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    Liquid crystal display device
    2.
    发明授权
    Liquid crystal display device 有权
    液晶显示装置

    公开(公告)号：US09025115B2

    公开(公告)日：2015-05-05

    申请号：US13361086

    申请日：2012-01-30

    申请人： Takeshi Harayama ,  Takashi Yoshimoto ,  Katsuhiko Ishii ,  Setsuo Kobayashi ,  Akira Ishii ,  Shinji Tanabe ,  Kiyoshi Sento

    发明人： Takeshi Harayama ,  Takashi Yoshimoto ,  Katsuhiko Ishii ,  Setsuo Kobayashi ,  Akira Ishii ,  Shinji Tanabe ,  Kiyoshi Sento

    IPC分类号： G02F1/1333 ,  G02F1/1335

    CPC分类号： G02F1/133602 ,  G02F1/133308 ,  G02F1/133512 ,  G02F1/133528 ,  G02F1/1368 ,  G02F2001/133331 ,  G02F2201/08

    摘要： Light emitted by a backlight can be prevented from leaking through a chamfered portion of a front window of a liquid crystal display device.An upper polarizing plate is bonded over the counter substrate, and a front window is bonded over the upper polarizing plate with a UV-curable resin adhesive. The front window is chamfered and a light shielding member is formed on the chamfered portion. The UV adhesive exists between the chamfered portion and the surface of the upper polarizing plate or the counter substrate, and an outer end of the polarizing plate exists at a point outer than an outer end of the front window. Since the light shielding member for the chamfered portion is formed, light from the backlight does not penetrate from the chamfered portion. Thus, light leakage at a periphery of a screen can be prevented even when the view angle is large.

    摘要翻译： 可以防止由背光发出的光通过液晶显示装置的前窗的倒角部分泄漏。 上偏振片接合在对置基板上，前窗用紫外线固化树脂粘合剂粘合在上偏振片上。 前窗被倒角，并且在倒角部分上形成遮光构件。 紫外线粘合剂存在于倒角部和上偏振片或相对基板的表面之间，偏振片的外端存在于比前窗的外端外侧的位置。 由于形成了用于倒角部分的遮光构件，所以来自背光源的光不会从倒角部分穿透。 因此，即使视角较大，也可以防止屏幕周边的光泄漏。

    Modified perovskite type composite oxide, method for preparing the same, and composite dielectric material
    3.
    发明授权
    Modified perovskite type composite oxide, method for preparing the same, and composite dielectric material 失效
    改性钙钛矿型复合氧化物，其制备方法和复合电介质材料

    公开(公告)号：US08609748B2

    公开(公告)日：2013-12-17

    申请号：US12737473

    申请日：2009-07-16

    申请人： Shinji Tanabe

    发明人： Shinji Tanabe

    IPC分类号： C08K9/02 ,  C09C3/06

    CPC分类号： C04B35/50 ,  C01B33/12 ,  C01B33/126 ,  C01G23/053 ,  C01P2004/84 ,  C04B35/10 ,  C04B35/4682 ,  C04B35/62655 ,  C04B35/62807 ,  C04B35/62813 ,  C04B35/62815 ,  C04B35/62821 ,  C04B2235/3236 ,  C04B2235/3248 ,  C04B2235/449 ,  C04B2235/5409 ,  C04B2235/768 ,  C08K3/10 ,  C08K3/22 ,  C08K3/34 ,  H01B3/12

    摘要： Provided is a modified perovskite type composite oxide in which the dielectric characteristics are equal to or better than those prior to modification, there is no substantial elution of coating components from the modifying coating components, and change in the specific surface areas over time and elution of the A-site metals are suppressed effectively, while the cracking traits are good. A modified perovskite type composite oxide in which the particle surface of a perovskite type composite oxide is coated with a first component of at least one selected from TiO2 and SiO2 and a second component of at least one selected from a group consisting of Al, Zr, Nd, La, Ce, Pr, and Sm, wherein the coating is formed by hydrolyzing at least one selected from a hydrolyzable TiO2 precursor and a hydrolyzable SiO2 precursor as a source of the first component and a salt of at least one selected from a group consisting of Al, Zr, Nd, La, Ce, Pr, and Sm as a source of the second component, and then calcining them.

