摘要:
A battery pack having a secondary battery and a circuit that controls charging and discharging of the secondary battery is provided. The battery pack has a computer that communicates with another computer disposed in a charging device, authenticate the charging device, and calculates remaining capacity information of the secondary battery. When the computer has not successfully authenticated the charging device and has detected that the secondary battery has been charged in a predetermined manner, the computer forcibly sets the remaining capacity information to “no remaining capacity”.
摘要:
A battery pack having a secondary battery and a circuit that controls charging and discharging of the secondary battery is provided. The battery pack has a computer and a charging control section. The computer communicates with another computer disposed in a charging device and authenticates the charging device. The charging control section, controlled by the computer, supplies a charging current to the secondary battery when the charging device has been successfully authenticated and shuts off the charging current when the charging device has not been successfully authenticated.
摘要:
A battery pack having a secondary battery and a circuit that controls charging and discharging of the secondary battery is provided. The battery pack has a computer and a charging control section. The computer communicates with another computer disposed in a charging device and authenticates the charging device. The charging control section, controlled by the computer, supplies a charging current to the secondary battery when the charging device has been successfully authenticated and shuts off the charging current when the charging device has not been successfully authenticated.
摘要:
A battery pack having a secondary battery and a circuit that controls charging and discharging of the secondary battery is provided. The battery pack has a computer that communicates with another computer disposed in a charging device, authenticate the charging device, and calculates remaining capacity information of the secondary battery. When the computer has not successfully authenticated the charging device and has detected that the secondary battery has been charged in a predetermined manner, the computer forcibly sets the remaining capacity information to “no remaining capacity”.
摘要:
Provided is a semiconductor device with a semiconductor chip mounted on a small-sized package substrate that has a large number of external connection terminals. The package substrate includes a slot, the external connection terminals, and bonding fingers. The bonding fingers are connected to the external connection terminals. The bonding fingers constitute a bonding finger arrangement in a central section and end sections of a bonding finger area along each longer side of the slot. The bonding finger arrangement includes a first bonding finger array, which is located at a close distance from the each longer side of the slot, and a second bonding finger array, which is located at a distance farther than the distance of the first bonding finger array from the each longer side of the slot. The central section of the bonding finger area includes at least the second bonding finger array, and the end sections of the bonding finger area includes the first bonding finger array.
摘要:
An infrared sensor has a groove formed at a peripheral portion of an optical filter in a region opposed to a circumferential region of an opening of a package so as to be continuously located in the peripheral portion of the optical filter. The optical filter has a resistance of about 1 MΩ/cm or less. The package is mainly composed of a metal material. A conductive adhesive is used as an adhesive for joining the optical filter to the package. In a case where the optical filter has a filter body and a thin film made of an insulating material and provided on a surface of the filter body, the groove is formed to have a depth extending from the surface provided with the thin film made of the insulating material to the filter body.
摘要:
An AC adapter includes: a synthetic resin case; a switching regulator circuit assembly having an AC input terminal and a DC output terminal, the switching regulator circuit assembly being housed in the synthetic resin case; a synthetic resin name plate; and a metallic sheet for heat radiation separate from the resin name plate. The metallic sheet is attached to a surface of the case except for a portion for the AC input terminal.
摘要:
An electronic device has a temperature sensor that detects temperature of a CPU, an image processing unit, and a microprocessor unit that controls the supply of electric power from a power source unit to the CPU and the image processing unit according to the temperature detected by the temperature sensor. If the temperature of the CPU and/or the image processing unit is detected by the temperature sensor to be near the temperature that causes malfunction or damage to them, the supply of electric power to the CPU and the image processing unit is automatically stopped by the microprocessor unit. It is possible to prevent malfunction and damage of the CPU and the image processing unit and to easily prevent the occurrence of runaway programs, etc.
摘要:
An AC adapter including an electronic device, a first circuit board on which the electronic device is mounted, a second circuit board separated from the first circuit board, a connector mounted on the second circuit board and electrically connected to the second circuit board, first and second metal wirings that electrically connect the first and the second circuit boards, and an insulation case installing the first circuit board, the electronic device, the second circuit board, and the connector therein and including a projecting part interposed between the first and second metal wirings.
摘要:
In a stacked-type semiconductor device, a first semiconductor device and at least one second semiconductor device are stacked. The first semiconductor device includes a wiring board and a first semiconductor chip mounted on the wiring board. The second semiconductor device includes a wiring board and a second semiconductor chip mounted on the wiring board. The thickness of the second semiconductor chip of each second semiconductor device is thicker than the thickness of the first semiconductor chip.