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    Polycrystalline diamond heat sink having major surfaces electrically insulated from each other
    1.
    发明授权
    Polycrystalline diamond heat sink having major surfaces electrically insulated from each other 失效
    多晶金刚石散热器具有彼此电绝缘的主表面

    公开(公告)号：US5495126A

    公开(公告)日：1996-02-27

    申请号：US181680

    申请日：1994-01-14

    申请人： Takahisa Iguchi ,  Tsutomu Nakamura ,  Tetsuo Nakai

    发明人： Takahisa Iguchi ,  Tsutomu Nakamura ,  Tetsuo Nakai

    IPC分类号： H01L21/48 ,  H01L23/373 ,  H01L23/34 ,  H01L31/0312

    CPC分类号： H01L21/4803 ,  H01L23/3732 ,  H01L2924/0002

    摘要： A polycrystalline diamond is prepared by chemical vapor deposition (step 101). A surface of the polycrystalline diamond is metallized (step 102). The metallized surface of the polycrystalline diamond is grooved with a YAG laser (step 103). A wedge or the like is driven into the grooves of the polycrystalline diamond to pressurize the same, whereby the polycrystalline diamond is divided along the grooves (step 104). Alternatively, a surface of a polycrystalline diamond prepared by chemical vapor deposition is grooved with a YAG laser (step 112), and the surface of the polycrystalline diamond is metallized (step 113) after the grooving. The obtained diamond heat sink (10) includes a first layer (11a) grooved with a laser, and a mechanically divided second layer (11b). Graphite adheres to the outer peripheral surface of the first layer (11a). The outer peripheral surface of the second layer (11b) has a greater surface roughness than that of the first layer (11a).

    摘要翻译： 通过化学气相沉积制备多晶金刚石（步骤101）。 多晶金刚石的表面被金属化（步骤102）。 多晶金刚石的金属化表面用YAG激光器开槽（步骤103）。 将楔形物等驱动到多晶金刚石的槽中以对其加压，由此多晶金刚石沿凹槽分开（步骤104）。 或者，通过化学气相沉积制备的多晶金刚石的表面用YAG激光器（步骤112）开槽，并且在开槽之后多晶金刚石的表面被金属化（步骤113）。 所获得的金刚石散热器（10）包括用激光器沟槽的第一层（11a）和机械分割的第二层（11b）。 石墨粘附到第一层（11a）的外周表面。 第二层（11b）的外周面比第一层（11a）具有更大的表面粗糙度。

    Method of manufacturing a diamond heat sink
    3.
    发明授权
    Method of manufacturing a diamond heat sink 失效
    制造金刚石散热器的方法

    公开(公告)号：US5294381A

    公开(公告)日：1994-03-15

    申请号：US964390

    申请日：1992-10-29

    申请人： Takahisa Iguchi ,  Tsutomu Nakamura ,  Tetsuo Nakai

    发明人： Takahisa Iguchi ,  Tsutomu Nakamura ,  Tetsuo Nakai

    IPC分类号： H01L21/48 ,  H01L23/373 ,  H01L21/302

    CPC分类号： H01L21/4803 ,  H01L23/3732 ,  H01L2924/0002

    摘要： A polycrystalline diamond is prepared by chemical vapor deposition (step 101). A surface of the polycrystalline diamond is metallized (step 102). The metallized surface of the polycrystalline diamond is grooved with a YAG laser (step 103). A wedge or the like is driven into the grooves of the polycrystalline diamond to pressurize the same, whereby the polycrystalline diamond is divided along the grooves (step 104). Alternatively, a surface of a polycrystalline diamond prepared by chemical vapor deposition is grooved with a YAG laser (step 112), so that the surface of the polycrystalline diamond is metallized (step 113) after the grooving.

    摘要翻译： 通过化学气相沉积制备多晶金刚石（步骤101）。 将多晶金刚石的表面金属化（步骤102）。 多晶金刚石的金属化表面用YAG激光器开槽（步骤103）。 将楔形物等驱动到多晶金刚石的槽中以对其加压，由此多晶金刚石沿凹槽分开（步骤104）。 或者，通过化学气相沉积制备的多晶金刚石的表面用YAG激光器（步骤112）开槽，使得在开槽之后多晶金刚石的表面被金属化（步骤113）。

    High strength bonding tool and a process for production of the same
    4.
    发明授权
    High strength bonding tool and a process for production of the same 失效
    高强度粘合工具及其制造方法

