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1.发明授权
公开(公告)号：US5244143A
公开(公告)日：1993-09-14
申请号：US869676
申请日：1992-04-16
申请人： Thomas G. Ference , Peter A. Gruber , Bernardo Hernandez , Michael J. Palmer , Arthur R. Zingher
发明人： Thomas G. Ference , Peter A. Gruber , Bernardo Hernandez , Michael J. Palmer , Arthur R. Zingher
CPC分类号： B23K3/0607 , B23K1/20 , H05K3/3468 , B23K2201/40 , H01L2224/11003 , H01L2224/111 , H05K2201/10734 , H05K2203/0113 , H05K2203/0338 , H05K2203/128
摘要： An apparatus and method are described for injection molding solder mounds onto electronic devices. The apparatus has a reservoir for molten solder which is disposed over a cavity in an injection plate. The injection plate is disposed over a mold having an array of cavities therein into which solder in injection molded. The mold is disposed over a workpiece, such as a semiconductor chip or a semiconductor chip packaging substrate. The cavities in the mold are aligned with electrical contact locations on the chip or substrate. The workpiece is heated and the molten solder is forced under gas pressure into the cavity in the injection plate disposed above the array of cavities in the mold. The molten solder is forced into the array of cavities in the mold. The injection plate is advanced to slide over the mold to wipe away the excess solder above the mold at a plurality of wiping apertures in the injection plate. The injection plate is further advanced to a location having a nonsolder wettable surface at which location the injection plate is removed. The mold is then removed to leave solder mounds disposed on the workpiece. The workpiece can be a semiconductor chip, a semiconductor chip packaging substrate or a dummy substrate onto which the injected molded solder adheres such as a polymer layer to form a carrier substrate for a solder mound array which can be subsequently transferred to a substrate such as a semiconductor chip or a semiconductor chip packaging substrate. The apparatus and methods of the present invention can be integrated into an automated manufacturing system for depositing an array of solder mounds onto a substrates.
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公开(公告)号：US5291371A
公开(公告)日：1994-03-01
申请号：US515906
申请日：1990-04-27
申请人： Peter A. Gruber , Arthur R. Zingher
发明人： Peter A. Gruber , Arthur R. Zingher
IPC分类号： H01L21/52 , F28F13/00 , H01L23/36 , H01L23/373 , H01L23/433 , H05K7/20
CPC分类号： H01L23/433 , F28F13/00 , H01L23/3736 , H01L23/3737 , F28F2013/006 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01077 , H01L2924/01322 , H01L2924/1305
摘要： A thermal joint for transferring heat from a first object to a second object contains a first relatively thick layer of high bulk thermal conductivity material and a second relatively thin layer of lubricant. In a preferred embodiment an anti-adhesion coating is also present in the joint. The thermal joint completely fills the gap between the first and second objects while enabling relative sliding motion to compensate for any lateral distortion.
摘要翻译： 用于将热量从第一物体传递到第二物体的热接头包含第一相对厚的高体积导热材料层和第二相对较薄的润滑剂层。 在优选实施例中，接合处也存在抗粘附涂层。 热接头完全填充第一和第二物体之间的间隙，同时实现相对滑动以补偿任何横向变形。
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公开(公告)号：US5388635A
公开(公告)日：1995-02-14
申请号：US883051
申请日：1992-05-08
申请人： Peter A. Gruber , Arthur R. Zingher
发明人： Peter A. Gruber , Arthur R. Zingher
IPC分类号： F28F3/12 , F28F27/02 , H01L23/433 , H01L23/473 , F28F7/00
CPC分类号： F28F9/0278 , F28F3/12 , H01L23/433 , H01L23/473 , F28D2021/0029 , F28F2210/02 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/13034 , H01L2924/1305 , H01L2924/3025 , H01L2924/3511
摘要： A cooling hat for transferring heat from a surface or plurality of heat generating components to a flowing fluid includes a coldsheet, a plurality of manifold layers and springs. The coldsheet is typically a medium-thin metal sheet usually with fine fins or grooves to readily transfer heat to a coolant. Each manifold layer is typically molded rubber with conduits for coolant supply and return. The conduits form a branched hierarchy. The fluid flow is highly parallel and streamlined which achieves ample flow with small hydraulic differential pressure. Springs gently urge the cooling hat against the thermal joints hence against the components. The hat can bend slightly to conform to a curved surface. Typically some compliance is provided by the hat, and other compliance is provided by a thermal joint between each component and the coldsheet. The system is highly self-aligned for counteracting variations.
