摘要:
The present invention provides a solar cell module including: a light transmitting plate having light transmittance; solar cells having bonding pads and conductive bumps bonded to the bonding pads; an adhesive film disposed between the light transmitting plate and the solar cells to bond the light transmitting plate and the solar cells; and a conductive pad disposed by being inserted in the adhesive film and surrounding and electrically connecting the conductive bumps of the adjacent solar cells.
摘要:
A reflection blocking film provided on a solar cell includes a transparent substrate with a plurality of patterns having incident light collected on the top surface thereof, and a reflector on the bottom surface of the transparent substrate and with holes through which the collected incident light is transmitted. A method of manufacturing a reflection blocking film includes: forming a plurality of patterns on the top surface of a transparent substrate; coating a photo resin on a bottom surface of the transparent substrate; exposing to irradiate light to the top surface of the transparent substrate to react the light collected by the pattern with the photo resin; developing to lift off a portion, which does not receive light, by using a developer during the exposing; coating a reflector on the bottom surface of the transparent substrate; and forming holes by lifting off the photo resin interposed in the reflector.
摘要:
The present invention provides a solar cell module. The solar cell module includes a floodlight panel with a light transmission property; solar cells each of which has a light-receiving surface with electrode pads and a non-light-receiving surface opposite to the light-receiving surface, the solar cells being adhered to the floodlight panel so that the light-receiving surface faces the floodlight panel; and a conductive bonding film which is interposed between the floodlight panel and the solar cells and bonds the floodlight panel to the solar cells, wherein the conductive bonding film is used to electrically connect the electrode pads of the solar cells adjacent to one another.
摘要:
A solar cell module comprises a rear contact solar cell in which positive (+) and negative (−) electrode patterns are alternately formed on a rear surface of a solar cell; insulating layers formed on both sides of the rear surface of the solar cell to be vertical to the electrode patterns; and a pair of conductive pattern bars that is disposed in a gap between both sides of the rear surface of the solar cell. Each conductive pattern bar includes a stem part formed on the each insulating layer and a plurality of branch parts extending from the stem part to be electrically connected to the same electrode patterns on the rear surface of the solar cell; and an encapsulant layer that protects the conductive pattern bars and at least the rear surface of the solar cell.
摘要:
The present invention relates to a solar cell module having a white back sheet. According to one aspect of the present invention, provided is a solar cell module having a white back sheet including: a solar cell; an encapsulation sheet for covering and protecting an upper part of the solar cell while transmitting light; and a back sheet for supporting the solar cell and having a white reflection layer for reflecting the light transmitted through the solar cell, wherein the light reflected from the white reflection layer of the back sheet is reused to be photoelectrically converted by the solar cell.
摘要:
Disclosed herein are a method and an apparatus for inspecting solar cells. According to an exemplary embodiment of the present invention, a method for inspecting solar cells includes: (a) preparing solar cells; (b) obtaining a photoluminescence image(s) by irradiating light to the prepared solar cells; and (c) determining a conversion efficiency rating of each solar cell according to brightness of the obtained image. Further, an apparatus for inspecting solar cells includes a stage unit that transfers solar cells; a light source unit that irradiates light to a surface of the solar cell transferred through the stage unit; a camera unit that obtains a photoluminescence image according to the light irradiated from the light source unit; and an efficiency determination unit that determines a conversion efficiency rating of each solar cell based on brightness of an image obtained from the camera unit according to preset programs.
摘要:
Provided are a wafer level chip scale package of an image sensor and a manufacturing method thereof. The wafer level chip scale package includes: a wafer including an image sensor and a pad on the top surface thereof and inclined surfaces on both ends thereof; expansion pads formed on the inclined surfaces of the wafer, including the pad, such that the expansion pads are electrically connected to the pad, a bottom surface of the expansion pads being on a straight line with respect to that of the wafer; a support formed on the expansion pads to support both bottom surfaces of a glass, the support having a height to provide a space where an air cavity is formed; and a glass disposed on the support to provide the air cavity over the wafer.
摘要:
Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter attached on the pad electrodes of the wafer by means of a bonding agent, terminals electrically connected to the pad electrodes, respectively, in via holes formed at the other side surface of the wafer, which is opposite to the pad electrodes, and bump electrodes, each of which is connected to one side of each of the terminals. The present invention is capable of minimizing the size of a semiconductor package having an image sensor, which is referred to as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), through the application of a wafer level package technology, thereby reducing the manufacturing costs of the semiconductor package and accomplishing production on a large scale.
摘要:
A glass cap molding package includes a substrate with an external connection terminal formed on a peripheral region of a top surface; an image sensor mounted on the top surface of the substrate; a transparent member installed on an upper part of the image sensor; and a molding unit formed to seal the image sensor and the transparent member. The mold unit exposes the external connection terminal of the substrate to a lateral surface of the substrate. The glass cap molding package and a manufacturing method thereof and a camera module including the same reduce a manufacturing cost and improve productivity by manufacturing a small module in comparison with a conventional module and simplifying a process.
摘要:
Disclosed herein is an optical navigation module, including: an LED that is a light source diffusing light; a lens having a light transmitting part and a light receiving part integrally formed and refracting and collecting light diffused from the light source; a window transmitting light diffused from the LED and light reflected by a subject; and a sensor receiving light reflected from the window, detecting the received light, and outputting the detected light as a signal.