公开(公告)号：US07977138B1

公开(公告)日：2011-07-12

申请号：US12929795

申请日：2011-02-16

申请人： Hu Meng ,  Hiroto Osaki ,  Tetsushi Nishio ,  Kiyokazu Itoi

发明人： Hu Meng ,  Hiroto Osaki ,  Tetsushi Nishio ,  Kiyokazu Itoi

IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L31/0203

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device includes a semiconductor substrate (11) on which a light receiving part (12) (or a light emitting part) and electrodes (13) are formed, and a translucent plate (2) bonded on the light receiving part (12) with a translucent adhesive (5), the semiconductor substrate (11) having a plurality of convex portions (31) formed so as to separate the light receiving part (12) and the electrodes (13) and have proper gaps (32) therebetween.

摘要翻译： 光学器件包括：半导体衬底（11），其上形成有光接收部分（12）（或发光部分）和电极（13）;以及半透明板（2），其接合在光接收部分（12）上， 通过半透明粘合剂（5），半导体衬底（11）具有形成为分离光接收部分（12）和电极（13）的多个凸部（31），并且在它们之间具有适当的间隙（32）。

公开(公告)号：US07646539B2

公开(公告)日：2010-01-12

申请号：US12401904

申请日：2009-03-11

申请人： Kiyokazu Itoi ,  Tetsushi Nishio ,  Yutaka Harada ,  Tomoko Komatsu ,  Masashi Kuroda

发明人： Kiyokazu Itoi ,  Tetsushi Nishio ,  Yutaka Harada ,  Tomoko Komatsu ,  Masashi Kuroda

IPC分类号： G02B27/10 ,  G02B7/02 ,  G03B17/00

CPC分类号： G02B1/14 ,  G02B1/105

摘要： An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.

摘要翻译： 光学装置包括基板，形成在基板的元件形成区域中的多个光学元件，在元件形成区域上形成为与多个光学元件对应的多个透镜，以及形成为 以覆盖多个透镜。 在元件形成区域外的区域中的保护层上形成保持构件。 保持构件保持透明构件的底面。 保护层和透明构件之间的间隙填充有粘合剂。

公开(公告)号：US07595540B2

公开(公告)日：2009-09-29

申请号：US11488062

申请日：2006-07-18

申请人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

发明人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

IPC分类号： H01L27/14 ,  H01L31/00

CPC分类号： H01L27/14618 ,  B81B7/0077 ,  B81C2203/0109 ,  B81C2203/058 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48997 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device including a package (2) having a plurality of wall portions (9a) and a plurality of conductor portions (4), a semiconductor element such as a solid-state image pickup device (1) mounted in an internal space of the base, thin metal wires (5) electrically connecting the semiconductor element and the conductor portions (4) between the wall portions (9a), a resin sealing material (7) implanted in the spaces between the wall portions (9a), and a closing member such as a cover glass (6). The region for connecting the thin metal wires (5) and the wall portion (9a) region overlap each other, so that the device can be reduced in size and in height. The cover glass (6) can not move easily from the correct position because the wall portions (9a) serve as supporting columns, thereby improving the yield.

摘要翻译： 一种半导体器件，包括具有多个壁部分（9a）和多个导体部分（4）的封装（2），诸如固态图像拾取器件（1）的半导体元件，其安装在 电连接半导体元件和壁部分之间的导体部分（4）的薄金属线（5），植入在壁部分（9a）之间的空间中的树脂密封材料（7） 诸如盖玻璃（6）的构件。 用于连接细金属丝（5）和壁部（9a）区域的区域彼此重叠，使得该装置的尺寸和高度可以减小。 由于壁部（9a）作为支柱，因此盖玻璃（6）不能容易地从正确的位置移动，从而提高产量。

公开(公告)号：US20090237796A1

公开(公告)日：2009-09-24

申请号：US12401904

申请日：2009-03-11

申请人： Kiyokazu ITOI ,  Tetsushi Nishio ,  Yutaka Harada ,  Tomoko Komatsu ,  Masashi Kuroda

发明人： Kiyokazu ITOI ,  Tetsushi Nishio ,  Yutaka Harada ,  Tomoko Komatsu ,  Masashi Kuroda

IPC分类号： G02B1/10 ,  B05D5/06 ,  C08F2/46

CPC分类号： G02B1/14 ,  G02B1/105

摘要： An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.