    摘要翻译： 提供了一种改性钙钛矿型复合氧化物，其中介电特性等于或优于改性前的改性钙钛矿型复合氧化物，涂层组分不会从改性涂层组分中显着洗脱，并随时间推移改变比表面积 A位金属被有效抑制，裂纹特性良好。 一种改性钙钛矿型复合氧化物，其中钙钛矿型复合氧化物的颗粒表面被选自TiO 2和SiO 2中的至少一种的第一组分和选自Al，Zr， Nd，La，Ce，Pr和Sm，其中通过水解选自可水解TiO 2前体和可水解SiO 2前体中的至少一种作为第一组分的源和选自下组的至少一种的盐， 由Al，Zr，Nd，La，Ce，Pr和Sm组成，作为第二成分的来源，然后煅烧。

    DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    DISPLAY DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    显示装置和液晶显示装置及其制造方法

    公开(公告)号：US20110205472A1

    公开(公告)日：2011-08-25

    申请号：US13029207

    申请日：2011-02-17

    申请人： Setsuo KOBAYASHI ,  Akira Ishii ,  Masanori Katsuyama ,  Shinji Tanabe ,  Kiyoshi Sento ,  Takeharu Furusawa

    发明人： Setsuo KOBAYASHI ,  Akira Ishii ,  Masanori Katsuyama ,  Shinji Tanabe ,  Kiyoshi Sento ,  Takeharu Furusawa

    IPC分类号： G02F1/1335 ,  B32B37/12

    CPC分类号： B32B37/1284 ,  B32B17/06 ,  B32B2037/1253 ,  B32B2307/412 ,  B32B2307/546 ,  B32B2310/0831 ,  B32B2315/08 ,  B32B2457/202 ,  G02F1/133308 ,  G02F2001/133331 ,  G02F2202/28

    摘要： A liquid crystal display panel including liquid crystal sandwiched between a pair of substrates is prepared. A light-transmitting reinforcing plate is prepared. A photocuring resin is provided between the liquid crystal display panel and the reinforcing plate. Light is irradiated to a side surface of a laminated body constituted of the liquid crystal display panel, the reinforcing plate and the photocuring resin. The photocuring resin is arranged to face the liquid crystal in an opposed manner. The light is allowed to advance to the inside of the photocuring resin from an edge portion of the photocuring resin. The light is allowed to advance to the inside of the reinforcing plate from an edge portion of the reinforcing plate, is propagated in the inside of the reinforcing plate, and is irradiated to the photocuring resin from the reinforcing plate at a position away from the edge portion of the reinforcing plate.

    摘要翻译： 准备包含夹在一对基板之间的液晶的液晶显示面板。 制备透光加强板。 在液晶显示面板和加强板之间设置光固化树脂。 照射到由液晶显示面板，加强板和光固化树脂构成的层叠体的侧面。 光固化树脂以相对的方式布置成面对液晶。 允许光从光固化树脂的边缘部分前进到光固化树脂的内部。 允许光从加强板的边缘部分前进到加强板的内侧，在加强板的内部传播，并且在远离边缘的位置处从加强板照射到光固化树脂 加强板的一部分。

    Sensor
    8.
    发明授权
    Sensor 有权
    传感器

    公开(公告)号：US07559224B2

    公开(公告)日：2009-07-14

    申请号：US11640215

    申请日：2006-12-18

    申请人： Takaya Yoshikawa ,  Junji Kawai ,  Kenji Hayashi ,  Shinji Tanabe ,  Noboru Ishida ,  Masataka Taguchi ,  Masashi Ando

    发明人： Takaya Yoshikawa ,  Junji Kawai ,  Kenji Hayashi ,  Shinji Tanabe ,  Noboru Ishida ,  Masataka Taguchi ,  Masashi Ando

    IPC分类号： G01N7/00

    CPC分类号： H01R13/5205 ,  G01N27/4077

    摘要： A sensor comprising a sensor element, a metallic housing holding therewithin the sensor element, an inner tubular member fixed to an axially rearward end of the metallic housing, and an outer tubular member radially surrounding the inner tubular member and having a radially inward crimping section for contact with an outer surface of the inner tubular member, wherein an axially forward end of the crimping section is disposed axially apart from an axially forward end of the outer tubular member by a distance of 1.5 mm or less.

