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    Low temperature fired, lead-free thick film heating element
    1.
    发明授权
    Low temperature fired, lead-free thick film heating element 有权
    低温烧制，无铅厚膜加热元件

    公开(公告)号：US07459104B2

    公开(公告)日：2008-12-02

    申请号：US11488173

    申请日：2006-07-18

    申请人： Timothy Russell Olding ,  David Andrew Barrow ,  Mary Ann Ruggiero

    发明人： Timothy Russell Olding ,  David Andrew Barrow ,  Mary Ann Ruggiero

    IPC分类号： H01B1/00

    CPC分类号： C23C28/00 ,  C23C18/1212 ,  C23C18/1216 ,  C23C18/1225 ,  C23C18/1245 ,  C23C18/1254 ,  C23C18/127 ,  C23C26/00 ,  C23C28/04 ,  C23C28/042 ,  C23C30/00 ,  H01C17/06526 ,  H05B3/141 ,  H05B3/265 ,  H05B2203/013 ,  H05B2203/017 ,  Y10T428/24917

    摘要： A lead free, thick film heating element. Known thick film heating elements contain environmentally hazardous material such as lead. This is particularly problematic when manufacturing thick film heating elements, as lead is often used in thick film formulations to allow the glass-based thick film to be processed at low firing temperatures. Using composite sol gel technology, the present invention provides a method to produce a lightweight mica-based thick film heating element based on thick film materials that are free from lead or cadmium. This mica-based element is lightweight, has the performance advantages of a thick film heating element, and may be processed at a low temperature using thick film materials. Particularly, the present invention provides a lightweight heating element comprised of a mica-based substrate material, a resistive thick film that can be produced by composite sol gel technology, optionally a conductive thick film which is used to make electrical connection to the resistive element, and optionally a topcoat which is used to provide protection against moisture and oxidation. This element is lightweight, provides efficient, rapid heat up and cool down, can be designed to provide even temperature distribution, and delivers power at lower operating temperatures resulting in increased element safety.

    摘要翻译： 无铅，厚膜加热元件。 已知的厚膜加热元件含有环境有害物质，如铅。 当制造厚膜加热元件时，这是特别有问题的，因为铅通常用于厚膜配方中以允许在低烧制温度下处理玻璃基厚膜。 使用复合溶胶凝胶技术，本发明提供一种制备基于不含铅或镉的厚膜材料的轻质云母基厚膜加热元件的方法。 这种云母元素是轻质的，具有厚膜加热元件的性能优点，并且可以使用厚膜材料在低温下加工。 特别地，本发明提供了一种轻质加热元件，其包括云母基材料，可通过复合溶胶凝胶技术制备的电阻厚膜，可选地用于与电阻元件电连接的导电厚膜， 和任选的面漆，其用于提供防止水分和氧化的保护。 该元件重量轻，提供高效，快速的加热和冷却，可设计为提供均匀的温度分布，并在较低的工作温度下提供功率，从而提高元件安全性。

    Thick film high temperature thermoplastic insulated heating element
    3.
    发明申请
    Thick film high temperature thermoplastic insulated heating element 有权
    厚膜高温热塑性绝缘加热元件

    公开(公告)号：US20090272731A1

    公开(公告)日：2009-11-05

    申请号：US12385889

    申请日：2009-04-22

    申请人： Timothy Russell Olding ,  Mary Ann Ruggiero

    发明人： Timothy Russell Olding ,  Mary Ann Ruggiero

    IPC分类号： H05B3/02 ,  B05D5/12

    CPC分类号： H05B3/265 ,  C08G2650/40 ,  C08L71/00 ,  C08L79/08 ,  C08L81/02 ,  H05B2203/011 ,  H05B2203/013 ,  H05B2203/017 ,  H05B2203/028 ,  C08L2666/20

    摘要： The present invention provides an integrated thick film heating element on a substrate made from high temperature melt-flowable thermoplastic polymer/powder additive formulations which form an electrically insulating thermoplastic dielectric coating on the substrate, and electrically resistive lead free films and electrically conductive film formulations that are deposited and fired to form an integrated thick film heating element on a substrate at a processing temperature well below 600° C. This thick film heating element is formed on a substrate material coated first with the electrically insulating, filled melt flowable high temperature thermoplastic polymer/powder composite layer on which is deposited the electrically resistive lead free thick film that is capable of operating over a wide range of power densities for consumer and industrial heating element applications, with suitable electrical insulation properties under temperature cycling to for example 250° C.

    摘要翻译： 本发明提供了一种在由基材上形成电绝缘的热塑性介电涂层的高温可熔融流动的热塑性聚合物/粉末添加剂配方制成的基底上的集成的厚膜加热元件，以及电阻无铅膜和导电膜配方， 沉积和烧制，以在远低于600℃的加工温度下在基底上形成一体的厚膜加热元件。该厚膜加热元件形成在首先涂覆有电绝缘填充的可熔融流动的高温热塑性聚合物的基材上 /粉末复合层，其上沉积有电阻无铅厚膜，其能够在用于消费者和工业加热元件应用的宽范围的功率密度下工作，并且在温度循环到例如250℃时具有合适的电绝缘性能。

    Thick film high temperature thermoplastic insulated heating element
    4.
    发明授权
    Thick film high temperature thermoplastic insulated heating element 有权
    厚膜高温热塑性绝缘加热元件

    公开(公告)号：US08653423B2

    公开(公告)日：2014-02-18

    申请号：US12385889

    申请日：2009-04-22

    申请人： Timothy Russell Olding ,  Mary Ann Ruggiero

    发明人： Timothy Russell Olding ,  Mary Ann Ruggiero

    IPC分类号： H05B3/02

    CPC分类号： H05B3/265 ,  C08G2650/40 ,  C08L71/00 ,  C08L79/08 ,  C08L81/02 ,  H05B2203/011 ,  H05B2203/013 ,  H05B2203/017 ,  H05B2203/028 ,  C08L2666/20

    摘要： The present invention provides an integrated thick film heating element on a substrate made from high temperature melt-flowable thermoplastic polymer/powder additive formulations which form an electrically insulating thermoplastic dielectric coating on the substrate, and electrically resistive lead free films and electrically conductive film formulations that are deposited and fired to form an integrated thick film heating element on a substrate at a processing temperature well below 600° C. This thick film heating element is formed on a substrate material coated first with the electrically insulating, filled melt flowable high temperature thermoplastic polymer/powder composite layer on which is deposited the electrically resistive lead free thick film that is capable of operating over a wide range of power densities for consumer and industrial heating element applications, with suitable electrical insulation properties under temperature cycling to for example 250° C.

    摘要翻译： 本发明提供了一种在由基材上形成电绝缘的热塑性介电涂层的高温可熔融流动的热塑性聚合物/粉末添加剂配方制成的基底上的集成的厚膜加热元件，以及电阻无铅膜和导电膜配方， 沉积和烧制，以在远低于600℃的加工温度下在基底上形成一体的厚膜加热元件。该厚膜加热元件形成在首先涂覆有电绝缘填充的可熔融流动的高温热塑性聚合物的基材上 /粉末复合层，其上沉积有电阻无铅厚膜，其能够在用于消费者和工业加热元件应用的宽范围的功率密度下工作，并且在温度循环到例如250℃时具有合适的电绝缘性能。