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公开(公告)号：US11679510B2
公开(公告)日：2023-06-20
申请号：US17113371
申请日：2020-12-07
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Oliver Yu , Huei-Chi Chiu , Shi-Ming Wang , Li-Jen Wu , Yu Kai Chen , Sharon Yang
CPC classification number: B25J11/005 , B25J13/006 , B25J15/08 , G03F7/003 , G05D1/0212 , G05D2201/0216
Abstract: The present disclosure describes a method for replacing a photoresist (PR) bottle using a vehicle. An exemplary vehicle includes a processor configured to receive a request signal to replace a first PR bottle. The processor is also configured to transmit an order based on the request signal. The vehicle also includes a plurality of wheels configured to move the vehicle from the first location to a second location, and from the second location to the first location. The vehicle further includes a robotic arm configured to load, at the first location, the first PR bottle into a first container; load a second PR bottle in a second container; remove a cap from the second PR bottle and a socket from the first PR bottle; couple the socket of the first PR bottle to the second PR bottle; and unload the second PR bottle from the second container.
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公开(公告)号：US20210086368A1
公开(公告)日：2021-03-25
申请号：US17113371
申请日：2020-12-07
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Oliver YU , Huei-Chi CHIU , Shi-Ming WANG , Li-Jen Wu , Yu Kai Chen , Sharon Yang
Abstract: The present disclosure describes a method for replacing a photoresist (PR) bottle using a vehicle. An exemplary vehicle includes a processor configured to receive a request signal to replace a first PR bottle. The processor is also configured to transmit an order based on the request signal. The vehicle also includes a plurality of wheels configured to move the vehicle from the first location to a second location, and from the second location to the first location. The vehicle further includes a robotic arm configured to load, at the first location, the first PR bottle into a first container; load a second PR bottle in a second container; remove a cap from the second PR bottle and a socket from the first PR bottle; couple the socket of the first PR bottle to the second PR bottle; and unload the second PR bottle from the second container.
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公开(公告)号：US10943802B2
公开(公告)日：2021-03-09
申请号：US16233701
申请日：2018-12-27
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yu Kai Chen , Chia-Hung Chung , Ko-Bin Kao , Shi-Ming Wang , Su-Yu Yeh , Li-Jen Wu , Oliver Yu , Wen-Shiung Chen
Abstract: The present disclosure describes a container for placing an object therein. The container includes a container body and a lid over the container body, a collision-preventing portion attached to one or more of the container body and the lid and configured to buffer an impact force, a pairing recognition mechanism configured to detect an object placed in the container body, and a liquid-detecting sensor configured to detect a leakage from the object.
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公开(公告)号：US10857676B2
公开(公告)日：2020-12-08
申请号：US16034886
申请日：2018-07-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Oliver Yu , Huei-Chi Chiu , Shi-Ming Wang , Li-Jen Wu , Yu Kai Chen , Sharon Yang
Abstract: The present disclosure describes a method for replacing a photoresist (PR) bottle using a vehicle. An exemplary vehicle includes a processor configured to receive a request signal to replace a first PR bottle. The processor is also configured to transmit an order based on the request signal. The vehicle also includes a plurality of wheels configured to move the vehicle from the first location to a second location, and from the second location to the first location. The vehicle further includes a robotic arm configured to load, at the first location, the first PR bottle into a first container; load a second PR bottle in a second container; remove a cap from the second PR bottle and a socket from the first PR bottle; couple the socket of the first PR bottle to the second PR bottle; and unload the second PR bottle from the second container.
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公开(公告)号：US11029603B2
公开(公告)日：2021-06-08
申请号：US16226139
申请日：2018-12-19
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yu Kai Chen , Forster Yuan , Ko-Bin Kao , Shi-Ming Wang , Su-Yu Yeh , Li-Jen Wu , Oliver Yu
Abstract: Embodiments of the present disclosure describe a chemical replacement system and a method to automatically replace PR bottles. The chemical replacement system includes a computer system and a transfer module. The computer system can receive a request signal to replace one or more chemical containers and transmit a command to the transfer module. The transfer module, being controlled by the computer system, can include a holder configured to hold the one or more chemical containers (e.g., PR bottles); a door unit configured to open in response to the command; and a transfer unit configured to eject the holder in response to the command for replacement. The chemical replacement system can further include an automated vehicle configured to replace the one or more chemical containers in the ejected holder.