摘要翻译： 用于将热量从表面或多个发热部件传递到流动流体的冷却帽包括冷片，多个歧管层和弹簧。 冷片通常是中等厚度的金属片，通常具有细的翅片或凹槽，以便将热量传递给冷却剂。 每个歧管层通常是具有用于冷却剂供应和返回的导管的模制橡胶。 导管形成分支层级。 流体流动是高度平行和流线型的，其具有小的液压差压的充足的流量。 弹簧轻轻地将冷却帽推向热接头，从而抵抗部件。 帽子可以稍微弯曲以符合曲面。 通常，帽子提供一些柔顺性，并且通过每个部件和冷片之间的热接头来提供其它柔顺性。 该系统高度自我对齐以抵消变化。
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公开(公告)号：US4730666A
公开(公告)日：1988-03-15
申请号：US858318
申请日：1986-04-30
IPC分类号： H01L23/36 , H01L23/433 , H01L23/467 , F28F7/00 , H01R13/00
CPC分类号： H01L23/467 , F28F19/06 , F28F21/085 , F28F3/048 , H01L23/4338 , F28F2255/02 , F28F2255/14 , H01L2924/0002
摘要： A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is secured adheringly, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. The heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. The finned sheet may be efficiently fabricated by processes analogous to those used to make printed circuits. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately two mils.
摘要翻译： 用于冷却设置在共同基板上的电路芯片的阵列的热交换器形成为具有用于将热从芯片传递到流过翅片的冷却剂的直立翅片的导热材料的柔性片。 片材可以设置在芯片的位置之间设置的波纹，以提高柔性以适应芯片的各个取向。 片材足够大以覆盖芯片阵列，并且通过使用导热油脂将密封件固定到芯片上。 片材气密地密封芯片以免受冷却剂的污染。 热交换器可以由具有镍涂层的铜制成，其中铜提供热传导，并且镍保护铜免受诸如水的腐蚀性冷却剂的影响。 翅片可以通过与用于制造印刷电路的那些类似的工艺被有效地制造。 在热交换器的一个实施例中，翅片厚度，翅片间距和片材厚度大致相等，典型的片材厚度约为2密耳。
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公开(公告)号：US5198189A
公开(公告)日：1993-03-30
申请号：US870152
申请日：1992-04-13
IPC分类号： B22F1/02 , B23K35/14 , C22C1/02 , H01L23/373
CPC分类号： C22C1/02 , B22F1/025 , H01L23/3733 , H01L2924/0002
摘要： A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.
摘要翻译： 液态金属基体热膏包括在低熔点液体金属基体中的非反应导热颗粒的分散体。 颗粒优选是硅，钼，钨或其它在低于约100℃的温度下不与镓反应的材料。优选的液态金属是镓和铟共晶，镓和锡共晶以及镓，铟和锡三元共晶。 颗粒可以用贵金属涂覆以最小化表面氧化并增强颗粒的润湿性。 液体金属基质热膏用作高导热浆料，以与传统的流体冷却系统一起冷却高功率耗散部件。
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公开(公告)号：US5173256A
公开(公告)日：1992-12-22
申请号：US790904
申请日：1991-11-08
IPC分类号： B22F1/02 , C22C1/02 , H01L23/373
CPC分类号： B22F1/025 , C22C1/02 , H01L23/3733 , H01L2924/0002
摘要： A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.
摘要翻译： 液态金属基体热膏包括在低熔点液体金属基体中的非反应导热颗粒的分散体。 颗粒优选是硅，钼，钨或其它在低于约100℃的温度下不与镓反应的材料。优选的液态金属是镓和铟共晶，镓和锡共晶以及镓，铟和锡三元共晶。 颗粒可以用贵金属涂覆以最小化表面氧化并增强颗粒的润湿性。 液体金属基质热膏用作高导热浆料，以与传统的流体冷却系统一起冷却高功率耗散部件。
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公开(公告)号：US5022462A
公开(公告)日：1991-06-11
申请号：US492601
申请日：1990-03-12
IPC分类号： H01L23/433 , H01L23/467
CPC分类号： H01L23/4338 , H01L23/467 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01014 , H01L2924/01078 , H01L2924/15312 , H01L2924/3025
摘要： A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is thermally joined, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. For liquid coolant, the heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately two mils. Another embodiment uses air cooling, and uses metal pin fins bonded to a metal sheet which is moderately thin and flexible. Transverse motion between the sheet and the array of chips is introduced concurrently with the application of pressure between the sheet and the chips to reduce the thickness of the layers of grease between the chips and the sheet, thereby to improve thermal conductivity between the heat exchanger and each of the chips.