摘要翻译： 光学装置包括基板，形成在基板的元件形成区域中的多个光学元件，在元件形成区域上形成为与多个光学元件对应的多个透镜，以及形成为 以覆盖多个透镜。 在元件形成区域外的区域中的保护层上形成保持构件。 保持构件保持透明构件的底面。 保护层和透明构件之间的间隙填充有粘合剂。

公开(公告)号：US20070109439A1

公开(公告)日：2007-05-17

申请号：US11540753

申请日：2006-10-02

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： H04N5/225

CPC分类号： H01L27/14623 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.

摘要翻译： 半导体图像感测元件具有包括图像感测区域，外围电路区域，设置在外围电路区域中的多个电极部分和设置在图像感测区域上的多个微透镜的半导体元件和具有 至少覆盖图像感测区域并通过透明结合部件粘合在微透镜上的构造。 光学构件的侧表面区域形成有用于防止来自侧表面区域的反射光束或散射光束照射摄像区域的遮光膜。

公开(公告)号：US20070018301A1

公开(公告)日：2007-01-25

申请号：US11488062

申请日：2006-07-18

申请人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

发明人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  B81B7/0077 ,  B81C2203/0109 ,  B81C2203/058 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48997 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device including a package (2) having a plurality of wall portions (9a) and a plurality of conductor portions (4), a semiconductor element such as a solid-state image pickup device (1) mounted in an internal space of the base, thin metal wires (5) electrically connecting the semiconductor element and the conductor portions (4) between the wall portions (9a), a resin sealing material (7) implanted in the spaces between the wall portions (9a), and a closing member such as a cover glass (6). The region for connecting the thin metal wires (5) and the wall portion (9a) region overlap each other, so that the device can be reduced in size and in height. The cover glass (6) can not move easily from the correct position because the wall portions (9a) serve as supporting columns, thereby improving the yield.

摘要翻译： 一种半导体器件，包括具有多个壁部分（9a）和多个导体部分（4）的封装（2），诸如固态图像拾取器件（1）的半导体元件，其安装在 所述底座，将所述半导体元件与所述壁部（9a）之间的所述导体部（4）电连接的薄金属线（5），植入在所述壁部（9a）之间的空间中的树脂密封材料（7） 以及诸如盖玻璃（6）的封闭构件。 用于连接细金属丝（5）和壁部（9a）区域的区域彼此重叠，使得该装置的尺寸和高度可以减小。 由于壁部（9a）用作支柱，因此盖玻璃（6）不能容易地从正确的位置移动，从而提高产量。

公开(公告)号：US20050274882A1

公开(公告)日：2005-12-15

申请号：US11137549

申请日：2005-05-26

申请人： Masanori Minamio ,  Kiyokazu Itoi

发明人： Masanori Minamio ,  Kiyokazu Itoi

IPC分类号： H01L27/14 ,  H01J5/02 ,  H01L23/12 ,  H01L23/28 ,  H01L31/02 ,  H01S5/022

CPC分类号： H01S5/02208 ,  H01L2224/48091 ,  H01S5/0224 ,  H01L2924/00014

摘要： An optical device comprises a copper plate having an opening; a flexible board placed below the copper plate; a light receiving element substrate placed below the copper plate and mounted on a wiring pattern of the flexible board via bumps; a light emitting element and a light receiving element both provided at the principal surface of the light receiving element substrate; and a supporting frame supporting the flexile board in a downwardly posture. The supporting frame fixes the flexible board and the copper plate. Therefore, a thin optical device can be realized without employing a resin mold structure.