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Patent Agency Ranking
公开(公告)号：US20190146348A1
公开(公告)日：2019-05-16
申请号：US15905739
申请日：2018-02-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yu-Kai Chen , Chia-Hung Chung , Ko-Bin Kao , Su-Yu Yeh , Li-Jen Wu , Zhi-You Ke , Ming-Hung Lin
Abstract: A method of manufacturing a semiconductor device and a semiconductor processing system are provided. The method includes the following steps. A photoresist layer is formed on a substrate in a lithography tool. The photoresist layer is exposed in the lithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed to form a patterned photoresist layer in the lithography tool by using a developer. An ammonia gas by-product of the developer is removed from the lithography tool.
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公开(公告)号：US20230264360A1
公开(公告)日：2023-08-24
申请号：US18310219
申请日：2023-05-01
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Oliver Yu , Huei-Chi Chiu , Shi-Ming Wang , Li-Jen Wu , Yu Kai Chen , Sharon Yang
CPC classification number: B25J11/005 , G03F7/003 , B25J15/08 , B25J13/006 , G05D1/0212 , G05D2201/0216
Abstract: The present disclosure describes a method for replacing a photoresist (PR) bottle using a vehicle. An exemplary vehicle includes a processor configured to receive a request signal to replace a first PR bottle. The processor is also configured to transmit an order based on the request signal. The vehicle also includes a plurality of wheels configured to move the vehicle from the first location to a second location, and from the second location to the first location. The vehicle further includes a robotic arm configured to load, at the first location, the first PR bottle into a first container; load a second PR bottle in a second container; remove a cap from the second PR bottle and a socket from the first PR bottle; couple the socket of the first PR bottle to the second PR bottle; and unload the second PR bottle from the second container.
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公开(公告)号：US11061333B2
公开(公告)日：2021-07-13
申请号：US15905739
申请日：2018-02-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yu-Kai Chen , Chia-Hung Chung , Ko-Bin Kao , Su-Yu Yeh , Li-Jen Wu , Zhi-You Ke , Ming-Hung Lin
IPC: G03F7/20 , G03F7/40 , H01L21/027 , H01L21/66 , G03F7/039 , G03F7/004 , G03F7/32 , G03F7/16 , G03F7/30 , H01L29/66 , H01L21/67 , H01L29/78
Abstract: A method of manufacturing a semiconductor device and a semiconductor processing system are provided. The method includes the following steps. A photoresist layer is formed on a substrate in a lithography tool. The photoresist layer is exposed in the lithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed to form a patterned photoresist layer in the lithography tool by using a developer. An ammonia gas by-product of the developer is removed from the lithography tool.
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公开(公告)号：US11004709B2
公开(公告)日：2021-05-11
申请号：US16127919
申请日：2018-09-11
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Wen-Chieh Hsieh , Su-Yu Yeh , Ko-Bin Kao , Chia-Hung Chung , Li-Jen Wu , Chun-Yu Chen , Hung-Ming Chen , Yong-Ting Wu
IPC: H01L21/67 , G01N33/00 , H01L21/673 , B05C15/00
Abstract: A method for monitoring gas in a wafer processing system is provided. The method includes producing an exhaust flow in an exhausting conduit from a processing chamber. The method further includes placing a gas sensor in fluid communication with a detection point located in the exhausting conduit via a sampling tube that passes through a through hole formed on the exhausting conduit. The detection point is located away from the through hole. The method also includes detecting a gas condition at the detection point with the gas sensor. In addition, the method also includes analyzing the gas condition detected by the gas sensor to determine if the gas condition in the exhausting conduit is in a range of values.
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公开(公告)号：US10105732B2
公开(公告)日：2018-10-23
申请号：US14988677
申请日：2016-01-05
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Ming-Hsiang Hung , Teng-Yi Huang , Fu-Jen Tien , Li-Jen Wu , Cheng-Ming Wu , Teng-Hwee Ng , Ming-Yang Chuang
Abstract: A coater includes a chuck, a source of a coating material, a dispensing head, an exhaust system, and a liner. The chuck is configured to support a wafer. The dispensing head is configured to dispense the coating material onto the wafer. The exhaust system is configured to exhaust the excess coating material. The liner is present at least partially on an inner surface of the exhaust system. The liner has a stick resistance to the coating material, and the stick resistance of the liner is greater than a stick resistance of the inner surface of the exhaust system.
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