摘要翻译： 用于冷却设置在共同基板上的电路芯片的阵列的热交换器形成为具有用于将热从芯片传递到流过翅片的冷却剂的直立翅片的导热材料的柔性片。 引脚散热片可以与空气冷却剂一起使用。 片材可以设置在芯片的位置之间设置的波纹，以提高柔性以适应芯片的各个取向。 片材足够大以覆盖芯片阵列，并且通过使用导热油脂与芯片热连接。 片材气密地密封芯片以免受冷却剂的污染。 对于液体冷却剂，热交换器可以由具有镍涂层的铜制成，其中铜提供热传导，并且镍保护铜免受诸如水的腐蚀性冷却剂的影响。 在热交换器的一个实施例中，翅片厚度，翅片间距和片材厚度大致相等，典型的片材厚度约为2密耳。 另一实施例使用空气冷却，并且使用结合到中等薄度和柔性的金属片的金属销散热片。 片材与芯片阵列之间的横向运动与片材和芯片之间的压力施加同时引入，以减小芯片和片材之间的润滑脂层的厚度，从而改善热交换器和 每个芯片。
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公开(公告)号：US4964458A
公开(公告)日：1990-10-23
申请号：US161880
申请日：1988-02-29
IPC分类号： H01L23/367 , H01L23/433 , H01L23/467
CPC分类号： H01L23/3672 , H01L23/4338 , H01L23/467 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253
摘要： A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with understanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is thermally joined, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. For liquid coolant, the heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately two mils. Another embodiment uses air cooling, and uses metal pin fins bonded to a metal sheet which is moderately thin and flexible. Transverse motion between the sheet and the array of chips is introduced concurrently with the application of pressure between the sheet and the chips to reduce the thickness of the layers of grease between the chips and the sheet, thereby to improve thermal conductivity between the heat exchanger and each of the chips.
摘要翻译： 用于冷却设置在共同基板上的电路芯片阵列的热交换器形成为导热材料的柔性片，其具有用于将热从芯片传递到流过翅片的冷却剂的散热片。 引脚散热片可以与空气冷却剂一起使用。 片材可以设置在芯片的位置之间设置的波纹，以提高柔性以适应芯片的各个取向。 片材足够大以覆盖芯片阵列，并且通过使用导热油脂与芯片热连接。 片材气密地密封芯片以免受冷却剂的污染。 对于液体冷却剂，热交换器可以由具有镍涂层的铜制成，其中铜提供热传导，并且镍保护铜免受诸如水的腐蚀性冷却剂的影响。 在热交换器的一个实施例中，翅片厚度，翅片间距和片材厚度大致相等，典型的片材厚度约为2密耳。 另一实施例使用空气冷却，并且使用结合到中等薄度和柔性的金属片的金属销散热片。 片材与芯片阵列之间的横向运动与片材和芯片之间的压力施加同时引入，以减小芯片和片材之间的润滑脂层的厚度，从而改善热交换器和 每个芯片。
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公开(公告)号：US4685606A
公开(公告)日：1987-08-11
申请号：US861696
申请日：1986-05-09
IPC分类号： H01L23/36 , H01L23/373 , H01L23/433 , H01L23/473 , B23K31/02
CPC分类号： H01L23/3736 , H01L23/433 , H01L23/473 , H01L2224/16 , H01L2924/01014
摘要： A method of joining a thermally conductive element to an electric circuit chip for cooling the chip includes initial steps of forming an oxide-free preform of a fusible metal alloy by extrusion of alloy between two mold blocks or plates. During the extrusion, the oxide coating is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill or section of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity.
摘要翻译： 将导热元件接合到用于冷却芯片的电路芯片的方法包括通过在两个模块或板之间挤出合金来形成易熔金属合金的无氧化物预制件的初始步骤。 在挤出过程中，留下氧化物涂层，使得挤出的合金基本上不含氧化物。 挤压在升至约合金的液相线温度的温度下进行。 预成型件（其可以是薄片形式的片或薄片形式）放置在导热元件和芯片的接合表面之间，然后在压力和升高的温度下沿着界面表面挤出以形成导热 ，无氧化物结合层，导热性优良。
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公开(公告)号：US06426241B1
公开(公告)日：2002-07-30
申请号：US09439112
申请日：1999-11-12
IPC分类号： H01L2144
CPC分类号： H01L21/4857 , H01L21/4867 , H01L2924/0002 , H05K3/101 , H05K3/107 , H05K3/3421 , H05K2201/0305 , H05K2201/09036 , H05K2201/09472 , H05K2203/128 , H01L2924/00
摘要： A method for forming three-dimensional circuitization in a substrate is provided for forming conductive traces and via contacts. In the method, a substrate formed of a substantially insulating material is first provided, grooves and apertures in a top surface of and through the substrate are then formed, followed by filling the grooves and apertures with an electrically conductive material such as a solder. The method can be carried out at a low cost to produce high quality circuit substrates by utilizing an injection molded solder technique or a molten solder screening technique to fill the grooves and the apertures. The grooves and the apertures in the substrate may be formed by a variety of techniques such as chemical etching, physical machining and hot stamping.
摘要翻译： 提供了一种用于在基板中形成三维电路的方法，用于形成导电迹线和通孔触点。 在该方法中，首先提供由基本绝缘材料形成的基板，然后形成在基板的顶表面中的沟槽和孔，然后用导电材料（例如焊料）填充凹槽和孔。 该方法可以以低成本进行，以通过使用注射成型焊接技术或熔融焊料筛选技术来填充槽和孔来产生高质量的电路基板。 衬底中的凹槽和孔可以通过各种技术形成，例如化学蚀刻，物理加工和热冲压。
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