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公开(公告)号：US09981914B2
公开(公告)日：2018-05-29
申请号：US15720150
申请日：2017-09-29
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Jiro Hikida , Kazuya Someya , Koichi Misumi , Dai Shiota
IPC: C07D233/56 , C07D233/60 , B01J20/22 , B01J20/26 , B01J20/32 , H01L29/786 , C09D133/14 , G02F1/1335 , H01L27/32 , G02F1/1368 , H01L51/52
Abstract: To provide a hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the hydrogen barrier film forming composition; and an electronic element provided with the hydrogen barrier film. A compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. Furthermore, the hydrogen barrier film forming composition is prepared by blending the above-mentioned hydrogen barrier agent into the base material component. In addition, the hydrogen barrier film is formed using the hydrogen barrier film forming composition.
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公开(公告)号：US20150338734A1
公开(公告)日：2015-11-26
申请号：US14758199
申请日：2013-12-25
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Kunihiro Noda , Hiroki Chisaka , Dai Shiota , Kazuya Someya
CPC classification number: G03F7/0041 , C07C323/47 , C07D209/86 , C07D233/56 , C07D233/60 , C08G73/1042 , C08G73/105 , C08G73/1067 , C08G73/1071 , C08G73/1078 , C08K5/33 , C08K5/34 , C09D179/08 , G03F7/0045 , G03F7/0387 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , C08K5/3445
Abstract: The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.
Abstract translation: 本发明提供一种能量敏感性树脂组合物，其中使用所述组合物的聚酰亚胺薄膜或聚酰亚胺模塑制品的制造方法以及形成所述组合物的图案的方法。 该组合物即使通过在低温下进行热处理也提供具有优异的耐热性和低介电常数的聚酰亚胺树脂。 该组合物含有通过使四羧酸二酐和二胺，溶剂和通过光和/或热的作用分解并产生碱和/或酸的化合物（A）反应而获得的聚酰胺酸。 制造聚酰亚胺膜或聚酰亚胺模塑制品的方法包括形成包含该组合物的涂膜或模制品，并通过曝光或加热分解膜或产品中的化合物（A）。 顺序形成图案的方法包括成膜，选择性地曝光，显影和加热薄膜或产品。
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3.发明授权公开(公告)号：US10767017B2
公开(公告)日：2020-09-08
申请号：US15855291
申请日：2017-12-27
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Kunihiro Noda , Hiroki Chisaka , Kazuya Someya , Dai Shiota
IPC: C08L83/14 , C08G77/18 , C09D183/06 , C08G77/08 , C08L83/10 , C08G77/42 , C08L83/16 , C08G77/60 , C07F7/21
Abstract: A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component including at least one of (I) and (II) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound): (I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure, and (II) a mixture of a resin having a polysilane structure and a resin having a polysiloxane structure.
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公开(公告)号：US10023540B2
公开(公告)日：2018-07-17
申请号：US15720150
申请日：2017-09-29
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Jiro Hikida , Kazuya Someya , Koichi Misumi , Dai Shiota
IPC: C07D233/56 , C07D233/60 , B01J20/22 , B01J20/26 , B01J20/32 , H01L29/786 , C09D133/14 , G02F1/1335 , H01L27/32 , G02F1/1368 , H01L51/52
Abstract: To provide a hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the hydrogen barrier film forming composition; and an electronic element provided with the hydrogen barrier film. A compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. Furthermore, the hydrogen barrier film forming composition is prepared by blending the above-mentioned hydrogen barrier agent into the base material component. In addition, the hydrogen barrier film is formed using the hydrogen barrier film forming composition.
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5.发明申请METHOD OF PRODUCING POLYIMIDE RESIN, METHOD OF PRODUCING POLYIMIDE COATING, METHOD OF PRODUCING POLYAMIC ACID SOLUTION, POLYIMIDE COATING, AND POLYAMIC ACID SOLUTION 有权生产聚酰胺树脂的方法，制备聚酰亚胺涂料的方法，制备聚酰胺溶液的方法，聚酰亚胺涂料和聚氨酯溶液公开(公告)号：US20140058036A1
公开(公告)日：2014-02-27
申请号：US13971003
申请日：2013-08-20
Applicant: Tokyo Ohka Kogyo Co., Ltd.
