路板比传统的嵌入式电容器印刷电路板具有更高的每单位面积的电容密度，由此具有各种电容值的电容器，例如具有高电容的多层陶瓷电容器可以嵌入印刷电路板中，而不是 安装在其上。 此外，提供了一种制造包括嵌入式电容器的印刷电路板的方法。

    MEMBRANE ELECTRODE ASSEMBLY FOR FUEL CELL, AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    MEMBRANE ELECTRODE ASSEMBLY FOR FUEL CELL, AND METHOD OF MANUFACTURING THE SAME 审中-公开
    用于燃料电池的膜电极组件及其制造方法

    公开(公告)号：US20090148751A1

    公开(公告)日：2009-06-11

    申请号：US12175198

    申请日：2008-07-17

    申请人： Yeong-Suk Choi ,  Tae Kyoung Kim

    发明人： Yeong-Suk Choi ,  Tae Kyoung Kim

    IPC分类号： H01M4/00 ,  B05D5/12

    CPC分类号： H01M8/0297 ,  H01M4/8605 ,  H01M8/1004 ,  Y02P70/56

    摘要： A membrane electrode assembly (MEA) for a fuel cell, and a method of making the same, the MEA including: an electrolyte membrane; binder layers including a sulfonated polysulfone-clay nanocomposite, and a tackifier, disposed on opposing sides of the membrane; and electrodes including electrode catalytic layers, disposed on the binder layers.

    摘要翻译： 一种用于燃料电池的膜电极组件（MEA）及其制造方法，MEA包括：电解质膜; 包括磺化聚砜 - 粘土纳米复合材料的粘合剂层和设置在膜的相对侧上的增粘剂; 以及设置在粘合剂层上的包括电极催化剂层的电极。