FILM FORMATION METHOD AND APPARATUS FOR SEMICONDUCTOR PROCESS
    1.
    发明申请
    FILM FORMATION METHOD AND APPARATUS FOR SEMICONDUCTOR PROCESS 审中-公开
    薄膜形成方法和半导体工艺设备

    公开(公告)号:US20150184293A1

    公开(公告)日:2015-07-02

    申请号:US14644703

    申请日:2015-03-11

    Abstract: A film formation method performs a supply cycle of sequentially supplying two kinds of reactive gases inside a vacuum container to form a thin film on the substrate. The method includes placing the substrate, including a depressed portion formed thereon, on a table, then adjusting a temperature of the substrate to a temperature at which a first reactive gas is adsorbed and condensed, then supplying the first reactive gas and thereby depositing a condensed substance of the first reactive gas on the substrate, then rotating the table, then partly vaporizing the condensed substance by supplying a heated gas to the substrate; and then supplying a second reactive gas in an activated state to the substrate and thereby causing the second reactive gas to react with the condensed substance.

    Abstract translation: 成膜方法进行在真空容器内依次供给两种反应气体的供给循环,在基板上形成薄膜。 该方法包括将包括形成在其上的凹陷部分的基板放置在工作台上,然后将衬底的温度调节到第一反应气体被吸附和冷凝的温度,然后提供第一反应气体,从而沉积冷凝 然后旋转工作台,然后通过向衬底提供加热的气体来部分蒸发冷凝物质; 然后将处于活化状态的第二反应气体供给到基板,从而使第二反应气体与冷凝物质反应。

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