摘要翻译： 光学装置包括具有开口的铜板; 放置在铜板下面的柔性板; 光接收元件基板，设置在铜板的下方，通过凸块安装在柔性基板的布线图案上; 在所述受光元件基板的主面设置有发光元件和受光元件， 以及以向下姿势支撑柔性板的支撑框架。 支撑框架固定了柔性板和铜板。 因此，可以在不使用树脂模具结构的情况下实现薄的光学装置。

公开(公告)号：US20050001219A1

公开(公告)日：2005-01-06

申请号：US10876839

申请日：2004-06-25

申请人： Masanori Minamio ,  Kouichi Yamauchi ,  Kenichi Nishiyama ,  Kiyokazu Itoi

发明人： Masanori Minamio ,  Kouichi Yamauchi ,  Kenichi Nishiyama ,  Kiyokazu Itoi

IPC分类号： H01L27/14 ,  H01L23/02 ,  H01L23/08 ,  H01L31/02 ,  H01L31/0203 ,  H04N5/335 ,  H04N5/372 ,  H01L27/15

CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L31/02002 ,  H01L31/0203 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/07802 ,  H01L2924/15151 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging device includes a housing having a resin-molded base and ribs; metal lead pieces embedded in the housing, the metal lead pieces each having an inner terminal portion facing an inner space of the housing, an outer terminal portion exposed at a bottom surface of the housing, and a lateral electrode portion exposed at an outer lateral surface of the housing; an imaging element fixed on the base in the inner space; connecting members connecting electrodes of the imaging element respectively to the inner terminal portions; and a transparent plate fixed to an upper surface of the ribs. The die pad having a through hole is embedded in a center portion of the base so that the die pad's upper and lower surfaces are exposed, and the imaging element is fixed on the die pad. A ventilation hole to the inner space of the housing that is formed in one piece with a resin can be formed easily with a simple configuration.

摘要翻译： 固态成像装置包括具有树脂模制基座和肋条的外壳; 嵌入壳体中的金属引线片，金属引线片各自具有面向壳体的内部空间的内部端子部分，暴露在壳体的底部表面的外部端子部分和暴露在外侧表面的侧面电极部分 的住房; 固定在所述内部空间中的基座上的成像元件; 连接构件将摄像元件的电极分别连接到内端子部分; 以及固定到肋的上表面的透明板。 具有通孔的管芯焊盘嵌入基座的中心部分，使得裸片焊盘的上表面和下表面露出，并将成像元件固定在芯片焊盘上。 能够以简单的结构容易地形成到与树脂一体形成的壳体的内部空间的通气孔。

公开(公告)号：US07911018B2

公开(公告)日：2011-03-22

申请号：US12209233

申请日：2008-09-12

申请人： Hu Meng ,  Hiroto Osaki ,  Tetsushi Nishio ,  Kiyokazu Itoi

发明人： Hu Meng ,  Hiroto Osaki ,  Tetsushi Nishio ,  Kiyokazu Itoi

IPC分类号： H01L31/0203 ,  H01L23/02

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical device includes a semiconductor substrate (11) on which a light receiving part (12) (or a light emitting part) and electrodes (13) are formed, and a translucent plate (2) bonded on the light receiving part (12) with a translucent adhesive (5), the semiconductor substrate (11) having a plurality of convex portions (31) formed so as to separate the light receiving part (12) and the electrodes (13) and have proper gaps (32) therebetween.

公开(公告)号：US20090140405A1

公开(公告)日：2009-06-04

申请号：US12210490

申请日：2008-09-15

申请人： Tetsumasa Maruo ,  Masanori Minamio ,  Kiyokazu Itoi

发明人： Tetsumasa Maruo ,  Masanori Minamio ,  Kiyokazu Itoi

IPC分类号： H01L23/02

CPC分类号： H01L23/10 ,  H01L23/055 ,  H01L24/45 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes: a semiconductor element; a package body having the semiconductor element bonded inside thereof and electrically connected to the semiconductor element; a lid-like member covering the semiconductor element, and bonded to the package body to form a hollow structure; and a bonding member for bonding the package body and the lid-like member to each other. The bonding member is a resin adhesive containing an epoxy resin, a polymerization initiator, and a filling material, and a content of the filling material in the bonding member is 30 wt % to 60 wt %.

摘要翻译： 半导体器件包括：半导体元件; 封装体，其内部具有半导体元件，并与半导体元件电连接; 覆盖半导体元件的盖状构件，并且结合到封装主体以形成中空结构; 以及用于将封装体和盖状构件彼此接合的接合构件。 接合部件是含有环氧树脂，聚合引发剂和填充材料的树脂粘合剂，接合部件中的填充材料的含量为30重量％〜60重量％。