Inventor： Kunihiro Noda , Hiroki Chisaka , Dai Shiota , Kazuya Someya
IPC: C09D179/08
CPC classification number: C09D179/08 , C08G69/26 , C08G73/1028 , C08G73/1032 , C08G73/1067 , C08L79/08 , C08L2666/20 , G02F1/133723
Abstract: A polyimide resin produced by heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N′,N′-tetramethylurea.
Abstract translation: 通过加热在N，N，N'，N'-四甲基脲中由四羧酸二酐组分和二胺组分反应得到的聚酰胺酸制得的聚酰亚胺树脂。
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Patent Agency Ranking
公开(公告)号：US11142629B2
公开(公告)日：2021-10-12
申请号：US16362344
申请日：2019-03-22
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Jiro Hikida , Kazuya Someya , Koichi Misumi , Dai Shiota
Abstract: A hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the composition; and an electronic element provided with the hydrogen barrier film. A salt compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. The composition is prepared by blending the hydrogen barrier agent into the base material component. The hydrogen barrier film is formed using the hydrogen barrier film forming composition.
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公开(公告)号：US10747113B2
公开(公告)日：2020-08-18
申请号：US15855102
申请日：2017-12-27
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Dai Shiota , Hiroki Chisaka , Kunihiro Noda , Kazuya Someya
IPC: G03F7/11 , G03F7/075 , G03F7/30 , C07F7/08 , C09D183/06 , C08G77/18 , C09D183/10 , G03F7/32 , G03F7/20 , C08G77/42
Abstract: A method of pattern formation. The method is capable of inhibiting a post-development residue from remaining on a support equipped with an electrode, and a method of producing a polysilane-polysiloxane resin precursor that is suitable for use in the method of pattern formation. The method of pattern formation includes forming a film of a silicon-containing composition on the support equipped with an electrode forming a film of a resin composition on the film of a silicon-containing composition, and forming the film of a resin composition into a pattern.
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公开(公告)号：US10364372B2
公开(公告)日：2019-07-30
申请号：US15856659
申请日：2017-12-28
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Yasushi Fujii , Kunihiro Noda , Hiroki Chisaka , Kazuya Someya , Koichi Misumi , Dai Shiota
IPC: C08G77/62 , C09D183/16 , H01L21/02 , C08L83/16
Abstract: A composition capable of stably providing a high-quality siliceous film even under relatively low-temperature heating conditions, and a method of using the composition for forming a siliceous film. The composition includes a polysilazane and an imidazole group-containing compound represented by Formula (B).
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9.发明授权公开(公告)号：US11718717B2
公开(公告)日：2023-08-08
申请号：US17005117
申请日：2020-08-27
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Kunihiro Noda , Hiroki Chisaka , Kazuya Someya , Dai Shiota
IPC: C08G77/42 , C08G77/18 , C09D183/06 , C08G77/08 , C08L83/10 , C08L83/16 , C08L83/14 , C08G77/60 , C07F7/21 , C09D183/04 , C09D183/10 , C08G77/04 , C08G77/06
CPC classification number: C08G77/18 , C08G77/08 , C08G77/42 , C08G77/60 , C08L83/10 , C08L83/14 , C08L83/16 , C09D183/06 , C07F7/21 , C08G77/04 , C08G77/06 , C09D183/04 , C09D183/10 , C08L83/16 , C08L83/00
Abstract: A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component includes (I) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound):
(I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure.-
公开(公告)号：US11413682B2
公开(公告)日：2022-08-16
申请号：US16670537
申请日：2019-10-31
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Naozumi Matsumoto , Kazuya Someya , Dai Shiota
Abstract: To provide a method for producing surface-modified metal oxide fine particles, which can produce surface-modified metal oxide fine particles having excellent dispersion stability in dispersion liquids having various compositions; a method for producing improved metal oxide fine particles, suitable as a method for producing metal oxide fine particles to be surface-modified in production of the surface-modified metal oxide fine particles; surface-modified metal oxide fine particles which can be produced by the method for producing surface-modified metal oxide fine particles; and a metal oxide fine particle dispersion liquid including the surface-modified metal oxide fine particles. Surface-modified metal oxide fine particles are produced by a method including coating at least a part of surfaces of metal oxide fine particles with a carboxylic acid compound having a certain structure substituted with an amino group which may be cyclic, and/or carboxylate thereof.
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