公开(公告)号：US11912889B2

公开(公告)日：2024-02-27

申请号：US17607182

申请日：2020-05-13

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Kunihiro Noda ,  Takehiro Seshimo ,  Dai Shiota

IPC: C08G77/60 ,  B05D3/02 ,  C09D183/16 ,  C09D183/08

CPC classification number: C09D183/16 ,  C08G77/60 ,  C09D183/08

Abstract: The present invention aims to provide: a novel silicon-containing polymer that is alkali soluble or is soluble in an alkaline aqueous solution by using heat, etc.; a film-forming composition including the silicon-containing polymer; a method for forming a silicon-containing polymer coating using the film-forming composition; a method for forming a silica coating using the film-forming composition; and a production method for the silicon-containing polymer. The silicon-containing polymer including at least either a polysiloxane chain or oligosiloxane chain or a polysilane chain or oligosilane chain in the molecular chain thereof has a group that has e.g., a carboxy or carboxylic acid ester group and a sulfide group, introduced to the molecular chain as a result of an ene-thiol reaction.

公开(公告)号：US10767017B2

公开(公告)日：2020-09-08

申请号：US15855291

申请日：2017-12-27

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Kunihiro Noda ,  Hiroki Chisaka ,  Kazuya Someya ,  Dai Shiota

IPC: C08L83/14 ,  C08G77/18 ,  C09D183/06 ,  C08G77/08 ,  C08L83/10 ,  C08G77/42 ,  C08L83/16 ,  C08G77/60 ,  C07F7/21

Abstract: A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component including at least one of (I) and (II) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound): (I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure, and (II) a mixture of a resin having a polysilane structure and a resin having a polysiloxane structure.

公开(公告)号：US10570269B2

公开(公告)日：2020-02-25

申请号：US15746348

申请日：2016-07-15

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Kunihiro Noda ,  Hiroki Chisaka ,  Koichi Misumi ,  Dai Shiota

IPC: C08K5/3445 ,  C07D233/58 ,  C07D233/60 ,  C08L101/00 ,  C08K3/013 ,  C08F2/48 ,  C08F220/06 ,  C08F220/18 ,  C08F2/44 ,  C08F2/46 ,  C08J3/24

Abstract: A composition which contains microparticles and does not undergo the long-term process of aggregation of the microparticles during storage of the composition. An imidazole compound having a specific structure is added to a composition containing microparticles having a volume average particle diameter of 3000 nm or less. The composition may contain a base material component. The base material component may be a heat-curable or photocurable base material component. The microparticles may be inorganic particles and/or organic particles.

公开(公告)号：US10336708B2

公开(公告)日：2019-07-02

申请号：US15506681

申请日：2015-08-27

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Tatsuro Ishikawa ,  Kunihiro Noda ,  Yasuhide Ohuchi ,  Hiroki Chisaka ,  Dai Shiota ,  Yukitsugu Maeda ,  Takafumi Imoto ,  Kouhei Fujita ,  Yasuyuki Akai

IPC: C07D233/60 ,  C23C22/02 ,  C23C22/05 ,  C23F11/00 ,  G03F7/004 ,  G03F7/039 ,  H05K3/28 ,  C08K5/3445 ,  G03F7/031 ,  G03F7/038 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H05K1/09 ,  H05K3/46

Abstract: A novel imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. A metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.

公开(公告)号：US10023540B2

公开(公告)日：2018-07-17

申请号：US15720150

申请日：2017-09-29

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Jiro Hikida ,  Kazuya Someya ,  Koichi Misumi ,  Dai Shiota

IPC: C07D233/56 ,  C07D233/60 ,  B01J20/22 ,  B01J20/26 ,  B01J20/32 ,  H01L29/786 ,  C09D133/14 ,  G02F1/1335 ,  H01L27/32 ,  G02F1/1368 ,  H01L51/52

Abstract: To provide a hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the hydrogen barrier film forming composition; and an electronic element provided with the hydrogen barrier film. A compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. Furthermore, the hydrogen barrier film forming composition is prepared by blending the above-mentioned hydrogen barrier agent into the base material component. In addition, the hydrogen barrier film is formed using the hydrogen barrier film forming composition.

公开(公告)号：US09890250B2

公开(公告)日：2018-02-13

申请号：US14716581

申请日：2015-05-19

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Kunihiro Noda ,  Hiroki Chisaka ,  Dai Shiota ,  Masaru Shida

IPC: C08G73/22 ,  C08G73/00

CPC classification number: C08G73/22

Abstract: A method for producing a polybenzoxazole resin, in which even when a polybenzoxazole precursor is heat treated at a low temperature, a polybenzoxazole resin that is excellent in mechanical properties, such as tensile elongation, and in chemical resistance, is suppressed in terms of coloration, and is high in transparency can be produced. A polybenzoxazole resin is formed by heating a polybenzoxazole precursor which is obtained by allowing an aromatic diaminediol and a diformyl compound or a dicarboxylic acid dihalide, to react with each other in a solvent containing an amide compound or a urea compound each having a specified structure, at 120° C. to 350° C.

