Abstract:
An integrated circuit includes a first through fourth devices positioned over a substrate, the first device including first through third transceivers, the second device including a fourth transceiver, the third device including a fifth transceiver, and the fourth device including a sixth transceiver. A first radio frequency interconnect (RFI) includes the first transceiver coupled to the fourth transceiver through a first guided transmission medium, a second RFI includes the second transceiver coupled to the fifth transceiver through a second guided transmission medium, and a third RFI includes the third transceiver coupled to the sixth transceiver by the second guided transmission medium.
Abstract:
A communication system includes a modulator configured to generate a modulated signal responsive to at least a data signal, and a demodulator configured to demodulate the modulated signal responsive to a first carrier signal. The demodulator includes a filter configured to generate a filtered first signal based on a first signal, and a gain adjusting circuit coupled to the filter. The first signal is based on the first carrier signal and modulated signal. The filter has a gain controlled by a set of control signals. The gain adjusting circuit is configured to adjust the gain of the filter, and to generate the set of control signals based on a voltage of the filtered first signal and a voltage of the first signal. The gain adjusting circuit includes a first peak detector coupled to the filter, and configured to detect a peak value of the voltage of the filtered first signal.
Abstract:
A varainductor includes a signal line, a ground plane, and a floating plane over a substrate. The ground plane is disposed on a side of the signal line, and the first floating plane is disposed between the ground plane and the signal line. An array of switches includes at least two switches configured to selectively electrically connect the ground plane to the floating plane.
Abstract:
A carrier generator includes a phase accumulator configured to generate a phase reference signal based on a frequency command word (FCW) signal, a time to digital converter (TDC) configured to generate a feedback signal based on a divided signal, a loop filter configured to generate a filtered command signal based on the phase reference signal and the feedback signal, and a plurality of tuning arrangements. Each tuning arrangement includes an oscillator configured to receive the filtered command signal and output an adjustment signal, and is configured to output a carrier signal of a corresponding plurality of carrier signals based on the adjustment signal. The divided signal is based on the adjustment signal of a first tuning arrangement.
Abstract:
An apparatus comprises a code generator configured to generate a coarse tuning signal and a reset signal based on a reference frequency and a phase difference signal. The apparatus also comprises a digital loop filter configured to generate a fine tuning signal based on the phase difference signal. The apparatus further comprises a voltage control oscillator configured to generate an output signal based on the coarse tuning signal and the fine tuning signal. The apparatus additionally comprises a divider configured to generate a divider frequency based on a divider control signal and the output signal. The phase difference signal is based, at least in part, on the divider frequency, and the divider is configured to be reset based on the reset signal.
Abstract:
A shared loop filter includes an input port configured to selectively receive a first input from a first charge pump. The first charge pump is connected to a first phase locked loop (PLL) in a first die. The input port is further configured to selectively receive a second input from a second charge pump, the second charge pump connected to a second PLL in a second die separate from the first die. The shared loop filter further includes an output port configured to selectively provide an output to a first voltage controlled oscillator (VCO). The first VCO is connected to the first PLL. The output port is further configured to selectively output a second output to a second VCO. The second VCO is connected to the second PLL.
Abstract:
An integrated circuit includes a first die and a second die. The first die comprising a first phase-locked loop (PLL) and the second die comprising a second PLL. The integrated circuit includes a shared loop filter, wherein the first PLL in the first die is combined with the shared loop filter to form a first PLL feedback loop, the second PLL in the second die is combined with the shared loop filter to form a second PLL feedback loop and the shared loop filter is configured to provide configurable bandwidths to each of the first PLL feedback loop and the second PLL feedback loop.
Abstract:
A device for optical signal processing includes a first layer, a second layer and a waveguiding layer. A lens is disposed within the first layer and adjacent to a surface of the first layer. The second layer is underneath the first layer and adjacent to another surface of the first layer. The waveguiding layer is located underneath the second layer and configured to waveguide a light beam transmitted in the waveguiding layer. A grating coupler is disposed over the waveguiding layer. The lens is configured to receive, from one of the grating coupler or a light-guiding element, the light beam, and focus the light beam towards another one of the light-guiding element or the grating coupler.
Abstract:
An integrated circuit includes first through fourth devices positioned over one or more substrates, a first radio frequency interconnect (RFI) including a first transmitter included in the first device, a first receiver included in the second device, and a first guided transmission medium coupled to each of the first transmitter and the first receiver, a second RFI including a second transmitter included in the first device, a second receiver included in the third device, and a second guided transmission medium coupled to each of the second transmitter and the second receiver, and a third RFI including a third transmitter included in the first device, a third receiver included in the fourth device, and the second guided transmission medium coupled to each of the third transmitter and the third receiver.
Abstract:
A method of forming semiconductor device includes forming an active layer in a substrate including forming components of one or more transistors; forming an MD and gate (MDG) layer over the active layer including forming a gate line; forming a metal-to-S/D (MD) contact structure; and forming a waveguide between the gate line and the MD contact structure; forming a first interconnection layer over the MDG layer including forming a first via contact structure over the gate line; forming a second via contact structure over the MD contact structure; and forming a heater between the first and second via contact structures and over the waveguide.