    摘要翻译： 传感器，包括传感器元件，保持在其中的传感器元件的金属壳体，固定到金属壳体的轴向后端的内部管状构件和径向围绕内部管状构件的外部管状构件，并且具有径向向内压接部分 与内部管状构件的外表面接触，其中压接部分的轴向前端与外部管状构件的轴向前端轴向隔开距离为1.5mm或更小。

    DISPLAY DEVICE
    9.
    发明申请
    DISPLAY DEVICE 有权
    显示设备

    公开(公告)号：US20080030666A1

    公开(公告)日：2008-02-07

    申请号：US11833270

    申请日：2007-08-03

    申请人： Hideaki Abe ,  Shinji Tanabe ,  Kouichi Inoue ,  Yasuaki Kondo

    发明人： Hideaki Abe ,  Shinji Tanabe ,  Kouichi Inoue ,  Yasuaki Kondo

    IPC分类号： H05K1/02 ,  H05K5/02

    CPC分类号： H05K3/381 ,  G02F1/13452 ,  G02F2001/133354 ,  H05K1/0269 ,  H05K1/0286 ,  H05K2201/055 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/166 ,  H05K2203/168

    摘要： The present invention can perform, at the time of mounting flexible printed circuit boards on a display substrate, the accurate alignment without wrong mounting. A first alignment mark and a second alignment mark for performing the alignment of a flexible printed circuit board with a display substrate are attached to left and right sides of a group of lines which are formed on the flexible printed circuit board. Further, when at least one of the first alignment mark and the second alignment mark is equally divided into four areas, a shape of the alignment mark in at least one area is a shape obtained by folding back the shape of the alignment mark in other areas.

    摘要翻译： 本发明可以在将柔性印刷电路板安装在显示基板上时进行准确的对准而不会错误地安装。 用于执行柔性印刷电路板与显示基板的对准的第一对准标记和第二对准标记被附接到形成在柔性印刷电路板上的一组线的左侧和右侧。 此外，当第一对准标记和第二对准标记中的至少一个被等分成四个区域时，至少一个区域中的对准标记的形状是通过在其它区域中折回对准标记的形状而获得的形状 。

    Semiconductor device and method of manufacturing the same
    10.
    发明授权
    Semiconductor device and method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号：US06379999B1

    公开(公告)日：2002-04-30

    申请号：US09525517

    申请日：2000-03-15

    申请人： Shinji Tanabe

    发明人： Shinji Tanabe

    IPC分类号： H01L2144

    CPC分类号： H01L24/12 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/485 ,  H01L24/11 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/051 ,  H01L2224/05139 ,  H01L2224/05599 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2224/45099 ,  H01L2924/00

    摘要： A method of manufacturing a semiconductor device in which potential can be applied well to a substrate without the semiconductor device being made less compact. A wafer 11A includes a semiconductor layer 13, a surface oxide film 14 and electrode pads 16 for the substrate. The semiconductor layer 13 is formed on the wafer 11A via an insulating layer 12, and a plurality of same semiconductor circuits are formed collectively at the semiconductor layer 13. The surface oxide film 14 covers the semiconductor layer 13. The electrode pads 16 for the substrate are formed on the surface oxide film 14 in correspondence with the semiconductor circuits. Cut grooves 18 for separating the wafer 11A into chips 10 of the semiconductor circuits are formed in the wafer 11A from the surface oxide film 14 to the substrate. Before the wafer 11A is separated into the chips 10, a conductive layer 17 is formed. The conductive layer 17 is formed from a substrate region 11 of cut groove surfaces 18a and 18b, via the cut groove surfaces 18a and 18b, and reaches the electrode pads 16.

    摘要翻译： 一种半导体器件的制造方法，其中可以将电极很好地应用于不使半导体器件变得不紧凑的衬底。 晶片11A包括半导体层13，表面氧化膜14和用于衬底的电极焊盘16。 半导体层13经由绝缘层12形成在晶片11A上，并且多个相同的半导体电路集中地形成在半导体层13上。表面氧化膜14覆盖半导体层13.用于基板的电极焊盘16 形成在与半导体电路对应的表面氧化膜14上。 用于将晶片11A分离成半导体电路的芯片10的切割槽18形成在晶片11A中，从表面氧化膜14到基板。 在将晶片11A分离成芯片10之前，形成导电层17。 导电层17经由切割槽表面18a和18b由切割槽表面18a和18b的基板区域11形成，并到达电极焊盘16。