    公开(公告)号：US5934542A

    公开(公告)日：1999-08-10

    申请号：US842515

    申请日：1997-04-24

    申请人： Tsutomu Nakamura ,  Hiroshi Kawauchi ,  Tetsuo Nakai

    发明人： Tsutomu Nakamura ,  Hiroshi Kawauchi ,  Tetsuo Nakai

    IPC分类号： B23K20/02

    CPC分类号： B23K20/025 ,  H01L2924/0002

    摘要： The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting tool (bonding tool) used for heating, melting and bonding or thermocompression bonding in a lump a number of workpieces to be bonded, making up a part of electronic parts, in particular, a high precision tool called outer lead bonding tool. The high strength bonding tool comprises a substrate consisting of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface and a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree. C. at room temperature to 400.degree. C. and a polycrystalline diamond coating formed on the above described surface having microscopic protrusions by a gaseous phase synthesis method, the surface coated with the polycrystalline diamond coating being used as a tool end surface.

    摘要翻译： 本发明提供一种热压工具，即用于将诸如IC，LSI等的半导体器件或元件安装在基板上的高强度焊接工具，例如用于焊接的脉冲加热型工具，以及安装工具 （接合工具），用于加热，熔化和粘合或热压接合一批待接合的工件，构成电子部件的一部分，特别是称为外引线接合工具的高精度工具。 高强度粘合工具包括由在至少一个表面上具有硬质碳化物和/或硬质碳氮化物的微观突起的硬质合金构成的基体，线性膨胀系数为4.0×10 -6至5.5×10 -6 /℃。 室温至400℃，通过气相合成法在上述具有微小突起的表面上形成多晶金刚石涂层，涂覆有多晶金刚石涂层的表面用作工具端面。

    High strength bonding tool and a process for the production of the same
    5.
    发明授权
    High strength bonding tool and a process for the production of the same 失效
    高强度粘合工具及其生产工艺

    公开(公告)号：US5653376A

    公开(公告)日：1997-08-05

    申请号：US414787

    申请日：1995-03-31

    申请人： Tsutomu Nakamura ,  Hiroshi Kawauchi ,  Tetsuo Nakai

    发明人： Tsutomu Nakamura ,  Hiroshi Kawauchi ,  Tetsuo Nakai

    IPC分类号： B23K20/02 ,  B23K3/03 ,  H01L21/603

    CPC分类号： B23K20/025 ,  H01L2924/0002

    摘要： The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting tool (bonding tool). The tool is used for heating, melting and bonding or thermocompression bonding in a lump a number of workpieces to be bonded, making up a part of electronic parts, in particular, a high precision tool called outer lead bonding tool. The high strength bonding tool has a substrate that is composed of a cemented carbide having microscopic protrusions of hard carbides and/or hard carbonitrides on at least one surface and having a coefficient of linear expansion of 4.0.times.10.sup.-6 to 5.5.times.10.sup.-6 /.degree.C. at room temperature to 400.degree. C. Furthermore, a polycrystalline diamond coating is formed on the surface having microscopic protrusions by a gaseous phase synthesis method, the surface coated with the polycrystalline diamond coating being used as a tool end surface.

    摘要翻译： 本发明提供一种热压工具，即用于将诸如IC，LSI等的半导体器件或元件安装在基板上的高强度焊接工具，例如用于焊接的脉冲加热型工具，以及安装工具 （接合工具）。 该工具用于加热，熔化和粘合或热压接在一起的多个待接合的工件，构成电子部件的一部分，特别是称为外引线接合工具的高精度工具。 高强度粘合工具具有基材，该基材由在至少一个表面上具有硬质碳化物和/或硬质碳氮化物的微观突起的硬质合金构成，线膨胀系数为4.0×10 -6至5.5×10 -6 /℃ C.在室温至400℃下进行。此外，通过气相合成法在具有微观突起的表面上形成多晶金刚石涂层，涂覆有多晶金刚石涂层的表面用作工具端面。

    Polycrystalline diamond cutting tool and method of manufacturing the same
    6.
    发明授权
    Polycrystalline diamond cutting tool and method of manufacturing the same 失效
    多晶金刚石切割工具及其制造方法

    公开(公告)号：US5366522A

    公开(公告)日：1994-11-22

    申请号：US970798

    申请日：1992-11-03

    申请人： Tsutomu Nakamura ,  Yasuyuki Kanada ,  Tetsuo Nakai

    发明人： Tsutomu Nakamura ,  Yasuyuki Kanada ,  Tetsuo Nakai

    IPC分类号： B23B27/14 ,  C04B37/00 ,  C23C16/01 ,  C23C16/27 ,  B24D3/00

    CPC分类号： C04B37/026 ,  B23B27/145 ,  C23C16/01 ,  C23C16/271 ,  C23C16/272 ,  C23C16/274 ,  C23C16/277 ,  B23B2226/315 ,  B23B2240/08 ,  C04B2235/6586 ,  C04B2235/667 ,  C04B2235/963 ,  C04B2237/083 ,  C04B2237/12 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/30 ,  C04B2237/363 ,  C04B2237/401 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/82

