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公开(公告)号：US08188597B2
公开(公告)日：2012-05-29
申请号：US12887809
申请日：2010-09-22
IPC分类号： H01L23/34
CPC分类号： H01L24/81 , B23K1/0016 , B23K3/087 , B23K2101/40 , H01L21/4846 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/49894 , H01L24/01 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81001 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19105 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , Y10T29/41 , Y10T29/49117 , H01L2924/00
摘要： A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
摘要翻译： 提供了一种形成芯片组件的固定装置和方法。 夹具组件包括具有开口尺寸以容纳安装在层压板上的芯片的第一板。 固定装置还包括通过至少一个机械紧固机构配合到第一板的第二板。 夹具组件还包括由第一板和第二板的相对表面限定的并由第一板和第二板中的至少一个的凸起台阶部限定的空间。 这个空间与开幕式一致。 该空间的尺寸和形状使得层压体被限制在空间内并且直接邻接第一板和第二板的阶梯部分和相对表面以被限制在X，Y和Z方向上。
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公开(公告)号：US08759151B2
公开(公告)日：2014-06-24
申请号：US13422429
申请日：2012-03-16
IPC分类号： H01L21/00
CPC分类号： H01L24/81 , B23K1/0016 , B23K3/087 , B23K2101/40 , H01L21/4846 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/49894 , H01L24/01 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81001 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19105 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , Y10T29/41 , Y10T29/49117 , H01L2924/00
摘要： A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
摘要翻译： 提供了一种形成芯片组件的固定装置和方法。 夹具组件包括具有开口尺寸以容纳安装在层压板上的芯片的第一板。 固定装置还包括通过至少一个机械紧固机构配合到第一板的第二板。 夹具组件还包括由第一板和第二板的相对表面限定的并由第一板和第二板中的至少一个的凸起台阶部限定的空间。 这个空间与开幕式一致。 该空间的尺寸和形状使得层压体被限制在空间内并且直接邻接第一板和第二板的阶梯部分和相对表面以被限制在X，Y和Z方向上。
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公开(公告)号：US20120070940A1
公开(公告)日：2012-03-22
申请号：US12887809
申请日：2010-09-22
CPC分类号： H01L24/81 , B23K1/0016 , B23K3/087 , B23K2101/40 , H01L21/4846 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/49894 , H01L24/01 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81001 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01076 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19105 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , Y10T29/41 , Y10T29/49117 , H01L2924/00
摘要： A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.
摘要翻译： 提供了一种形成芯片组件的固定装置和方法。 夹具组件包括具有开口尺寸以容纳安装在层压板上的芯片的第一板。 固定装置还包括通过至少一个机械紧固机构配合到第一板的第二板。 夹具组件还包括由第一板和第二板的相对表面限定的并由第一板和第二板中的至少一个的凸起台阶部限定的空间。 这个空间与开幕式一致。 该空间的尺寸和形状使得层压体被限制在空间内并且直接邻接第一板和第二板的阶梯部分和相对表面以被限制在X，Y和Z方向上。
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公开(公告)号：US20070108984A1
公开(公告)日：2007-05-17
申请号：US10595541
申请日：2003-11-12
申请人： Christopher Cline , Edward Yarmchuk , Vincent Arena , Donald Merte , Thomas Picunko , Brian Wojszynski , Charles Hendricks , Michael Scaman , Robert Olyha , Arnold Halperin
发明人： Christopher Cline , Edward Yarmchuk , Vincent Arena , Donald Merte , Thomas Picunko , Brian Wojszynski , Charles Hendricks , Michael Scaman , Robert Olyha , Arnold Halperin
IPC分类号： G01N27/62
CPC分类号： G01R31/2805 , G01R19/0061 , G01R31/302
摘要： A method and apparatus for the non-contact electrical test of both opens and shorts in electronic substrates. Top surface electrical test features are exposed to an ionization source under ambient conditions and the subsequent charge build up is measured as a drain current by probes contacting corresponding bottom surface features. Opens are detected by an absence of a drain current and shorts are detected by turning off the ionization source and re-measuring the bottom surface probes with a varying bias applied to each probe in the array.
摘要翻译： 用于电子基板中的开口和短路的非接触电测试的方法和装置。 顶部表面电测试特征在环境条件下暴露于电离源，随后的电荷积聚通过探针接触相应的底表面特征作为漏极电流测量。 通过不存在漏极电流来检测开路，并且通过关闭电离源并且利用施加到阵列中的每个探针的变化的偏置来重新测量底表面探针来检测短路。
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