公开(公告)号：US09683150B2

公开(公告)日：2017-06-20

申请号：US14636428

申请日：2015-03-03

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Yoshinori Tadokoro ,  Hiroki Chisaka ,  Kunihiro Noda ,  Dai Shiota

IPC: C09J173/02 ,  C09J163/00 ,  C09J163/04 ,  C09J165/00 ,  C09J167/00 ,  C09J187/00 ,  C08G59/40 ,  C08G59/42 ,  C08G59/50 ,  C08G59/62 ,  C08K7/02

CPC classification number: C09J173/02 ,  C08G59/405 ,  C08G59/42 ,  C08G59/5073 ,  C08G59/62 ,  C08K7/02 ,  C09J163/00 ,  C09J163/04 ,  C09J165/00 ,  C09J167/00 ,  C09J187/005

Abstract: A curable composition obtained by blending a polymerizable compound (A) having predetermined types of polymerizable functional groups, a reactive compound (B) having predetermined types of reactive functional groups, a compound (C) which is an imidazolyl group-containing compound having a predetermined structure, and a compound (D) which is an oxime compound or an oxime ester compound having a predetermined structure.

公开(公告)号：US20150252229A1

公开(公告)日：2015-09-10

申请号：US14636428

申请日：2015-03-03

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Yoshinori Tadokoro ,  Hiroki Chisaka ,  Kunihiro Noda ,  Dai Shiota

IPC: C09J173/02 ,  C09J187/00 ,  C09J165/00 ,  C09J167/00 ,  C09J163/00 ,  C09J163/04

CPC classification number: C09J173/02 ,  C08G59/405 ,  C08G59/42 ,  C08G59/5073 ,  C08G59/62 ,  C08K7/02 ,  C09J163/00 ,  C09J163/04 ,  C09J165/00 ,  C09J167/00 ,  C09J187/005

Abstract: A curable composition obtained by blending a polymerizable compound (A) having predetermined types of polymerizable functional groups, a reactive compound (B) having predetermined types of reactive functional groups, a compound (C) which is an imidazolyl group-containing compound having a predetermined structure, and a compound (D) which is an oxime compound or an oxime ester compound having a predetermined structure.

Abstract translation: 将具有预定类型的可聚合官能团的可聚合化合物（A），具有预定类型的反应性官能团的反应性化合物（B），具有预定的含咪唑基的化合物的化合物（C） 和具有预定结构的肟化合物或肟酯化合物的化合物（D）。

公开(公告)号：US20140058036A1

公开(公告)日：2014-02-27

申请号：US13971003

申请日：2013-08-20

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Kunihiro Noda ,  Hiroki Chisaka ,  Dai Shiota ,  Kazuya Someya

IPC: C09D179/08

CPC classification number: C09D179/08 ,  C08G69/26 ,  C08G73/1028 ,  C08G73/1032 ,  C08G73/1067 ,  C08L79/08 ,  C08L2666/20 ,  G02F1/133723

Abstract: A polyimide resin produced by heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N′,N′-tetramethylurea.

Abstract translation: 通过加热在N，N，N'，N'-四甲基脲中由四羧酸二酐组分和二胺组分反应得到的聚酰胺酸制得的聚酰亚胺树脂。

公开(公告)号：US11718587B2

公开(公告)日：2023-08-08

申请号：US16648585

申请日：2018-09-26

Applicant: TOKYO OHKA KOGYO CO., LTD. ,  Daicel Corporation

Inventor： Kunihiro Noda ,  Hiroki Chisaka ,  Issei Suzuki ,  Jiro Hikida ,  Dai Shiota ,  Kieko Hanano ,  Kyohei Ishida ,  Tsutomu Watanabe ,  Kazuhiro Uehara

IPC: C07D233/60 ,  C07D233/58

CPC classification number: C07D233/60 ,  C07D233/58

Abstract: A novel compound suitable as an epoxy curing catalyst; an epoxy curing catalyst using the compound; and a method for producing the compound. A compound represented by formula (1) in which Xm+ represents an m valent counter cation, R1 represents an aromatic group which may have a substituent; R2 represents an alkylene group which may have a substituent; R3 represents a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonic acid ester group, a phosphino group, a phosphinyl group, a phosphonic acid ester group or an organic group; m represents an integer of 1 or more; n represents an integer of 0-3; and R2 may bond with R1 to form a cyclic structure.