    摘要： A polycrystalline diamond cutting tool comprises a tool material of polycrystalline diamond formed by low-pressure vapor deposition, which is bonded to a shank of cemented carbide through a brazing layer. The thickness of the polycrystalline diamond layer is set at 0.1 to 1.0 mm, while that of the brazing layer is set at 10 to 50 .mu.m. The brazing layer is made of a material having a melting point of 950.degree. to 1300.degree. C., which is in the form of an alloy layer containing at least one material selected from metals belonging to the groups IVa, Va, VIa and VIIa of the periodic table and carbides thereof and at least one material selected from Au, Ag, Cu, Pt, Pd and Ni. The polycrystalline diamond cutting tool is improved in heat resistance and tool strength. In order to improve deposition resistance of the cutting tool, the surface roughness of a tool rake face is set to be not more than 0.2 .mu.m in Rmax. A portion of the polycrystalline diamond layer up to a depth of 10 .mu.m from the rake face contains 99 to 100 atomic percent of carbon elements, and 99 to 100% of carbon atoms are diamond-bonded. A surface of the polycrystalline diamond layer which has been in contact with the substrate during formation of the polycrystalline diamond layer defines the rake face, whose surface is subjected to ion beam machining and thereafter treated in the atmosphere at a temperature of 300.degree. to 500.degree. C.

    摘要翻译： 多晶金刚石切割工具包括通过低压气相沉积形成的多晶金刚石的工具材料，其通过钎焊层粘合到硬质合金的柄上。 多晶金刚石层的厚度设定为0.1〜1.0mm，钎焊层的厚度设定为10〜50μm。 钎焊层由熔点为950℃至1300℃的材料制成，其为含有至少一种选自属于IVa，Va，VIa和VIIa族的金属的材料的合金层的形式 周期表及其碳化物和选自Au，Ag，Cu，Pt，Pd和Ni中的至少一种材料。 多晶金刚石切削工具的耐热性和刀具强度提高。 为了提高切削工具的耐沉积性，将工具前刀面的表面粗糙度设定为Rmax以下0.2μm以下。 距离前刀面10μm深的多晶金刚石层的一部分含有99〜100原子％的碳元素，99〜100％的碳原子金刚石键合。 在形成多晶金刚石层期间已经与基板接触的多晶金刚石层的表面限定了表面进行离子束加工的后刀面，然后在大气中在300〜500℃的温度下进行处理 C。

    Diamond sintered body having high strength and high wear-resistance and manufacturing method thereof
    8.
    发明授权
    Diamond sintered body having high strength and high wear-resistance and manufacturing method thereof 失效
    具有高强度和高耐磨性的金刚石烧结体及其制造方法

    公开(公告)号：US5759216A

    公开(公告)日：1998-06-02

    申请号：US786114

    申请日：1997-01-17

    申请人： Yasuyuki Kanada ,  Hirohumi Mizusuna ,  Tsutomu Nakamura ,  Tetsuo Nakai

    发明人： Yasuyuki Kanada ,  Hirohumi Mizusuna ,  Tsutomu Nakamura ,  Tetsuo Nakai

    IPC分类号： B01J3/06 ,  C22C26/00 ,  C09C1/08

    CPC分类号： B01J3/062 ,  C22C26/00 ,  B01J2203/062 ,  B01J2203/0655 ,  B01J2203/0685

    摘要： A method of manufacturing a diamond sintered body includes the following steps: preparing a diamond powder having a particle size within a range of 0.1 to 10 .mu.m, coating the surface of each particle of the diamond powder with a sintering assistant agent including Pd within a range of 0.01 to 40 percent by weight and at least one iron family metal as a remainder, and liquid-phase sintering the coated diamond powder under a high pressure and high temperature condition. In this manner, a diamond sintered body having high strength and high wear-resistance, and containing diamond particles of 80 to 96 percent by volume, can be obtained.

    摘要翻译： 制造金刚石烧结体的方法包括以下步骤：制备粒度在0.1至10μm范围内的金刚石粉末，用包含Pd的烧结助剂将金刚石粉末的每个颗粒的表面涂覆在 范围为0.01〜40重量％，以及至少一种铁族金属作为其余部分，并在高压和高温条件下液相烧结涂覆的金刚石粉末。 以这种方式，可以获得具有高强度和高耐磨性并且含有80至96体积％的金刚石颗粒的金刚石烧结体。